1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO16
1通道 12位 逐次逼近型模数转换器, 串行存取, PDSO16
| 参数名称 | 属性值 |
| 最大转换时间 | 5.6 µs |
| 最大线性误差 | 0.0244 % |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最小工作温度 | -40 Cel |
| 最大工作温度 | 85 Cel |
| 加工封装描述 | SOP-16 |
| each_compli | Yes |
| 状态 | Active |
| 转换器的类型 | ADC, SUCCESSIVE APPROXIMATION |
| 模拟输入电压最小值 | 0.0 V |
| 模拟输入电压最大值 | 5 V |
| jesd_30_code | R-PDSO-G16 |
| jesd_609_code | e0 |
| moisture_sensitivity_level | 1 |
| egative_supply_voltage_nom | -15 V |
| 模拟通道数 | 1 |
| 位数 | 12 |
| 输出位编码 | BINARY |
| 输出格式 | SERIAL |
| 包装材料 | PLASTIC/EPOXY |
| ckage_code | SOP |
| ckage_equivalence_code | SOP16,.4 |
| 包装形状 | RECTANGULAR |
| 包装尺寸 | SMALL OUTLINE |
| eak_reflow_temperature__cel_ | 240 |
| wer_supplies__v_ | 5,-12/-15 |
| qualification_status | COMMERCIAL |
| seated_height_max | 2.65 mm |
| sub_category | Analog to Digital Converters |
| 额定供电电压 | 5 V |
| 表面贴装 | YES |
| 工艺 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子涂层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子间距 | 1.27 mm |
| 端子位置 | DUAL |
| ime_peak_reflow_temperature_max__s_ | 20 |
| length | 10.3 mm |
| width | 7.5 mm |
| MAX170DC/D | MAX170 | MAX170CEWE+ | MAX170CCWE+ | MAX170DEPA+ | |
|---|---|---|---|---|---|
| 描述 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO16 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO16 | IC ADC 12BIT SERIAL 16-SOIC | IC ADC 12BIT SERIAL 16-SOIC | IC ADC 12BIT SERIAL 8-DIP |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 8 |
| 位数 | 12 | 12 | 12 | 12 | 12 |
| 输出格式 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 表面贴装 | YES | YES | YES | YES | NO |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 是否无铅 | - | - | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | - | - | 符合 | 符合 | 符合 |
| 零件包装代码 | - | - | SOIC | SOIC | DIP |
| 包装说明 | - | - | SOP, SOP16,.4 | SOP, SOP16,.4 | DIP, DIP8,.3 |
| 针数 | - | - | 16 | 16 | 8 |
| Reach Compliance Code | - | - | compliant | compliant | compliant |
| ECCN代码 | - | - | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | - | - | 1 week | 8 weeks | 9 weeks |
| 最大模拟输入电压 | - | - | 5 V | 5 V | 5 V |
| 最长转换时间 | - | - | 5.6 µs | 5.6 µs | 5.6 µs |
| 转换器类型 | - | - | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | - | - | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T8 |
| JESD-609代码 | - | - | e3 | e3 | e3 |
| 长度 | - | - | 10.3 mm | 10.3 mm | 9.375 mm |
| 最大线性误差 (EL) | - | - | 0.0122% | 0.0122% | 0.0244% |
| 湿度敏感等级 | - | - | 1 | 1 | 1 |
| 标称负供电电压 | - | - | -15 V | -15 V | -15 V |
| 模拟输入通道数量 | - | - | 1 | 1 | 1 |
| 最高工作温度 | - | - | 85 °C | 70 °C | 85 °C |
| 输出位码 | - | - | BINARY | BINARY | BINARY |
| 封装主体材料 | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | - | SOP | SOP | DIP |
| 封装等效代码 | - | - | SOP16,.4 | SOP16,.4 | DIP8,.3 |
| 封装形状 | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | - | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 峰值回流温度（摄氏度） | - | - | 260 | 260 | 260 |
| 电源 | - | - | 5,-12/-15 V | 5,-12/-15 V | 5,-12/-15 V |
| 认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | - | 2.65 mm | 2.65 mm | 4.572 mm |
| 标称供电电压 | - | - | 5 V | 5 V | 5 V |
| 技术 | - | - | CMOS | CMOS | CMOS |
| 端子面层 | - | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子节距 | - | - | 1.27 mm | 1.27 mm | 2.54 mm |
| 处于峰值回流温度下的最长时间 | - | - | 30 | 30 | 30 |
| 宽度 | - | - | 7.5 mm | 7.5 mm | 7.62 mm |
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