EE PLD, 5.5 ns, PQFP144, PLASTIC, QFP-144
参数名称 | 属性值 |
是否无铅 | 含铅 |
厂商名称 | Rochester Electronics |
零件包装代码 | QFP |
包装说明 | QFP, |
针数 | 144 |
Reach Compliance Code | unknown |
最大时钟频率 | 133 MHz |
JESD-30 代码 | S-PQFP-G144 |
湿度敏感等级 | 3 |
专用输入次数 | |
I/O 线路数量 | 104 |
端子数量 | 144 |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 0 DEDICATED INPUTS, 104 I/O |
输出函数 | MACROCELL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QFP |
封装形状 | SQUARE |
封装形式 | FLATPACK |
峰值回流温度(摄氏度) | 225 |
可编程逻辑类型 | EE PLD |
传播延迟 | 5.5 ns |
认证状态 | COMMERCIAL |
最大供电电压 | 5.25 V |
最小供电电压 | 4.75 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | NOT SPECIFIED |
端子形式 | GULL WING |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
Base Number Matches | 1 |
M5-128/104-5YC/1 | M5-128/104-7YC/1 | M5-128/104-10YC/1 | M5-128/104-12YC/1 | M5-128/104-15YC/1 | M5-256/68-12VC | M5-128/120-7YC | |
---|---|---|---|---|---|---|---|
描述 | EE PLD, 5.5 ns, PQFP144, PLASTIC, QFP-144 | EE PLD, 7.5 ns, PQFP144, PLASTIC, QFP-144 | EE PLD, 10 ns, PQFP144, PLASTIC, QFP-144 | EE PLD, 12 ns, PQFP144, PLASTIC, QFP-144 | EE PLD, 15 ns, PQFP144, PLASTIC, QFP-144 | EE PLD, 12 ns, PQFP100, TQFP-100 | EE PLD, 7.5ns, PQFP160, PLASTIC, QFP-160 |
零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
包装说明 | QFP, | QFP, | QFP, | QFP, | QFP, | LFQFP, | PLASTIC, QFP-160 |
针数 | 144 | 144 | 144 | 144 | 144 | 100 | 160 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最大时钟频率 | 133 MHz | 100 MHz | 83.3 MHz | 71.4 MHz | 55.6 MHz | 71.4 MHz | 100 MHz |
JESD-30 代码 | S-PQFP-G144 | S-PQFP-G144 | S-PQFP-G144 | S-PQFP-G144 | S-PQFP-G144 | S-PQFP-G100 | S-PQFP-G160 |
I/O 线路数量 | 104 | 104 | 104 | 104 | 104 | 68 | 120 |
端子数量 | 144 | 144 | 144 | 144 | 144 | 100 | 160 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 0 DEDICATED INPUTS, 104 I/O | 0 DEDICATED INPUTS, 104 I/O | 0 DEDICATED INPUTS, 104 I/O | 0 DEDICATED INPUTS, 104 I/O | 0 DEDICATED INPUTS, 104 I/O | 0 DEDICATED INPUTS, 68 I/O | 0 DEDICATED INPUTS, 120 I/O |
输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFP | QFP | QFP | QFP | QFP | LFQFP | QFP |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK |
可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
传播延迟 | 5.5 ns | 7.5 ns | 10 ns | 12 ns | 15 ns | 12 ns | 7.5 ns |
认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
是否无铅 | 含铅 | 含铅 | 不含铅 | 含铅 | 含铅 | - | 含铅 |
湿度敏感等级 | 3 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
峰值回流温度(摄氏度) | 225 | 225 | NOT SPECIFIED | 225 | 225 | - | 225 |
端子面层 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | TIN LEAD |
处于峰值回流温度下的最长时间 | 30 | 30 | NOT SPECIFIED | 30 | 30 | - | 30 |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |
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