ERmet ZDHD
High-Speed Connector Sytem for Datarate up to 25 Gbit/s
ERNI’s new ZDHD connector is a high speed, differential board to
backplane connector. It is a higher density extension of our stan-
dard ERmet ZD product line. The ZDHD has an optimized footprint
for improved electrical performance and is designed for data rates
up to 25 Gbits/s. ERNI’s ZD HD will be available in a 6-pair version.
Future additions to the product line will include a 2- and 4-pair ver-
sion.
Technical Features
• Operating temperature: -55/125 °C
• Mechanical operation: >250 mating cycles
• Insertion and withdrawal force: 0,7 N/pin (Signal)
Material
• Housing materaial: LCP
• Contact material:
Base material: Cu alloy
Mating area: PdNi + Au
Termination area: Sn
Features
• 14 rows per inch by 6 differential pairs per row
•
•
•
•
84 differential pairs per inch
L-shield for each differential pair
Impedance 100 Ohm, 85 Ohm on request
Datarate up to 25 Gbit/s
• Superior crosstalk behavior
• Pitch 1,8 mm between rows
• Pitch 3,6 mm between diff. pair within a row
• Downsized pressfit technology 0.46 mm dia. hole
• Robust alignment guides on male side walls
• Dual beam female contact design
Catalog E XXXXXX
01/14
Edition 3
www.erni.com
3
ERmet ZDHD
Vertical Male Connectors 6 Pair
Dimensional Drawings
27,2
25,7
1,8
23,4
X
Leiterplattenoberfläche Tochterkarte
Top surface of daughter card
14 13 12 11 10
9
8
7
6
5
4
3
2 1
1,95
1,8
1,8
23,4
25,3
0,55
Leiterplattenoberfläche Tochterkarte
Top surface of daughter card
Lochbild für Leiterplatte
(Bestückungsplan)
13 x 1,8 = (23,4)
1,8
1,8
1)
Board hole pattern
(Component mounting side)
Ø
0,05
1,3
a
b
GND a/b
c
d
GND c/d
e
f
GND e/f
g
h
GND g/h
i
j
GND i/j
k
l
GND k/l
a
b
GND a/b
c
d
GND c/d
e
f
GND e/f
g
h
GND g/h
i
j
GND i/j
k
l
GND k/l
3,6
4,35
1) Ø 0.46
Ø 0.46
Ø 0.55
Ø 0.55
±0.05
±0.05
±0.02
±0.02
Durchmesser des metallisierten Loches
Diameter of finished plated- through hole
Bohrungsdurchmesser des Loches
Diameter of drilled hole
alle Löcher
all holes
1,9
GND a
GND b/c
GND d/e
GND f/g
GND h/i
GND j/k
GND l
a
b
c
d
e
f
g
h
i
j
k
l
GND a
a
b
GND b/c
c
d
GND d/e
e
f
GND f/g
g
h
GND h/i
i
j
GND j/k
k
l
GND l
Schichtaufbau im metallisierten Loch
siehe Zeichnung 384191
Metal plating of plated-through hole
see drawing 384191
14 13 12 11 10
9
8
7
6
5
4
3
2 1
ground
4
1,2
Catalog E XXXXXX
18 x 1,2 = (21,6)
01/14
Edition 3
3
6,35
12
www.erni.com
ERmet ZDHD
Right Angle Female Connectors 6 Pair
Dimensional Drawings
23,4
1,8
0,65
GND k/l
GND i/j
GND g/h
GND e/f
GND c/d
GND a/b
l
k
j
i
h
g
f
e
d
c
b
a
1,8
14 13 12 11 10 9 8
7
6
5
4
3
2
1
Leiterplattenoberfläche
Top surface of daughter card
4,15
GND k/l
l
k
GND i/j
j
i
GND g/h
h
g
GND e/f
f
e
GND c/d
d
c
GND a/b
b
a
1,3
3,6
25,5
25,18
1,6
10,8
21,35
25,5
Lochbild für Leiterplatte
(Bestückungsseite)
1,8
Board hole pattern
(Component mounting side)
13 x 1,8 = (23.4)
1)
Ø
0,05
alle Löcher
all holes
1) Ø 0.46 ± 0.05 Durchmesser des metallisierten Loches
Ø 0.46 ± 0.05 Diameter of finished plated-through hole
Ø 0.55 ± 0.02 Bohrdurchmesser des Loches
Ø 0.55 ± 0.02 Diameter of drilled hole
Schichtaufbau im metallisierten Loch
siehe Zeichnung 384191
Metal plating of plated-through hole
see drawing 384191
GND l
l
k
GND j/k
j
i
GND h/i
h
g
GND f/g
f
e
GND d/e
d
c
GND b/c
b
a
GND a
ground
Catalog E XXXXXX
01/14
Edition 3
1,8
14 13 12 11 10
9
8
7
6 5
4
3
2 1
1,5
GND l
l
k
GND j/k
j
i
GND h/i
h
g
GND f/g
f
e
GND d/e
d
c
GND b/c
b
a
GND a
19,2
3,6
1,2
4,5
3,6
18 x 1,2 = (21,6)
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