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BU-61583F6-300K

产品描述Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CDFP70, CERAMIC, DFP-70
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小354KB,共48页
制造商Data Device Corporation
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BU-61583F6-300K概述

Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CDFP70, CERAMIC, DFP-70

BU-61583F6-300K规格参数

参数名称属性值
厂商名称Data Device Corporation
零件包装代码DFP
包装说明CERAMIC, DFP-70
针数70
Reach Compliance Codeunknown
地址总线宽度16
边界扫描NO
最大时钟频率16 MHz
通信协议MIL-STD-1553A; MIL-STD-1553B; MCAIR; STANAG-3838
数据编码/解码方法BIPH-LEVEL(MANCHESTER)
最大数据传输速率0.125 MBps
外部数据总线宽度16
JESD-30 代码R-CDFP-F70
JESD-609代码e0
低功率模式NO
串行 I/O 数2
端子数量70
最高工作温度70 °C
最低工作温度
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码DFP
封装形状RECTANGULAR
封装形式FLATPACK
认证状态Not Qualified
座面最大高度5.46 mm
最大供电电压5.25 V
最小供电电压4.75 V
标称供电电压5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层TIN LEAD
端子形式FLAT
端子节距1.27 mm
端子位置DUAL
uPs/uCs/外围集成电路类型SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
Base Number Matches1

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BU-61582
SPACE LEVEL MIL-STD-1553
BC/RT/MT
ADVANCED COMMUNICATION
ENGINE (SP’ACE) TERMINAL
FEATURES
Make sure the next
Card you purchase
has...
®
Radiation-Hardened to 1 MRad
Fully Integrated 1553 Terminal
Flexible Processor Interface
16K x 16 Internal RAM
Automatic BC Retries
Programmable BC Gap Times
BC Frame Auto-Repeat
Intelligent RT Data Buffering
Small Ceramic Package
Available to SMD 5962-96887
Multiple Ordering Options;
+5V (Only)
+5V/-15V
+5V/-12V
+5V/Transceiverless
+5V (Only, with Transmit Inhibits)
DESCRIPTION
DDC’s BU-61582 Space Advanced Communication Engine (SP’ACE)
is a radiation hardened version of the BU-61580 ACE terminal. DDC
supplies the BU-61582 with enhanced screening for space and other
high reliability applications.
The BU-61582 provides a complete integrated BC/RT/MT interface
between a host processor and a MIL-STD-1553 bus. The BU-61582
maintains functional and software compatibility with the standard BU-
61580 product and is packaged in the same 1.9 square-inch package
footprint.
As an option, DDC can supply the BU-61582 with space level screen-
ing. This entails enhancements in the areas of element evaluation and
screening procedures for active and passive elements, as well as the
manufacturing and screening processes used in producing the termi-
nals.
The BU-61582 integrates dual transceiver, protocol, memory man-
agement and processor interface logic, and 16K words of RAM in the
choice of 70-pin DIP or flat pack packages. Transceiverless versions
may be used with an external electrical or fiber optic transceiver.
To minimize board space and ‘glue’ logic, the SP’ACE terminals pro-
vide ultimate flexibility in interfacing to a host processor and inter-
nal/external RAM.
FOR MORE INFORMATION CONTACT:
Data Device Corporation
105 Wilbur Place
Bohemia, New York 11716
631-567-5600 Fax: 631-567-7358
www.ddc-web.com
Technical Support:
1-800-DDC-5757 ext. 7771
All trademarks are the property of their respective owners.
© 1998, 1999 Data Device Corporation
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