FEATURES AND SPECIFICATIONS
Features and Benefits
s
10 to 64 circuits
s
Tin plated on solder tail
s
Complies with industry standard DIN 41654
s
Polarized
s
Selective Gold plating options for contacts
s
Eject levers allow end-to-end stacking with or without strain
relief with no loss of board space
Reference Information
Packaging: Tray
Mates With:
5320
Designed In: Millimeters
Electrical
Voltage: 250V
Current: 1.0A
Contact Resistance: 20m
Ω
max.
Dielectric Withstanding Voltage: 500V
Insulation Resistance: 1000 M
Ω
min.
Physical
Housing: Glass-filled PBTP
Contact: Brass
Operating Temperature: -40 to +105˚C
2.54mm (.100") Pitch
QF 50
™
Shrouded Header
5578
Right Angle
With Eject Levers
H
Ribbon Cable Systems
CATALOG DRAWING (FOR REFERENCE ONLY)
ORDERING INFORMATION AND DIMENSIONS
Circuits
10
14
16
20
26
30
34
40
50
60
64
Plating NBGS1
39-27-1106
39-27-1146
39-27-1166
39-27-1206
39-27-1266
39-27-1306
39-27-1346
39-27-1406
39-27-1506
39-27-1606
39-27-1646
Order No.
Plating NBGS2
39-27-1107
39-27-1147
39-27-1167
39-27-1207
39-27-1267
39-27-1307
39-27-1347
39-27-1407
39-27-1507
39-27-1607
39-27-1647
Plating NBT2
39-28-5106
39-28-5146
39-28-5166
39-28-5206
39-28-5266
39-28-5306
39-28-5346
39-28-5406
39-28-5506
A
(1.266)
(1.466)
(1.566)
(1.766)
(2.066)
(2.266)
(2.466)
(2.766)
(3.266)
(3.766)
(3.966)
B
(.400)
(.600)
(.700)
(.900)
(1.200)
(1.400)
(1.600)
(1.900)
(2.400)
(2.900)
(3.100)
Dimension
C
28.04 (1.104)
33.12 (1.304)
35.66 (1.404)
40.74 (1.604)
48.36 (1.904)
53.44 (2.104)
58.52 (2.304)
66.14 (2.604)
78.84 (3.104)
91.54 (3.604)
96.62 (3.804)
D
(.864)
(1.064)
(1.164)
(1.364)
(1.664)
(1.864)
(2.064)
(2.364)
(2.864)
(3.364)
(3.564)
E
(.700)
(.900)
(1.000)
(1.200)
(1.500)
(1.700)
(1.900)
(2.200)
(2.700)
(3.200)
(3.400)
32.16
37.24
39.78
44.86
52.48
57.56
62.64
70.26
82.96
95.66
100.74
10.16
15.24
17.78
22.86
30.48
35.56
40.64
48.26
60.96
73.66
78.74
21.94
27.02
29.56
34.64
42.26
47.34
52.42
60.04
72.74
85.44
90.52
17.76
22.84
25.38
30.46
38.08
43.16
48.24
55.86
68.56
81.26
86.34
Plating NBGS1: 39
µ
" (1
µ
m) min. Nickel underplate. Contact area: 0.1
µ
m min. Gold.
Solder area: 3
µ
m min. Tin/Lead.
Plating NBGS2: 39
µ
" (1
µ
m) min. Nickel underplate. Contact area: 0.76
µ
m min. Gold.
Solder area: 3
µ
m min. Tin/Lead.
Plating NBT2: 20
µ
" (0.5
µ
m) min. Nickel underplate. Contact and solder area: 39
µ
" (1
µ
m) min. Tin.
H-24
MX01
嵌入式系统
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