Surface Mount
Capacitors
Chip Capacitors
Stacked Chip
C0G/X7R
Ordering Information
8060
Chip
Size
B
Finish
B = Bare Chip
Assembly
500
Voltage
050 = 50V
100 = 100V
200 = 200V
500 = 500V
1K0 = 1000V
2K0 = 2000V
0126
Capacitance
Expressed in
picofarads (pF).
First digit is 0.
Second and third
digits are significant
figures of capacitance
code.
The fourth digit is
number of zeros
following.
eg: 0126=12µF.
K
Tolerance
M = ±20%
Standard
K = ±10%
Optional
X
Dielectric
C = C0G
X = X7R
B
Packaging
R =330mm
(13”)
reel
B =Bulk
J
Mounting
Style
N =Bare Chip
SM Assembly
J =J leaded
SM Assembly
L =L leaded
SM Assembly
S =Straight
leaded DIL
Assembly
W00
5
Customer
No. of
Special
Chips
Requirements
Notes
1. Other capacitance tolerances may also be available.
2. Tape and reel packing is available on 2220 & 2225 single chip ‘J’
and ‘L’ leaded products and 1812, 2220, 2225 2-stack unleaded
(‘N’ leaded) products. All other products will be supplied bulk
packed in protective foam. Special waffle packing requirements
can be considered.
3. Higher working voltages and alternative chip sizes are also
available by special request.
Design Notes
When specifying these components, consideration must be given
to their physical size, aspect ratio and mass with particular
reference to thermal mismatch, mechanical shock and vibration
characteristics.
It is not recommended that chip sizes greater than 3640 are
mounted directly to the board, but are lifted clear using stand off
leads (‘J’ or ‘L’) to prevent mechanical cracking.
Where possible, using a larger size chip with less chips in the
stack will result in a more stable product when placed on the
board, as the result of an improved aspect ratio.
A general handling recommendations sheet covering these, and
other points, is available upon request from our Sales Office.
A data sheet covering recommended pad designs is available on
request from our Sales Office.
Please refer all specific enquiries to the Sales Office.
Materials
In all cases, leadframes, where fitted, will be silver plated phospher
bronze.
Chip to chip attachment, and chip to leadframe attachment will be
by either high melting point solder (M.Pt. 300ºC typ.) or high
conductivity silver loaded epoxy adhesive depending on product.
45
Surface Mount
Capacitors
Chip Capacitors
Stacked Chip
C0G/X7R
Introduction
These ranges of both High Capacitance and High Voltage Multilayer
ceramic capacitor assemblies are designed for use in high frequency
switched mode power supplies, DC-DC converters and similar
applications.
Low ESR and low ESL are inherent in the design giving the
assemblies a high current capability up to 1MHz and offer far
superior performance than either aluminium or tantalum electrolytic
capacitors.Various lead options are available, making them suitable
for mounting on ceramic substrate or epoxy printed circuit boards.
Summary of Standard Range
Chip sizes covered
Working Voltages
Capacitance Range
1812; 2220; 2225; 3640; 5550; 8060.
50V to 2kV as standard.
39pF to 1.8µF in Ultra Stable COG Dielectric
820pF to 68µF in Stable X7R Dielectric.
Special chip sizes, working voltages, capacitance values and specific
custom requirements will be considered. Please refer all enquiries to
the Sales Office.
Available Lead Options
‘N’ Lead
‘J’ Lead
‘L’ Lead
‘S’ Lead
(DIL Package)
Note: Not all lead options are available with all chip sizes.
Check specific assembly drawings for available options.
Leaded assembly dimensions
Dimensions (mm)
3640
W
max
C
nom
L
max
No. of leads per side
11.5
9.2
11.7
4
5550
14.0
14.0
16.5
5
8060
16.5
20.3
22.8
6
Max Stack Height (H)
No. of Chips
Range
(size)
< 2225
> 3640
< 2225
> 3640
< 2225
> 3640
< 2225
> 3640
< 2225
> 3640
‘N’ Unleaded
Assemblies
N/A
N/A
5.25
N/A
7.75
N/A
10.25
N/A
12.75
N/A
‘J’ & ‘L’ leaded
Assemblies
4.5
5.5
7.0
8.75
9.5
12.0
12.0
15.25
14.5
18.5
‘S’ leaded
Assemblies
N/A
3.25
N/A
6.75
N/A
10.0
N/A
13.25
N/A
16.5
1
2
3
4
5
46
Surface Mount
Capacitors
Chip Capacitors
Stacked Chip
C0G/X7R
Available Options and Dimensions (mm)
Chip Size 1812
Unleaded assembly only (‘N’ lead option)
Denotes Metallised Solderable Area
5.2 max
H
max
4.5±0.35
3.9 max
3.2±0.4
See page 46 for dimension H
Chip Size 2220
‘J’ & ‘L’ Leaded or Unleaded (‘N’) assemblies
Denotes Metallised Solderable Area
6.5 max
H
max
H
max
7.5 max
5.7 nom.
Stand off
1.0mm Typ.
1.0
Pitch = 4.25
Unleaded
Assembly
0.75±0.05
6.0 max
5.7±0.4
5.7 max
5.0±0.4
Leaded Assembly
(‘J’ lead shown.)
Foot Length = 1.5 nom.
See page 46 for dimension H
Chip Size 2225
‘J’ & ‘L’ Leaded or Unleaded (‘N’) assemblies
Denotes Metallised Solderable Area
6.5 max
7.5 max
H
max
5.7 nom.
Stand off
1.0mm Typ.
Unleaded
Assembly
1.5
1.0
Pitch = 2.54
H
max
0.5±0.05
5.7±0.4
7.0 max
6.3±0.4
7.3 max
Leaded Assembly
(‘L’ lead shown.)
Foot Length = 1.5 nom.
See page 46 for dimension H
Chip Size 3640, 5550, 8060
‘J’, ‘L’ & ‘S’ Leaded assemblies
H max
H max
1.5
'C' nom.
Leg Width = 0.50
Pitch = 2.54
Foot Length = 2.0mm nom.
'L' max
'W' max
Stand off 1.5 Typ.
Stand off
1.5 Typ.
11.0 nom.
'C' nom.
Leg Thickness
= 0.25 nom.
1.5
Leg Width = 0.50
Pitch = 2.54
'L' max.
'W' max
‘J’ Leaded Assembly
Note: ‘L’ leaded assembly has the same basic
dimensions with the leg direction reversed.
‘S’ Leaded
Assembly
See page 46 for dimension H
47
Surface Mount
Capacitors
Chip Capacitors
Stacked Chip
C0G
25
22
12
18
ce
an
cit
pa
Ca
20
22
Rated Voltage d.c.
39pF
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1.0nF
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1.0µF
1.2
1.5
1.8
390
470
560
680
820
101
121
151
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
564
684
824
105
125
155
185
48
notes
de
Co
50
(‘N’ Lead only)
100 200
500
1K
2K
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
3
3
3
4
5
5
50
(‘N’, ‘J’ & ‘L’ Lead)
100
200
500
1K
2K
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
3
3
4
4
5
50
(‘N’, ‘J’ & ‘L’ Lead)
100 200
500
1K
2K
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
3
3
4
4
5
1
1
2
2
2
2
3
3
4
4
5
1
1
1
1
2
2
2
2
3
3
4
4
5
1
1
1
1
1
2
2
2
3
3
3
4
5
5
1
1
1
1
1
2
2
2
3
3
4
4
5
1
1
1
1
1
1
1
2
2
2
3
3
3
4
5
C0G
1
1
2
2
2
3
3
4
4
5
1
1
1
1
1
2
2
2
2
3
3
4
5
1
1
1
1
1
2
2
2
3
3
3
4
5
5
1
1
1
1
1
2
2
2
3
3
3
4
5
1
1
1
1
1
1
1
2
2
2
2
3
3
4
5
1
1
2
2
2
3
3
4
4
5
1
1
1
1
1
2
2
2
2
3
3
4
5
1
2
2
2
3
3
4
4
5
1
1
1
1
2
2
2
2
3
3
4
4
5
1
1
1
1
1
1
1
2
2
2
3
3
4
4
5
1. For details of ordering see page 45.
2. The table above indicates the number of chips required to achieve the
capacitance value.
3. Higher voltages (To 5kV max) may be available on request
Surface Mount
Capacitors
Chip Capacitors
Stacked Chip
C0G
60
80
40
36
ce
an
cit
pa
Ca
50
55
Rated Voltage d.c.
39pF
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1.0nF
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1.0µF
1.2
1.5
1.8
390
470
560
680
820
101
121
151
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
564
684
824
105
125
155
185
notes
de
Co
50
(‘J’, ‘L’ & ‘S’ Lead)
100 200
500
1K
2K
50
(‘J’, ‘L’ & ‘S’ Lead)
100
200
500
1K
2K
50
(‘J’, ‘L’ & ‘S’ Lead)
100 200
500
1K
2K
1
1
2
2
2
2
3
3
4
4
5
1
1
1
2
2
2
2
3
3
4
5
5
1
1
1
2
2
2
3
3
4
4
5
1
1
1
2
2
2
2
3
3
4
4
5
1
1
1
1
1
1
2
2
2
2
3
3
4
5
5
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
3
3
4
4
5
1
1
2
2
2
3
3
4
4
5
C0G
1
1
1
1
1
1
1
2
2
2
3
3
3
4
5
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
3
3
4
5
5
1
1
2
2
2
2
3
3
4
5
5
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
3
3
4
4
5
1
2
2
2
2
3
3
4
5
5
1
1
1
2
2
2
2
3
3
4
5
5
1
1
1
2
2
2
2
3
3
4
5
5
1
2
2
2
3
3
4
4
5
1
1
1
2
2
2
2
3
3
4
5
1
1
1
2
2
2
3
3
3
4
5
1
1
1
1
1
1
1
2
2
2
3
3
4
4
5
1. For details of ordering see page 45.
2. The table above indicates the number of chips required to achieve the
capacitance value.
3. Higher voltages (To 5kV max) may be available on request
49
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