8KX8 EEPROM 5V, 150ns, PDIP28, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, DIP-28
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| 最长访问时间 | 150 ns |
| JESD-30 代码 | R-PDIP-T28 |
| JESD-609代码 | e3 |
| 长度 | 36.695 mm |
| 内存密度 | 65536 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 8192 words |
| 字数代码 | 8000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 8KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 编程电压 | 5 V |
| 认证状态 | COMMERCIAL |
| 座面最大高度 | 6.35 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| Base Number Matches | 1 |
| CAT28C64BLI15 | CAT28C64BH13I12 | CAT28C64BH1312 | CAT28C64BH13-12 | CAT28C64BH1390 | CAT28C64BH13-90 | |
|---|---|---|---|---|---|---|
| 描述 | 8KX8 EEPROM 5V, 150ns, PDIP28, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, DIP-28 | 8KX8 EEPROM 5V, 120ns, PDSO28, 8 X 13.40 MM, LEAD FREE AND HALOGEN FREE, TSOP-28 | 8KX8 EEPROM 5V, 120ns, PDSO28, 8 X 13.40 MM, LEAD FREE AND HALOGEN FREE, TSOP-28 | EEPROM, 8KX8, 120ns, Parallel, CMOS, PDSO28, 8 X 13.40 MM, LEAD FREE AND HALOGEN FREE, TSOP-28 | 8KX8 EEPROM 5V, 90ns, PDSO28, 8 X 13.40 MM, LEAD FREE AND HALOGEN FREE, TSOP-28 | EEPROM, 8KX8, 90ns, Parallel, CMOS, PDSO28, 8 X 13.40 MM, LEAD FREE AND HALOGEN FREE, TSOP-28 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 零件包装代码 | DIP | TSOP | TSOP | TSOP | TSOP | TSOP |
| 包装说明 | DIP, | 8 X 13.40 MM, LEAD FREE AND HALOGEN FREE, TSOP-28 | 8 X 13.40 MM, LEAD FREE AND HALOGEN FREE, TSOP-28 | TSOP1, | 8 X 13.40 MM, LEAD FREE AND HALOGEN FREE, TSOP-28 | TSOP1, |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 150 ns | 120 ns | 120 ns | 120 ns | 90 ns | 90 ns |
| JESD-30 代码 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 |
| 长度 | 36.695 mm | 11.8 mm | 11.8 mm | 11.8 mm | 11.8 mm | 11.8 mm |
| 内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| 字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 编程电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | Not Qualified | COMMERCIAL | Not Qualified |
| 座面最大高度 | 6.35 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 0.55 mm | 0.55 mm | 0.55 mm | 0.55 mm | 0.55 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 15.24 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | - |
| 端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | - |
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