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HCS112HMSR

产品描述HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, UUC16, DIE-16
产品类别逻辑    逻辑   
文件大小179KB,共9页
制造商Renesas(瑞萨电子)
官网地址https://www.renesas.com/
下载文档 详细参数 选型对比 全文预览

HCS112HMSR概述

HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, UUC16, DIE-16

HCS112HMSR规格参数

参数名称属性值
厂商名称Renesas(瑞萨电子)
零件包装代码DIE
包装说明DIE,
针数16
Reach Compliance Codeunknown
系列HC/UH
JESD-30 代码R-XUUC-N16
逻辑集成电路类型J-K FLIP-FLOP
位数2
功能数量2
端子数量16
输出极性COMPLEMENTARY
封装主体材料UNSPECIFIED
封装代码DIE
封装形状RECTANGULAR
封装形式UNCASED CHIP
传播延迟(tpd)28 ns
认证状态Not Qualified
筛选级别MIL-PRF-38535 Class V
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
端子形式NO LEAD
端子位置UPPER
总剂量200k Rad(Si) V
触发器类型NEGATIVE EDGE
最小 fmax30 MHz
Base Number Matches1

文档预览

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HCS112MS
September 1995
Radiation Hardened
Dual JK Flip-Flop
Pinouts
16 LEAD CERAMIC DUAL-IN-LINE
METAL SEAL PACKAGE (SBDIP)
MIL-STD-1835 CDIP2-T16, LEAD FINISH C
TOP VIEW
CP1 1
KA 2
JA 3
SA 4
QA 5
16 VCC
15 RA
14 RB
13 CPB
12 KB
11 JB
10 SB
9 QB
Features
• 3 Micron Radiation Hardened SOS CMOS
• Total Dose 200K RAD (Si)
• SEP Effective LET No Upsets: >100 MEV-cm
2
/mg
• Single Event Upset (SEU) Immunity < 2 x 10
-9
Errors/
Bit-Day (Typ)
• Dose Rate Survivability: >1 x 10
12
RAD (Si)/s
• Dose Rate Upset >10
10
RAD (Si)/s 20ns Pulse
• Latch-Up Free Under Any Conditions
• Military Temperature Range: -55
o
C
QA 6
to
+125
o
C
QB 7
GND 8
• Significant Power Reduction Compared to LSTTL ICs
• DC Operating Voltage Range: 4.5V to 5.5V
• Input Logic Levels
- VIL = 30% of VCC Max
- VIH = 70% of VCC Min
• Input Current Levels Ii
5µA at VOL, VOH
16 LEAD CERAMIC METAL SEAL
FLATPACK PACKAGE (FLATPACK)
MIL-STD-1835 CDFP4-F16, LEAD FINISH C
TOP VIEW
CP1
KA
JA
SA
QA
QA
QB
GND
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VCC
RA
RB
CPB
KB
JB
SB
QB
Description
The Intersil HCS112MS is a Radiation Hardened dual JK
flip-flop with set and reset. The output changes state on the
negative going transition of the clock pulse. Set and reset
are accomplished asynchronously by a logic low input level.
The HCS112MS utilizes advanced CMOS/SOS technology
to achieve high-speed operation. This device is a member of
radiation hardened, high-speed, CMOS/SOS Logic Family.
The HCS112MS is supplied in a 16 lead Ceramic flatpack
(K suffix) or a SBDIP Package (D suffix).
Ordering Information
PART NUMBER
HCS112DMSR
HCS112KMSR
HCS112D/Sample
HCS112K/Sample
HCS112HMSR
TEMPERATURE RANGE
-55
o
C to +125
o
C
-55
o
C to +125
o
C
+25
o
C
+25
o
C
+25
o
C
SCREENING LEVEL
Intersil Class S Equivalent
Intersil Class S Equivalent
Sample
Sample
Die
PACKAGE
16 Lead SBDIP
16 Lead Ceramic Flatpack
16 Lead SBDIP
16 Lead Ceramic Flatpack
Die
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
Spec Number
File Number
11
518830
3558.1
DB NA

HCS112HMSR相似产品对比

HCS112HMSR HCS112KMSR HCS112DMSR
描述 HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, UUC16, DIE-16 HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, CDFP16, CERAMIC, DFP-16 HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, CDIP16
厂商名称 Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子)
零件包装代码 DIE DFP DIP
包装说明 DIE, DFP, FL16,.3 DIP, DIP16,.3
针数 16 16 16
Reach Compliance Code unknown not_compliant not_compliant
系列 HC/UH HC/UH HC/UH
JESD-30 代码 R-XUUC-N16 R-CDFP-F16 R-CDIP-T16
逻辑集成电路类型 J-K FLIP-FLOP J-K FLIP-FLOP J-K FLIP-FLOP
位数 2 2 2
功能数量 2 2 2
端子数量 16 16 16
输出极性 COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY
封装主体材料 UNSPECIFIED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 DIE DFP DIP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 UNCASED CHIP FLATPACK IN-LINE
传播延迟(tpd) 28 ns 35 ns 35 ns
认证状态 Not Qualified Not Qualified Not Qualified
筛选级别 MIL-PRF-38535 Class V MIL-PRF-38535 Class V MIL-PRF-38535 Class V
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V
表面贴装 YES YES NO
技术 CMOS CMOS CMOS
端子形式 NO LEAD FLAT THROUGH-HOLE
端子位置 UPPER DUAL DUAL
总剂量 200k Rad(Si) V 200k Rad(Si) V 200k Rad(Si) V
触发器类型 NEGATIVE EDGE NEGATIVE EDGE NEGATIVE EDGE
最小 fmax 30 MHz 20 MHz 20 MHz
是否Rohs认证 - 不符合 不符合
JESD-609代码 - e0 e0
负载电容(CL) - 50 pF 50 pF
最大频率@ Nom-Sup - 20000000 Hz 20000000 Hz
最高工作温度 - 125 °C 125 °C
最低工作温度 - -55 °C -55 °C
封装等效代码 - FL16,.3 DIP16,.3
峰值回流温度(摄氏度) - NOT SPECIFIED NOT SPECIFIED
电源 - 5 V 5 V
Prop。Delay @ Nom-Sup - 35 ns 35 ns
座面最大高度 - 2.92 mm 5.08 mm
温度等级 - MILITARY MILITARY
端子面层 - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子节距 - 1.27 mm 2.54 mm
处于峰值回流温度下的最长时间 - NOT SPECIFIED NOT SPECIFIED
宽度 - 6.73 mm 7.62 mm

 
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