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5962-8869002JX

产品描述512X8 OTPROM, 140ns, CDIP
产品类别存储    存储   
文件大小38KB,共8页
制造商Renesas(瑞萨电子)
官网地址https://www.renesas.com/
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5962-8869002JX概述

512X8 OTPROM, 140ns, CDIP

5962-8869002JX规格参数

参数名称属性值
包装说明DIP, DIP24,.6
Reach Compliance Codeunknown
ECCN代码EAR99
最长访问时间140 ns
JESD-30 代码R-XDIP-T24
JESD-609代码e0
内存密度4096 bit
内存集成电路类型OTP ROM
内存宽度8
功能数量1
端子数量24
字数512 words
字数代码512
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织512X8
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码DIP
封装等效代码DIP24,.6
封装形状RECTANGULAR
封装形式IN-LINE
并行/串行PARALLEL
电源5 V
认证状态Not Qualified
筛选级别38535Q/M;38534H;883B
最大待机电流0.0001 A
最大压摆率0.02 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
Base Number Matches1

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HM-6642
March 1997
512 x 8 CMOS PROM
Description
The HM-6642 is a 512 x 8 CMOS NiCr fusible link
Programmable Read Only Memory in the popular 24 pin,
byte wide pinout. Synchronous circuit design techniques
combine with CMOS processing to give this device high
speed performance with very low power dissipation.
On-chip address latches are provided, allowing easy
interfacing with recent generation microprocessors that use
multiplexed address/data bus structures, such as the 8085.
The output enable controls, both active low and active high,
further simplify microprocessor system interfacing by
allowing output data bus control independent of the chip
enable control. The data output latches allow the use of the
HM-6642 in high speed pipelined architecture systems, and
also in synchronous logic replacement functions.
Applications for the HM-6642 CMOS PROM include low
power handheld microprocessor based instrumentation and
communications systems, remote data acquisition and
processing systems, processor control store, and synchro-
nous logic replacement.
All bits are manufactured storing a logical “0” and can be
selectively programmed for a logical “1” at any bit location.
Features
• Low Power Standby and Operating Power
- ICCSB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .100µA
- ICCOP . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA at 1MHz
• Fast Access Time. . . . . . . . . . . . . . . . . . . . . . 120/200ns
• Industry Standard Pinout
• Single 5.0V Supply
• CMOS/TTL Compatible Inputs
• Field Programmable
• Synchronous Operation
• On-Chip Address Latches
• Separate Output Enable
Ordering Information
PACKAGE
SBDIP
SMD#
SLIM SBDIP
SMD#
CLCC
SMD#
TEMPERATURE RANGE
-40
o
C to +85
o
C
-55
o
C to +125
o
C
-40
o
C to +85
o
C
-55
o
C to +125
o
C
-40
o
C to +85
o
C
-55
o
C to +125
o
C
120ns
HM1-6642B-9
5962-8869002JA
HM6-6642B-9
5962-8869002LA
-
5962-88690023A
200ns
HM1-6642-9
5962-8869001JA
HM6-6642-9
5962-8869001LA
HM4-6642-9
5962-88690013A
PKG. NO.
D24.6
D24.6
D24.3
D24.3
J28.A
J28.A
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207
|
Copyright
©
Intersil Corporation 1999
File Number
3012.1
6-1

5962-8869002JX相似产品对比

5962-8869002JX 5962-8869001LX 5962-88690023X 5962-8869001JX 5962-8869002LX 5962-88690013X
描述 512X8 OTPROM, 140ns, CDIP 512X8 OTPROM, 220ns, CDIP24 512X8 OTPROM, 140ns, CQCC 512X8 OTPROM, 220ns, CDIP24 512X8 OTPROM, 140ns, CDIP24 512X8 OTPROM, 220ns, CQCC
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 140 ns 220 ns 140 ns 220 ns 140 ns 220 ns
内存密度 4096 bit 4096 bit 4096 bit 4096 bit 4096 bit 4096 bit
内存集成电路类型 OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM
内存宽度 8 8 8 8 8 8
功能数量 1 1 1 1 1 1
字数 512 words 512 words 512 words 512 words 512 words 512 words
字数代码 512 512 512 512 512 512
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
组织 512X8 512X8 512X8 512X8 512X8 512X8
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装形式 IN-LINE IN-LINE CHIP CARRIER IN-LINE IN-LINE CHIP CARRIER
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO YES NO NO YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子形式 THROUGH-HOLE THROUGH-HOLE NO LEAD THROUGH-HOLE THROUGH-HOLE NO LEAD
端子位置 DUAL DUAL QUAD DUAL DUAL QUAD
Base Number Matches 1 1 1 1 1 1
JESD-30 代码 R-XDIP-T24 R-CDIP-T24 - R-CDIP-T24 R-CDIP-T24 -
端子数量 24 24 - 24 24 -
封装形状 RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR -

 
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