ISD1020AP概述

Speech Synthesizer With RCDG, 20s, CMOS, PDIP28

ISD1020AP规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Nuvoton(新唐科技)
包装说明	DIP, DIP28,.6
Reach Compliance Code	unknown
商用集成电路类型	SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码	R-PDIP-T28
JESD-609代码	e0
端子数量	28
封装主体材料	PLASTIC/EPOXY
封装代码	DIP
封装等效代码	DIP28,.6
封装形状	RECTANGULAR
封装形式	IN-LINE
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	5 V
认证状态	Not Qualified
最长读取时间	20 s
最大压摆率	30 mA
表面贴装	NO
技术	CMOS
端子面层	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
Base Number Matches	1

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ISD1020AP相似产品对比

	ISD1020AP	ISD1020AG	ISD1020AX	ISD1016AP	ISD1012AG	ISD1012AJ	ISD1012AP	ISD1012AX	ISD1016AJ	ISD1020AJ
描述	Speech Synthesizer With RCDG, 20s, CMOS, PDIP28	Speech Synthesizer With RCDG, 20s, CMOS, PDSO28	Speech Synthesizer With RCDG, 20s, CMOS	Speech Synthesizer With RCDG, 16s, CMOS, PDIP28	Speech Synthesizer With RCDG, 12s, CMOS, PDSO28,	Speech Synthesizer With RCDG, 12s, CMOS, PQCC28,	Speech Synthesizer With RCDG, 12s, CMOS, PDIP28,	Speech Synthesizer With RCDG, 12s, CMOS,	Speech Synthesizer With RCDG, 16s, CMOS, PQCC28,	Speech Synthesizer With RCDG, 20s, CMOS, PQCC28,
厂商名称	Nuvoton(新唐科技)	Nuvoton(新唐科技)	Nuvoton(新唐科技)	Nuvoton(新唐科技)	Nuvoton(新唐科技)	Nuvoton(新唐科技)	Nuvoton(新唐科技)	Nuvoton(新唐科技)	Nuvoton(新唐科技)	Nuvoton(新唐科技)
包装说明	DIP, DIP28,.6	SOP, SOP28,.5	, DIE OR CHIP	DIP, DIP28,.6	SOP, SOP28,.5	QCCJ, LDCC28,.5SQ	DIP, DIP28,.6	, DIE OR CHIP	QCCJ, LDCC28,.5SQ	QCCJ, LDCC28,.5SQ
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
商用集成电路类型	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG	SPEECH SYNTHESIZER WITH RCDG
封装等效代码	DIP28,.6	SOP28,.5	DIE OR CHIP	DIP28,.6	SOP28,.5	LDCC28,.5SQ	DIP28,.6	DIE OR CHIP	LDCC28,.5SQ	LDCC28,.5SQ
电源	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最长读取时间	20 s	20 s	20 s	16 s	12 s	12 s	12 s	12 s	16 s	20 s
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
是否Rohs认证	不符合	不符合	-	不符合	不符合	不符合	不符合	-	不符合	不符合
JESD-30 代码	R-PDIP-T28	R-PDSO-G28	X-XUUC-N25	R-PDIP-T28	R-PDSO-G28	S-PQCC-J28	R-PDIP-T28	-	S-PQCC-J28	S-PQCC-J28
JESD-609代码	e0	e0	-	e0	e0	e0	e0	-	e0	e0
端子数量	28	28	25	28	28	28	28	-	28	28
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	DIP	SOP	-	DIP	SOP	QCCJ	DIP	-	QCCJ	QCCJ
封装形状	RECTANGULAR	RECTANGULAR	UNSPECIFIED	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	-	SQUARE	SQUARE
封装形式	IN-LINE	SMALL OUTLINE	UNCASED CHIP	IN-LINE	SMALL OUTLINE	CHIP CARRIER	IN-LINE	-	CHIP CARRIER	CHIP CARRIER
最大压摆率	30 mA	30 mA	-	30 mA	25 mA	25 mA	25 mA	-	30 mA	30 mA
表面贴装	NO	YES	YES	NO	YES	YES	NO	-	YES	YES
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE	GULL WING	NO LEAD	THROUGH-HOLE	GULL WING	J BEND	THROUGH-HOLE	-	J BEND	J BEND
端子节距	2.54 mm	1.27 mm	-	2.54 mm	1.27 mm	1.27 mm	2.54 mm	-	1.27 mm	1.27 mm
端子位置	DUAL	DUAL	UPPER	DUAL	DUAL	QUAD	DUAL	-	QUAD	QUAD

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