D Latch, AC Series, 1-Func, Low Level Triggered, 1-Bit, True Output, CMOS, PDSO16, FP-16DN
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | SOIC |
包装说明 | SOP, SOP16,.25 |
针数 | 16 |
Reach Compliance Code | unknown |
其他特性 | ALSO OPERATES WITH 5V SUPPLY |
系列 | AC |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e0 |
长度 | 9.9 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | D LATCH |
位数 | 1 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP16,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
电源 | 3.3/5 V |
Prop。Delay @ Nom-Sup | 12 ns |
传播延迟(tpd) | 12 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
触发器类型 | LOW LEVEL |
宽度 | 3.95 mm |
最小 fmax | 95 MHz |
Base Number Matches | 1 |
HD74AC259RP | HD74AC259T | HD74AC259P | HD74AC259FP | |
---|---|---|---|---|
描述 | D Latch, AC Series, 1-Func, Low Level Triggered, 1-Bit, True Output, CMOS, PDSO16, FP-16DN | D Latch, AC Series, 1-Func, Low Level Triggered, 1-Bit, True Output, CMOS, PDSO16, TTP-16DA | D Latch, AC Series, 1-Func, Low Level Triggered, 1-Bit, True Output, CMOS, PDIP16, DP-16 | D Latch, AC Series, 1-Func, Low Level Triggered, 1-Bit, True Output, CMOS, PDSO16, FP-16DA |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | SOIC | SOIC | DIP | SOIC |
包装说明 | SOP, SOP16,.25 | TSSOP, TSSOP16,.25 | DIP, DIP16,.3 | SOP, SOP16,.3 |
针数 | 16 | 16 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
其他特性 | ALSO OPERATES WITH 5V SUPPLY | ALSO OPERATES WITH 5V SUPPLY | ALSO OPERATES WITH 5V SUPPLY | ALSO OPERATES WITH 5V SUPPLY |
系列 | AC | AC | AC | AC |
JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 |
JESD-609代码 | e0 | e0 | e0 | e0 |
长度 | 9.9 mm | 5 mm | 19.2 mm | 10.06 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | D LATCH | D LATCH | D LATCH | D LATCH |
位数 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
输出极性 | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | TSSOP | DIP | SOP |
封装等效代码 | SOP16,.25 | TSSOP16,.25 | DIP16,.3 | SOP16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE |
电源 | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V |
Prop。Delay @ Nom-Sup | 12 ns | 12 ns | 12 ns | 12 ns |
传播延迟(tpd) | 12 ns | 12 ns | 12 ns | 12 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.75 mm | 1.1 mm | 5.06 mm | 2.2 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
端子节距 | 1.27 mm | 0.65 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
触发器类型 | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL |
宽度 | 3.95 mm | 4.4 mm | 7.62 mm | 5.5 mm |
最小 fmax | 95 MHz | 95 MHz | 95 MHz | 95 MHz |
Base Number Matches | 1 | 1 | 1 | 1 |
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