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MX25L1606EPI-12G: 产品描述Flash, 8MX2, PDIP8, DIP-8; 产品类别存储存储; 文件大小2MB，共61页; 制造商Macronix; 官网地址http://www.macronix.com/en-us/Pages/default.aspx; 标准

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MX25L1606EPI-12G概述

Flash, 8MX2, PDIP8, DIP-8

MX25L1606EPI-12G规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	Macronix
零件包装代码	DIP
包装说明	DIP, DIP8,.3
针数	8
Reach Compliance Code	unknown
ECCN代码	EAR99
备用内存宽度	1
最大时钟频率 (fCLK)	86 MHz
耐久性	100000 Write/Erase Cycles
JESD-30 代码	R-PDIP-T8
长度	9.27 mm
内存密度	16777216 bit
内存集成电路类型	FLASH
内存宽度	2
功能数量	1
端子数量	8
字数	8388608 words
字数代码	8000000
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	8MX2
封装主体材料	PLASTIC/EPOXY
封装代码	DIP
封装等效代码	DIP8,.3
封装形状	RECTANGULAR
封装形式	IN-LINE
并行/串行	SERIAL
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	3/3.3 V
编程电压	2.7 V
认证状态	Not Qualified
座面最大高度	5.33 mm
串行总线类型	SPI
最大待机电流	0.00002 A
最大压摆率	0.025 mA
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	2.7 V
标称供电电压 (Vsup)	3 V
表面贴装	NO
技术	CMOS
温度等级	INDUSTRIAL
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
类型	NOR TYPE
宽度	7.62 mm
写保护	HARDWARE/SOFTWARE
Base Number Matches	1

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MX25L1606E

3V, 16M-BIT [x 1/x 2]

CMOS SERIAL FLASH MEMORY

Key Features

• Hold Feature

• Low Power Consumption

• Auto Erase and Auto Program Algorithms

• Additional 512 bit secured OTP for unique identifier

P/N: PM1548

Rev. 1.9, November 13, 2017

MX25L1606E

Contents

FEATURES .................................................................................................................................................................. 5

GENERAL DESCRIPTION ......................................................................................................................................... 6

PIN CONFIGURATIONS ............................................................................................................................................. 7

PIN DESCRIPTION ...................................................................................................................................................... 8

BLOCK DIAGRAM....................................................................................................................................................... 9

MEMORY ORGANIZATION ....................................................................................................................................... 10

Table 1. Memory Organization ........................................................................................................................... 10

DEVICE OPERATION ................................................................................................................................................ 11

Figure 1. Serial Modes Supported...................................................................................................................... 11

DATA PROTECTION.................................................................................................................................................. 12

Table 2. Protected Area Sizes ............................................................................................................................ 13

Table 3. 512 bit Secured OTP Definition

............................................................................................................ 14

HOLD FEATURE........................................................................................................................................................ 15

Figure 2. Hold Condition Operation ................................................................................................................... 15

COMMAND DESCRIPTION ....................................................................................................................................... 16

Table 4. COMMAND DEFINITION ..................................................................................................................... 16

(1) Write Enable (WREN) ................................................................................................................................... 17

(2) Write Disable (WRDI) .................................................................................................................................... 17

(3) Read Status Register (RDSR) ...................................................................................................................... 17

Table 5. Status Register ..................................................................................................................................... 18

(4) Write Status Register (WRSR) ...................................................................................................................... 18

Table 6. Protection Modes .................................................................................................................................. 19

(5) Read Data Bytes (READ) ............................................................................................................................. 20

(6) Read Data Bytes at Higher Speed (FAST_READ) ....................................................................................... 20

(7) Dual Output Mode (DREAD) ......................................................................................................................... 20

(8) Sector Erase (SE) ......................................................................................................................................... 20

(9) Block Erase (BE)........................................................................................................................................... 21

(10) Chip Erase (CE) .......................................................................................................................................... 21

(11) Page Program (PP) ..................................................................................................................................... 21

(12) Deep Power-down (DP) .............................................................................................................................. 22

(13) Release from Deep Power-down (RDP), Read Electronic Signature (RES) ............................................. 22

(14) Read Identification (RDID)

.......................................................................................................................... 23

(15) Read Electronic Manufacturer ID & Device ID (REMS) .............................................................................. 23

Table 7. ID DEFINITIONS ................................................................................................................................. 23

(16) Enter Secured OTP (ENSO) ....................................................................................................................... 23

(17) Exit Secured OTP (EXSO) .......................................................................................................................... 24

(18) Read Security Register (RDSCUR) ............................................................................................................ 24

Table 8. SECURITY REGISTER DEFINITION ................................................................................................... 24

(19) Write Security Register (WRSCUR) ............................................................................................................ 24

P/N: PM1548

Rev. 1.9, November 13, 2017

MX25L1606E

(20) Read SFDP Mode (RDSFDP)..................................................................................................................... 25

Figure 3. Read Serial Flash Discoverable Parameter (RDSFDP) Sequence..................................................... 25

Table 9. Signature and Parameter Identification Data Values

........................................................................... 26

Table 10. Parameter Table (0): JEDEC Flash Parameter Tables ....................................................................... 27

Table 11. Parameter Table (1): Macronix Flash Parameter Tables ..................................................................... 29

POWER-ON STATE ................................................................................................................................................... 31

ELECTRICAL SPECIFICATIONS .............................................................................................................................. 32

ABSOLUTE MAXIMUM RATINGS ..................................................................................................................... 32

Figure 4. Maximum Negative Overshoot Waveform .......................................................................................... 32

CAPACITANCE TA = 25°C, f = 1.0 MHz............................................................................................................. 32

Figure 5. Maximum Positive Overshoot Waveform ............................................................................................ 32

Figure 6. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL

.............................................................. 33

Figure 7. OUTPUT LOADING ........................................................................................................................... 33

Figure 8. SCLK TIMING DEFINITION ................................................................................................................ 33

Table 12. DC CHARACTERISTICS (Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V - 3.6V)

... 34

Table 13. AC CHARACTERISTICS (Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V - 3.6V)

... 35

Timing Analysis ........................................................................................................................................................ 36

Figure 9. Serial Input Timing .............................................................................................................................. 36

Figure 10. Output Timing .................................................................................................................................... 36

Figure 11. Hold Timing ....................................................................................................................................... 37

Figure 12. WP# Disable Setup and Hold Timing during WRSR when SRWD=1 ............................................... 37

Figure 13. Write Enable (WREN) Sequence (Command 06h) ........................................................................... 38

Figure 14. Write Disable (WRDI) Sequence (Command 04h)............................................................................ 38

Figure 15. Read Status Register (RDSR) Sequence (Command 05h) .............................................................. 39

Figure 16. Write Status Register (WRSR) Sequence (Command 01h)............................................................. 39

Figure 17. Read Data Bytes (READ) Sequence (Command 03h) .................................................................... 39

Figure 18. Read at Higher Speed (FAST_READ) Sequence (Command 0Bh)................................................. 40

Figure 19. Dual Output Read Mode Sequence (Command 3Bh) ....................................................................... 41

Figure 20. Sector Erase (SE) Sequence (Command 20h) ................................................................................ 41

Figure 21. Block Erase (BE) Sequence (Command 52h or D8h) ...................................................................... 41

Figure 22. Chip Erase (CE) Sequence (Command 60h or C7h) ....................................................................... 42

Figure 23. Page Program (PP) Sequence (Command 02h).............................................................................. 42

Figure 24. Deep Power-down (DP) Sequence (Command B9h) ...................................................................... 43

Figure 25. Release from Deep Power-down (RDP) Sequence (Command ABh) ............................................. 43

Figure 26. Read Electronic Signature (RES) Sequence (Command ABh) ........................................................ 43

Figure 27. Read Identification (RDID) Sequence (Command 9Fh)

.................................................................... 44

Figure 28. Read Electronic Manufacturer & Device ID (REMS) Sequence (Command 90h)............................ 44

Figure 29. Read Security Register (RDSCUR) Sequence (Command 2Bh) ...................................................... 45

Figure 30. Write Security Register (WRSCUR) Sequence (Command 2Fh) ..................................................... 45

Figure 31. Power-up Timing ............................................................................................................................... 46

Table 14. Power-Up Timing ............................................................................................................................... 46

P/N: PM1548

Rev. 1.9, November 13, 2017

MX25L1606E

OPERATING CONDITIONS ....................................................................................................................................... 47

Figure 32. AC Timing at Device Power-Up ......................................................................................................... 47

Figure 33. Power-Down Sequence .................................................................................................................... 48

ERASE AND PROGRAMMING PERFORMANCE .................................................................................................... 49

DATA RETENTION .................................................................................................................................................... 49

LATCH-UP CHARACTERISTICS .............................................................................................................................. 49

ORDERING INFORMATION ...................................................................................................................................... 50

PART NAME DESCRIPTION ..................................................................................................................................... 51

PACKAGE INFORMATION ........................................................................................................................................ 52

16-PIN SOP (300mil).......................................................................................................................................... 52

8-PIN SOP (150mil)............................................................................................................................................ 53

8-PIN SOP (200mil)............................................................................................................................................ 54

8-PIN PDIP (300mil) ........................................................................................................................................... 55

8-LAND WSON (6x5mm) ................................................................................................................................... 56

8-LAND USON (4x4mm) .................................................................................................................................... 57

24-BALL BGA ..................................................................................................................................................... 58

REVISION HISTORY ................................................................................................................................................. 59

P/N: PM1548

Rev. 1.9, November 13, 2017

MX25L1606EPI-12G

MX25L1606EPI-12G概述

MX25L1606EPI-12G规格参数

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