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MAX4691EBE

产品描述Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PBGA16, BUMP, UCSP-16
产品类别模拟混合信号IC    信号电路   
文件大小234KB,共21页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
下载文档 详细参数 选型对比 全文预览

MAX4691EBE概述

Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PBGA16, BUMP, UCSP-16

MAX4691EBE规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Maxim(美信半导体)
零件包装代码BGA
包装说明BUMP, UCSP-16
针数16
Reach Compliance Codenot_compliant
模拟集成电路 - 其他类型SINGLE-ENDED MULTIPLEXER
JESD-30 代码S-PBGA-B16
JESD-609代码e0
长度2.02 mm
湿度敏感等级1
负电源电压最大值(Vsup)-5.5 V
负电源电压最小值(Vsup)-4.5 V
标称负供电电压 (Vsup)-5 V
信道数量8
功能数量1
端子数量16
标称断态隔离度82 dB
通态电阻匹配规范2 Ω
最大通态电阻 (Ron)25 Ω
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码VFBGA
封装等效代码BGA16,4X4,20
封装形状SQUARE
封装形式GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)245
电源+-2/+-5.5/2/11 V
认证状态Not Qualified
座面最大高度0.67 mm
最大信号电流0.02 A
最大供电电流 (Isup)0.001 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
最长断开时间50 ns
最长接通时间80 ns
切换BREAK-BEFORE-MAKE
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距0.5 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度2.02 mm
Base Number Matches1

文档预览

下载PDF文档
19-1945; Rev 5; 3/09
Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/
Quad SPDT in UCSP Package
General Description
The MAX4691–MAX4694 are low-voltage CMOS analog
ICs configured as an 8-channel multiplexer (MAX4691),
two 4-channel multiplexers (MAX4692), three single-
pole/double-throw (SPDT) switches (MAX4693), and
four SPDT switches (MAX4694).
The MAX4691/MAX4692/MAX4693 operate from either
a single +2V to +11V power supply or dual ±2V to
±5.5V power supplies. When operating from ±5V sup-
plies they offer 25Ω on-resistance (R
ON
), 3.5Ω (max)
R
ON
flatness, and 3Ω (max) matching between chan-
nels. The MAX4694 operates from a single +2V to +11V
supply. Each switch has rail-to-rail signal handling and
a low 1nA leakage current.
All digital inputs are 1.8V logic-compatible when oper-
ating from a +3V supply and TTL compatible when
operating from a +5V supply.
The MAX4691–MAX4694 are available in 16-pin,
4mm
4mm QFN and TQFN and 16-bump UCSP pack-
ages. The chip-scale package (UCSP™) occupies a
2mm
2mm area, significantly reducing the required
PC board area.
1.8V Logic Compatibility
Guaranteed On-Resistance
70Ω (max) with +2.7V Supply
35Ω (max) with +5V Supply
25Ω (max) with ±4.5V Dual Supplies
Guaranteed Match Between Channels
5Ω (max) with +2.7V Supply
3Ω (max) with ±4.5V Dual Supplies
Guaranteed Flatness Over Signal Range
3.5Ω (max) with ±4.5V Dual Supplies
Low Leakage Currents Over Temperature
20nA (max) at +85°C
Fast 90ns Transition Time
Guaranteed Break-Before-Make
Single-Supply Operation from +2V to +11V
Dual-Supply Operation from ±2V to ±5.5V
(MAX4691/MAX4692/MAX4693)
V+ to V- Signal Handling
Low Crosstalk: -90dB (100kHz)
High Off-Isolation: -88dB (100kHz)
Features
16 Bump, 0.5mm-Pitch UCSP (2mm x 2mm)
MAX4691–MAX4694
Applications
Audio and Video Signal Routing
Cellular Phones
Battery-Operated Equipment
Communications Circuits
Modems
Ordering Information
PART
MAX4691EBE+T
MAX4691EGE+
MAX4691ETE+T
TEMP RANGE
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
PIN-PACKAGE
16-Bump UCSP*
16 QFN-EP
16 TQFN-EP
16-Bump UCSP*
16 QFN-EP
16 TQFN-EP
16-Bump UCSP*
16 QFN-EP
16 TQFN-EP
16-Bump UCSP*
16 QFN-EP
16 TQFN-EP
Functional Diagrams
MAX4691
X0
X1
X2
X3
X4
X5
X6
X7
LOGIC
X
MAX4692EBE+T
MAX4692EGE+
MAX4692ETE+T
MAX4693EBE+T
MAX4693EGE+
MAX4693ETE+T
MAX4694EBE+T
MAX4694EGE+
MAX4694ETE+T
EN
A
B
C
Pin Configurations appear at end of data sheet.
Functional Diagrams continued at end of data sheet.
UCSP is a trademark of Maxim Integrated Products, Inc.
*UCSP reliability is integrally linked to the user’s assembly meth-
ods, circuit board, and environment. See the UCSP Reliability
section for more information.
EP = Exposed pad.
+Denotes
a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.

MAX4691EBE相似产品对比

MAX4691EBE MAX4692EBE TW-36-06-TM-S-605-SM MAX4692EBE+ MAX4691EBE+
描述 Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PBGA16, BUMP, UCSP-16 Differential Multiplexer, 2 Func, 4 Channel, CMOS, PBGA16, BUMP, UCSP-16 Board Stacking Connector, 36 Contact(s), 1 Row(s), Male, Straight, 0.079 inch Pitch, Surface Mount Terminal, Black Insulator, Differential Multiplexer, 2 Func, 4 Channel, CMOS, PBGA16, BUMP, UCSP-16 Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, 2 X 2 MM, ROHS COMPLIANT, UCSP-16
是否无铅 含铅 含铅 不含铅 不含铅 不含铅
是否Rohs认证 不符合 不符合 符合 符合 符合
Reach Compliance Code not_compliant not_compliant compliant compliant compliant
JESD-609代码 e0 e0 e3 e1 e1
最高工作温度 85 °C 85 °C 105 °C 85 °C 70 °C
最低工作温度 -40 °C -40 °C -55 °C -40 °C -
端子节距 0.5 mm 0.5 mm 2 mm 0.5 mm 0.5 mm
厂商名称 Maxim(美信半导体) Maxim(美信半导体) - Maxim(美信半导体) Maxim(美信半导体)
零件包装代码 BGA BGA - BGA BGA
包装说明 BUMP, UCSP-16 BUMP, UCSP-16 - VFBGA, BGA16,4X4,20 VFBGA, BGA16,4X4,20
针数 16 16 - 16 16
模拟集成电路 - 其他类型 SINGLE-ENDED MULTIPLEXER DIFFERENTIAL MULTIPLEXER - DIFFERENTIAL MULTIPLEXER SINGLE-ENDED MULTIPLEXER
JESD-30 代码 S-PBGA-B16 S-PBGA-B16 - S-PBGA-B16 S-XBGA-B16
长度 2.02 mm 2.02 mm - 2.02 mm 2.02 mm
湿度敏感等级 1 1 - 1 1
负电源电压最大值(Vsup) -5.5 V -5.5 V - -5.5 V -5.5 V
负电源电压最小值(Vsup) -4.5 V -4.5 V - -4.5 V -4.5 V
标称负供电电压 (Vsup) -5 V -5 V - -5 V -5 V
信道数量 8 4 - 4 8
功能数量 1 2 - 2 1
端子数量 16 16 - 16 16
标称断态隔离度 82 dB 82 dB - 82 dB 82 dB
通态电阻匹配规范 2 Ω 2 Ω - 2 Ω 2 Ω
最大通态电阻 (Ron) 25 Ω 25 Ω - 25 Ω 25 Ω
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY UNSPECIFIED
封装代码 VFBGA VFBGA - VFBGA VFBGA
封装等效代码 BGA16,4X4,20 BGA16,4X4,20 - BGA16,4X4,20 BGA16,4X4,20
封装形状 SQUARE SQUARE - SQUARE SQUARE
封装形式 GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH - GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度) 245 240 - 260 260
电源 +-2/+-5.5/2/11 V +-2/+-5.5/2/11 V - +-2/+-5.5/2/11 V +-2/+-5.5/2/11 V
认证状态 Not Qualified Not Qualified - Not Qualified Not Qualified
座面最大高度 0.67 mm 0.67 mm - 0.67 mm 0.67 mm
最大信号电流 0.02 A 0.02 A - 0.02 A 0.02 A
最大供电电流 (Isup) 0.001 mA 0.001 mA - 0.001 mA 0.001 mA
最大供电电压 (Vsup) 5.5 V 5.5 V - 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V - 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V - 5 V 5 V
表面贴装 YES YES - YES YES
最长断开时间 50 ns 50 ns - 50 ns 50 ns
最长接通时间 80 ns 80 ns - 80 ns 80 ns
切换 BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE - BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
技术 CMOS CMOS - CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL - INDUSTRIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL BALL - BALL BALL
端子位置 BOTTOM BOTTOM - BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED 20 - NOT SPECIFIED NOT SPECIFIED
宽度 2.02 mm 2.02 mm - 2.02 mm 2.02 mm
Base Number Matches 1 1 - 1 1
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