1M X 8 FLASH 2.7V PROM, DSO8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ST(意法半导体) |
| 零件包装代码 | DFN |
| 包装说明 | ROHS COMPLIANT, MLP-8 |
| 针数 | 8 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 50 MHz |
| 数据保留时间-最小值 | 20 |
| 耐久性 | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-N8 |
| 长度 | 6 mm |
| 内存密度 | 8388608 bi |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 1MX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SON |
| 封装等效代码 | SOLCC8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3/3.3 V |
| 编程电压 | 2.7 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 串行总线类型 | SPI |
| 最大待机电流 | 0.00001 A |
| 最大压摆率 | 0.015 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 类型 | NOR TYPE |
| 宽度 | 5 mm |
| 最长写入周期时间 (tWC) | 15 ms |
| 写保护 | HARDWARE/SOFTWARE |
| M25P80-VMP6TP | M25P80-VMF6G | M25P80-VMF6 | M25P80-VMF6T | M25P80-VMF6P | M25P80-VMF6TP | M25P80-VMF6TG | M25P80-VMP6P | M25P80-VMW6P | M25P80-VMW6TP | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 1M X 8 FLASH 2.7V PROM, DSO8 | 1M X 8 FLASH 2.7V PROM, DSO8 | 1M X 8 FLASH 2.7V PROM, DSO8 | 1M X 8 FLASH 2.7V PROM, DSO8 | 1M X 8 FLASH 2.7V PROM, DSO8 | 1M X 8 FLASH 2.7V PROM, DSO8 | 1M X 8 FLASH 2.7V PROM, DSO8 | 1M X 8 FLASH 2.7V PROM, DSO8 | 1M X 8 FLASH 2.7V PROM, PDSO8 | 1M X 8 FLASH 2.7V PROM, PDSO8 |
| 是否Rohs认证 | 符合 | 符合 | 不符合 | 不符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| 包装说明 | ROHS COMPLIANT, MLP-8 | SOP, | 0.300 INCH, SOP-16 | 0.300 INCH, SOP-16 | 0.300 INCH, ROHS COMPLIANT, SOP-16 | 0.300 INCH, ROHS COMPLIANT, SOP-16 | SOP, | ROHS COMPLIANT, MLP-8 | SOP, SOP8,.3 | SOP, SOP8,.3 |
| Reach Compliance Code | unknow | compli | _compli | _compli | compli | compli | compli | unknow | compli | compli |
| 最大时钟频率 (fCLK) | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 75 MHz | 75 MHz |
| JESD-30 代码 | R-PDSO-N8 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-N8 | R-PDSO-G8 | R-PDSO-G8 |
| 内存密度 | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bi |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 16 | 16 | 16 | 16 | 16 | 16 | 8 | 8 | 8 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SON | SOP | SOP | SOP | SOP | SOP | SOP | SON | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 |
| 编程电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | GULL WING | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED | 40 | 40 |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 零件包装代码 | DFN | - | SOIC | SOIC | SOIC | SOIC | - | DFN | SOIC | SOIC |
| 针数 | 8 | - | 16 | 16 | 16 | 16 | - | 8 | 8 | 8 |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | - | - |
| 数据保留时间-最小值 | 20 | - | 20 | 20 | 20 | 20 | - | 20 | 20 | 20 |
| 耐久性 | 100000 Write/Erase Cycles | - | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | - | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| 长度 | 6 mm | - | 10.3 mm | 10.3 mm | 10.3 mm | 10.3 mm | - | 6 mm | 5.3 mm | 5.3 mm |
| 封装等效代码 | SOLCC8,.25 | - | SOP16,.4 | SOP16,.4 | SOP16,.4 | SOP16,.4 | - | SOLCC8,.25 | SOP8,.3 | SOP8,.3 |
| 电源 | 3/3.3 V | - | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | - | 3/3.3 V | 3/3.3 V | 3/3.3 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1 mm | - | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | - | 1 mm | 2.5 mm | 2.5 mm |
| 串行总线类型 | SPI | - | SPI | SPI | SPI | SPI | - | SPI | SPI | SPI |
| 最大待机电流 | 0.00001 A | - | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | - | 0.00001 A | 0.00001 A | 0.00001 A |
| 最大压摆率 | 0.015 mA | - | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | - | 0.015 mA | 0.015 mA | 0.015 mA |
| 标称供电电压 (Vsup) | 3 V | - | 3 V | 3 V | 3 V | 3 V | - | 3 V | 3 V | 3 V |
| 端子节距 | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm |
| 宽度 | 5 mm | - | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | - | 5 mm | 5.62 mm | 5.62 mm |
| 写保护 | HARDWARE/SOFTWARE | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
| JESD-609代码 | - | - | e0 | e0 | e4 | e4 | - | - | e3 | e3 |
| 端子面层 | - | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | Matte Tin (Sn) | Matte Tin (Sn) |
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