Product
Specification
108-1422
15Jul08 Rev E
Surface Mount Matched Impedance Connector
1.
1.1.
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SCOPE
Content
This specification covers performance, tests and quality requirements for the Tyco Electronics Surface
Mount Matched Impedance Connector (MICTOR) for board to board applications using two design
styles, right angle and vertical. These two piece connector designs accommodate a variety of printed
circuit board thicknesses. Plug assemblies are loaded with .008 inch thick MICTOR contacts which mate
with hermaphroditic contacts in the receptacle assembly. Both plug and receptacle assemblies are
available in signal counts of 38 to 266 position in 38 pin increments for .025 inch centerline.
1.2.
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Qualification
When tests are performed on the subject product line, procedures specified in Figure 1 shall be used.
All inspections shall be performed using the applicable inspection plan and product drawing.
1.3.
Qualification Test Results
Successful qualification testing on the subject product line was completed on 13Dec98. The
Qualification Test Report number for this testing is 501-252. This documentation is on file at and
available from Engineering Practices and Standards (EPS).
2.
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APPLICABLE DOCUMENTS
The following Tyco Electronics documents form a part of this specification to the extent specified herein.
Unless otherwise specified, the latest edition of the document applies. In the event of conflict between
the requirements of this specification and the product drawing, the product drawing shall take
precedence. In the event of conflict between the requirements of this specification and the referenced
documents, this specification shall take precedence.
109-1: General Requirements for Test Specifications
109 Series: Test Specifications as indicated in Figure 1
501-252: Qualification Test Report (Surface Mount Matched Impedance Connector)
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3.
3.1.
REQUIREMENTS
Design and Construction
Product shall be of design, construction and physical dimensions specified on the applicable product
drawing.
©2008 Tyco Electronics Corporation
Harrisburg, PA
All International Rights Reserved.
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* Trademark
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For latest revision, visit our website at www.tycoelectronics.com\documents.
For Regional Customer Service, visit our website at www.tycoelectronics.com
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LOC B
108-1422
3.2.
Materials
Contacts:
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Plug: High reliability copper alloy, nickel underplate all over, mating surfaces plated to meet
Level 1 or Level 2 durability performance requirements, solder tails plated tin-lead or matte tin
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Receptacle: High reliability copper alloy, nickel underplate all over, mating surfaces plated to
meet Level 1 or Level 2 durability performance requirements, solder tails plated tin-lead or
matte tin
Ground bus:
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Plug: Brass, nickel underplate all over, mating surfaces plated to meet Level 1 or Level 2
durability performance requirements, solder tails plated tin-lead or matte tin
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Receptacle: Phosphor bronze, nickel underplate all over, mating surfaces plated to meet
Level 1 or Level 2 durability performance requirements, solder tails plated tin-lead or matte tin
Housing: Liquid crystal polymer, (LCP), UL94V-0
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3.3.
3.4.
Performance and Test Description
Product is designed to meet the electrical, mechanical and environmental performance requirements
specified in Figure 1. Unless otherwise specified, all tests shall be performed at ambient environmental
conditions per Test Specification 109-1.
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3.5.
Test Requirements and Procedures Summary
Test Description
Requirement
Meets requirements of product
drawing.
ELECTRICAL
Procedure
Visual, dimensional and functional
per applicable quality inspection
plan.
AMP 109-6-1.
Subject mated contacts assembled
in housing to 50 mv maximum open
circuit at 100 ma maximum.
See Figure 3.
AMP Spec 109-28-1.
Test between adjacent signal
contacts and between all signal
contacts and ground of mated
samples.
AMP Spec 109-29-1.
Test between adjacent signal
contacts and between all signal
contacts and ground of mated
samples.
Examination of product.
Insulation resistance.
Dielectric withstanding voltage.
Rev E
)
Termination resistance.
10000 megohms minimum.
500 volts AC at sea level.
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Ratings
Voltage: 30 volts AC
Current:
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Signal contacts: Signal application only
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Ground bus: See Figure 4 for applicable current carrying capability
Temperature: -55 to 125 C
Characteristic Impedance: 50 ± 5 ohms at 1 nanosecond
R 10 milliohms maximum.
Figure 1 (continued)
2 of 9
108-1422
Test Description
Random vibration.
Requirement
MECHANICAL
No discontinuities of 1 microsecond AMP Spec 109-21-5.
or longer duration.
Subject mated samples to 11.95
See Note.
G's rms. Ninety minutes in each of 3
mutually perpendicular planes.
No discontinuities of 1 microsecond AMP Spec 109-26-1.
or longer duration.
Subject mated samples to 50 G's
See Note.
half-sine shock pulses of 11
milliseconds duration. 3 shocks in
each direction applied along 3
mutually perpendicular planes, 18
total shocks.
See Note.
AMP Spec 109-27.
Mate and unmate samples for 25
cycles for Level 1 contacts and 500
cycles for Level 2 contacts at
maximum rate of 600 cycles per
hour.
Procedure
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Mechanical shock.
Durability.
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Mating force.
152 ounces maximum per module AMP Spec 109-42, Condition A.
(1 module = 38 contacts + 1 ground Measure force necessary to mate
bus).
samples at maximum rate of 1 inch
per minute.
19 ounces minimum per module (1
module = 38 contacts + 1 ground
bus).
ENVIRONMENTAL
AMP Spec 109-42, Condition A.
Measure force necessary to unmate
samples at maximum rate of 1 inch
per minute.
AMP Spec 109-22.
Subject mated samples to 5 cycles
between -55 and 125 C.
AMP Spec 109-23-3, Condition B.
Subject mated samples to 10 cycles
between 25 and 65 C at 95% RH.
AMP Spec 109-43.
Subject mated samples to
temperature life at 118 C for 792
hours.
AMP Spec 109-85-2.
Subject mated samples to
environmental class II for 14 days.
AMP Spec 109-75-2.
Subject mated samples to 1024
cycles between -40 and 60 C at 2
hours per cycle.
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Unmating force.
Thermal shock.
See Note.
Humidity/temperature cycling.
See Note.
Temperature life.
See Note.
Mixed flowing gas.
See Note.
Temperature cycling.
See Note.
NOTE
Shall meet visual requirements, show no physical damage and shall meet requirements of
additional tests as specified in Test Sequence in Figure 2.
Figure 1 (end)
Rev E
3 of 9
108-1422
3.6.
Product Qualification and Requalification Test Sequence
Test Group (a)
Test or Examination
Examination of product
Termination resistance
Insulation resistance
Dielectric withstanding voltage
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Random vibration
Mechanical shock
Durability
Mating force
Unmating force
Thermal shock
Humidity/temperature cycling
Temperature life
Mixed flowing gas
Temperature cycling
NOTE
3(c)
3(c)
3(c)
5
6
4
2
8
4
5
1
1,9
3,7
2
1,5
2,4
3
1,5
2,4
2,6
3,7
4
1,8
5
1,5
2,4
Test Sequence (b)
(a) See paragraph 4.1.A.
(b) Numbers indicate sequence in which tests are performed.
(c) Precondition samples with 3 cycles durability.
Figure 2
Rev E
4 of 9
108-1422
4.
4.1.
QUALITY ASSURANCE PROVISIONS
Qualification Testing
A.
Sample Selection
Samples shall be prepared in accordance with applicable Instruction Sheets and shall be selected
at random from current production. Test groups 1, 2, 3 and 5 shall consist of 3 mated pairs (plug
and receptacle) of vertical and right angle assemblies. Samples shall be mounted on .062 inch
thick printed circuit boards. Housings shall be fully populated with signal contacts and bus bars.
Test group 4 shall consist of 5 mated pairs (plug and receptacle) of vertical and right angle
assemblies. Housings shall be fully populated with signal contacts and bus bars and shall not be
mounted on printed circuit boards.
B.
Test Sequence
Qualification inspection shall be verified by testing samples as specified in Figure 2.
4.2.
Requalification Testing
If changes significantly affecting form, fit or function are made to product or manufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of original testing
sequence as determined by development/product, quality and reliability engineering.
4.3.
Acceptance
Acceptance is based on verification that product meets requirements of Figure 1. Failures attributed to
equipment, test setup or operator deficiencies shall not disqualify product. When product failure occurs,
corrective action shall be taken and samples resubmitted for qualification. Testing to confirm corrective
action is required before resubmittal.
4.4.
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Quality Conformance Inspection
The applicable quality inspection plan will specify sampling acceptable quality level to be used.
Dimensional and functional requirements shall be in accordance with applicable product drawing and
this specification.
Rev E
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FPGA/CPLD
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