5962-9220206MFX概述

Decoder/Driver, FCT Series, Inverted Output, CMOS, CDFP16, CERPACK-16

5962-9220206MFX规格参数

参数名称	属性值
零件包装代码	DFP
包装说明	DFP,
针数	16
Reach Compliance Code	unknown
ECCN代码	EAR99
系列	FCT
JESD-30 代码	R-CDFP-F16
JESD-609代码	e0
长度	10.16 mm
功能数量	2
端子数量	16
最高工作温度	125 °C
最低工作温度	-55 °C
输出极性	INVERTED
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	DFP
封装形状	RECTANGULAR
封装形式	FLATPACK
传播延迟（tpd）	6.2 ns
认证状态	Not Qualified
筛选级别	MIL-STD-883
座面最大高度	2.159 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子面层	TIN LEAD
端子形式	FLAT
端子节距	1.27 mm
端子位置	DUAL
宽度	6.731 mm
Base Number Matches	1

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5962-9220206MFX相似产品对比

	5962-9220206MFX	5962-9220204M2X	5962-9220204MFX	5962-9220202MEX	5962-9220206M2X	5962-9220206MEX	5962-9220202MFX	5962-9220204MEX	5962-9220202M2X
描述	Decoder/Driver, FCT Series, Inverted Output, CMOS, CDFP16, CERPACK-16	Decoder/Driver, FCT Series, Inverted Output, CMOS, CQCC20, LCC-20	Decoder/Driver, FCT Series, Inverted Output, CMOS, CDFP16, CERPACK-16	Decoder/Driver, FCT Series, Inverted Output, CMOS, CDIP16, 0.300 INCH, CERDIP-16	Decoder/Driver, FCT Series, Inverted Output, CMOS, CQCC20, LCC-20	Decoder/Driver, FCT Series, Inverted Output, CMOS, CDIP16, 0.300 INCH, CERDIP-16	Decoder/Driver, FCT Series, Inverted Output, CMOS, CDFP16, CERPACK-16	Decoder/Driver, FCT Series, Inverted Output, CMOS, CDIP16, 0.300 INCH, CERDIP-16	Decoder/Driver, FCT Series, Inverted Output, CMOS, CQCC20, LCC-20
零件包装代码	DFP	QLCC	DFP	DIP	QLCC	DIP	DFP	DIP	QLCC
包装说明	DFP,	QCCN,	DFP,	DIP,	QCCN,	DIP,	DFP,	DIP,	QCCN,
针数	16	20	16	16	20	16	16	16	20
Reach Compliance Code	unknown	unknow	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
系列	FCT	FCT	FCT	FCT	FCT	FCT	FCT	FCT	FCT
JESD-30 代码	R-CDFP-F16	S-CQCC-N20	R-CDFP-F16	R-GDIP-T16	S-CQCC-N20	R-GDIP-T16	R-CDFP-F16	R-GDIP-T16	S-CQCC-N20
长度	10.16 mm	8.89 mm	10.16 mm	20.066 mm	8.89 mm	20.066 mm	10.16 mm	20.066 mm	8.89 mm
功能数量	2	2	2	2	2	2	2	2	2
端子数量	16	20	16	16	20	16	16	16	20
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
输出极性	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
封装代码	DFP	QCCN	DFP	DIP	QCCN	DIP	DFP	DIP	QCCN
封装形状	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
封装形式	FLATPACK	CHIP CARRIER	FLATPACK	IN-LINE	CHIP CARRIER	IN-LINE	FLATPACK	IN-LINE	CHIP CARRIER
传播延迟（tpd）	6.2 ns	7.8 ns	7.8 ns	12 ns	6.2 ns	6.2 ns	12 ns	7.8 ns	12 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
筛选级别	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883
座面最大高度	2.159 mm	2.54 mm	2.159 mm	5.08 mm	2.54 mm	5.08 mm	2.159 mm	5.08 mm	2.54 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	NO	YES	NO	YES	NO	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
端子形式	FLAT	NO LEAD	FLAT	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	FLAT	THROUGH-HOLE	NO LEAD
端子节距	1.27 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm
端子位置	DUAL	QUAD	DUAL	DUAL	QUAD	DUAL	DUAL	DUAL	QUAD
宽度	6.731 mm	8.89 mm	6.731 mm	7.62 mm	8.89 mm	7.62 mm	6.731 mm	7.62 mm	8.89 mm
Base Number Matches	1	1	1	1	1	1	1	1	1
JESD-609代码	e0	-	e0	e0	-	e0	e0	e0	-
端子面层	TIN LEAD	-	TIN LEAD	TIN LEAD	-	TIN LEAD	TIN LEAD	TIN LEAD	-

5962-9220206MFX

5962-9220206MFX概述

5962-9220206MFX规格参数

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5962-9220206MFX相似产品对比

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