Microcontroller, 8-Bit, MROM, H8/300 CPU, 16MHz, CMOS, PQFP100,
| 参数名称 | 属性值 |
| 厂商名称 | Hitachi （Renesas ） |
| 包装说明 | QFP, TQFP100,.63SQ |
| Reach Compliance Code | unknown |
| 位大小 | 8 |
| CPU系列 | H8/300 |
| JESD-30 代码 | S-PQFP-G100 |
| 端子数量 | 100 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QFP |
| 封装等效代码 | TQFP100,.63SQ |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 2048 |
| ROM（单词） | 49152 |
| ROM可编程性 | MROM |
| 速度 | 16 MHz |
| 最大压摆率 | 60 mA |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| HD6433436(XXX)TF | HD6433436(XXX)F | HD6433436W(XXX)TF | HD6433437(XXX)F | HD6433437W(XXX)TF | HD6433437W(XXX)F | HD6433437(XXX)TF | HD6433436W(XXX)F | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Microcontroller, 8-Bit, MROM, H8/300 CPU, 16MHz, CMOS, PQFP100, | Microcontroller, 8-Bit, MROM, H8/300 CPU, 16MHz, CMOS, PQFP100, | Microcontroller, 8-Bit, MROM, H8/300 CPU, 16MHz, CMOS, PQFP100, | Microcontroller, 8-Bit, MROM, H8/300 CPU, 16MHz, CMOS, PQFP100, | Microcontroller, 8-Bit, MROM, H8/300 CPU, 16MHz, CMOS, PQFP100, | Microcontroller, 8-Bit, MROM, H8/300 CPU, 16MHz, CMOS, PQFP100, | Microcontroller, 8-Bit, MROM, H8/300 CPU, 16MHz, CMOS, PQFP100, | Microcontroller, 8-Bit, MROM, H8/300 CPU, 16MHz, CMOS, PQFP100, |
| 厂商名称 | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） |
| 包装说明 | QFP, TQFP100,.63SQ | QFP, QFP100,.63SQ,20 | QFP, TQFP100,.63SQ | QFP, QFP100,.63SQ,20 | QFP, TQFP100,.63SQ | QFP, QFP100,.63SQ,20 | QFP, TQFP100,.63SQ | QFP, QFP100,.63SQ,20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | H8/300 | H8/300 | H8/300 | H8/300 | H8/300 | H8/300 | H8/300 | H8/300 |
| JESD-30 代码 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 |
| 端子数量 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
| 封装等效代码 | TQFP100,.63SQ | QFP100,.63SQ,20 | TQFP100,.63SQ | QFP100,.63SQ,20 | TQFP100,.63SQ | QFP100,.63SQ,20 | TQFP100,.63SQ | QFP100,.63SQ,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 |
| ROM（单词） | 49152 | 49152 | 49152 | 61440 | 61440 | 61440 | 61440 | 49152 |
| ROM可编程性 | MROM | MROM | MROM | MROM | MROM | MROM | MROM | MROM |
| 速度 | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
| 最大压摆率 | 60 mA | 60 mA | 60 mA | 60 mA | 60 mA | 60 mA | 60 mA | 60 mA |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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