REVISIONS
LTR
A
B
DESCRIPTION
Change in paragraph 1.3, 1.4, 4.3.1c and figure 3. Technical changes in table I.
Editorial changes throughout.
Add vendor CAGE F8859. Add device Class V criteria. Add delta limits, table III.
Add case outline X. Update boilerplate. Editorial changes throughout. – lgt
Change to the propagation delay time value,
E
1
to
On
test in table I. Update
to latest MIL-PRF-38535 requirements. - lgt
Add section 1.5, radiation features. Update the boilerplate to include radiation
hardness assured requirements. Editorial changes throughout. - LTG
DATE (YR-MO-DA)
88-11-30
00-10-23
01-01-30
APPROVED
D. R. Cool
Raymond Monnin
Raymond Monnin
C
D
04-05-14
Charles F. Saffle
THE FRONT PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
D
15
D
16
D
17
REV
SHEET
PREPARED BY
Jeffery Tunstall
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
B
10
B
11
B
12
B
13
D
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Ray Monnin
APPROVED BY
D. R. Cool
DRAWING APPROVAL DATE
87-08-12
REVISION LEVEL
SIZE
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
MICROCIRCUIT, DIGITAL, ADVANCED
CMOS, 1-OF-8 DECODER/DEMULTIPLEXER,
MONOLITHIC SILICON
AMSC N/A
CAGE CODE
D
A
SHEET
67268
1 OF
17
5962-87622
DSCC FORM 2233
APR 97
5962-E283-04
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the
Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the
PIN.
1.2 PIN. The PIN is as shown in the following example:
For device classes M and Q:
5962
-
87622
01
E
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
\/
Drawing number
Device
type
(see 1.2.2)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
For device class V:
5962
F
87622
01
V
X
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
\/
Drawing number
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
54AC138
Circuit function
1-of-8 decoder/multiplexer
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed
below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q
designators will not be included in the PIN and will not be marked on the device.
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Certification and qualification to MIL-PRF-38535
Q or V
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87622
SHEET
D
2
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
E
F
2
X
Descriptive designator
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
CQCC1-N20
CDFP4-F16
Terminals
16
16
20
16
Package style
Dual-in-line
Flat pack
Square leadless chip carrier
Flat pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/ 2/ 3/
Supply voltage range (V
CC
)..................................................................................
DC input voltage range (V
IN
)................................................................................
DC output voltage range (V
OUT
)...........................................................................
Clamp diode current (I
IK
, I
OK
) ...............................................................................
DC output current ................................................................................................
DC V
CC
or GND current (per pin).........................................................................
Storage temperature range (T
STG
).......................................................................
Maximum power dissipation (P
D
).........................................................................
Lead temperature (soldering, 10 seconds)..........................................................
Thermal resistance, junction-to-case (θ
JC
) ..........................................................
Junction temperature (T
J
) ...................................................................................
1.4 Recommended operating conditions. 2/ 3/ 5/
Supply voltage range (V
CC
)..................................................................................
Input voltage range (V
IN
)......................................................................................
Output voltage range (V
OUT
) ................................................................................
Case operating temperature range (T
C
) ..............................................................
Input rise or fall times (t
r
, t
f
):
V
CC
= 3.6 V ....................................................................................................
V
CC
= 5.5 V ....................................................................................................
1.5 Radiation features.
Device type 01:
Total dose (dose rate = 50 – 300 rads(Si)/s).................................................. 300 krads (Si)
2
Single Event Latchup (SEL) or Single Event Upset (SEU).............................
≥
93 MeV–cm /mg
+2.0 V dc to +6.0 V dc
+0.0 V dc to V
CC
+0.0 V dc to V
CC
-55°C to +125°C
0 to 8 ns
0 to 8 ns
-0.5 V dc to +7.0 V dc
-0.5 V dc to V
CC
+ 0.5 V dc
-0.5 V dc to V
CC
+ 0.5 V dc
±20
mA
±50
mA
±50
mA
-65°C to +150°C
500 mW
+260°C
See MIL-STD-1835
+175°C 4/
1/
2/
3/
4/
5/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Unless otherwise noted, all voltages are referenced to GND.
The limits for the parameters specified herein shall apply over the full specified V
CC
range and case temperature range of
-55°C to +125°C.
Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
accordance with method 5004 of MIL-STD-883.
Operation from 2.0 V dc to 3.0 V dc is provided for compatibility with data retention and battery back-up systems. Data
retention implies no input transition and no stored data loss with the following conditions: V
IH
≥
70% V
CC
, V
IL
≤
30% V
CC
,
V
OH
≥
70% V
CC
@ -20µA, V
OL
≤
30% V
CC
@ 20
µA.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87622
SHEET
D
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks
form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of these documents cited in the solicitation or contract.
ELECTRONIC INDUSTRIES ALLIANCE (EIA)
JEDEC Standard No. 20 - Standard for Description of 54/74ACXXXX and 54/74ACTXXXX Advanced High-Speed
CMOS Devices.
(Copies of these documents are available online at http://www.jedec.org or from Electronics Industries Alliance, 2500 Wilson
Boulevard, Arlington, VA, 22201-3834).
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87622
SHEET
D
4
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3.
3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4.
3.2.6 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing or acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535
and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or
for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 39 (see MIL-PRF-38535, appendix A).
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87622
SHEET
D
5
瑞萨MCU/MPU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
