I
NTEGRATED
C
IRCUITS
D
IVISION
Characteristics
Parameter
Blocking Voltage
Load Current, T
A
=25°C:
With 5°C/W Heat Sink
No Heat Sink
On-Resistance (max)
Thermal Resistance,
Junction-to-Case,
JC
3.1
1.25
1
0.35
A
rms
/ A
DC
°C/W
600V Single-Pole, Normally Open
Power Relay
Description
CPC1977
Rating
600
Units
V
P
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of high-power Solid
State Relays.
As part of this family, the CPC1977 single-pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 3.1A
rms
continuous load current with a
5°C/W heat sink.
The CPC1977 employs optically coupled MOSFET
technology to provide 2500V
rms
of input to output
isolation. The optically coupled outputs, that use
patented OptoMOS architecture, are controlled by a
highly efficient infrared LED. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique i4-PAC package pioneered by IXYS
enables Solid State Relays to achieve the highest load
current and power ratings. This package features a
unique IXYS process where the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500V
rms
isolation
but also very low junction-to-case thermal resistance
(0.35 °C/W).
Features
•
•
•
•
•
•
•
•
•
•
3.1A
rms
Load Current with 5°C/W Heat Sink
Low 1 On-Resistance
600V
P
Blocking Voltage
2500V
rms
Input/Output Isolation
Low Thermal Resistance:
JC
= 0.35 °C/W
Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
•
•
•
•
Industrial Controls / Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Transportation Equipment
•
Aerospace/Defense
Ordering Information
Part
CPC1977J
Description
i4-PAC Package (25 per tube)
Switching Characteristics
Form-A
I
F
90%
Approvals
•
UL 508 Recognized Component: File E69938
Pin Configuration
I
LOAD
t
on
10%
t
off
e
3
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I
NTEGRATED
C
IRCUITS
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IVISION
1 Specifications
1.1 Absolute Maximum Ratings @ 25°C
Symbol
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
Ratings
600
5
100
1
150
2500
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
V
rms
CPC1977
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
°C
°C
1.2 Electrical Characteristics @ 25°C
Parameter
Output Characteristics
Load Current
1
Peak
Continuous
Continuous
Continuous
On-Resistance
2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
3
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Input/Output Characteristics
Capacitance, Input-to-Output
1
Conditions
Symbol
Minimum
Typical
Maximum
Units
t10ms
No Heat Sink
T
C
=25°C
T
C
=99°C
I
F
=10mA, I
L
=1A
V
L
=600V
P
15
I
L
I
L(99)
R
ON
I
LEAK
t
on
t
off
C
out
I
F
I
F
V
F
I
R
-
-
-
-
-
-
0.6
0.9
-
-
0.57
-
7.5
0.085
2450
-
-
1.2
-
1
-
-
1.25
12.25
1.4
1
1
20
5
-
10
-
1.4
10
-
A
P
A
rms
/ A
DC
A
I
F
=20mA, V
L
=10V
V
L
=25V, f=1MHz
I
L
=1A
-
I
F
=5mA
V
R
=5V
-
ms
pF
mA
mA
V
A
pF
C
I/O
Higher load currents possible with proper heat sinking.
2
Measurement taken within 1 second of on-time.
3
For applications requiring high temperature operation (T > 60ºC) an LED drive current of 20mA is recommended.
C
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I
NTEGRATED
C
IRCUITS
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IVISION
2 Thermal Characteristics
Parameter
Thermal Resistance (Junction to Case)
Thermal Resistance (Junction to Ambient)
Junction Temperature (Operating)
2.1 Thermal Management
Conditions
-
Free Air
-
Symbol
JC
JA
CPC1977
Rating
0.35
33
-40 to +100
Units
°C/W
°C/W
°C
T
J
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface
material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient
thermal resistance of 12.5°C/W.
2.2 Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Heat Sink Rating
θ
CA
=
(T
J
- T
A
) I
L(99)2
I
L
2
•
P
D(99)
-
θ
JC
T
J
= Junction Temperature (°C), T
J
≤
100°C *
T
A
= Ambient Temperature (°C)
I
L(99)
= Load Current
with
Case Temperature @ 99°C (A
DC
)
I
L
= Desired Operating Load Current (A
DC
), I
L
≤
I
L(MAX)
θ
JC
= Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W
θ
CA
= Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
P
D(99)
= Maximum power dissipation
with
case temperature held at 99ºC = 2.86W
* Elevated junction temperature reduces semiconductor lifetime.
NOTE:
The exposed surface of the DCB substrate is not to
be
soldered.
3
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I
NTEGRATED
C
IRCUITS
D
IVISION
3 Performance Data @ 25°C (Unless Otherwise Noted)
35
30
CPC1977
Typical LED Forward Voltage Drop
(N=50, I
F
=10mA)
25
20
15
10
5
0
1.30
1.31
1.32
1.33
1.34
6.5
Typical Turn-On Time
(N=50, I
F
=10mA, I
L
=1A
DC
)
Typical Turn-Off Time
(N=50, I
F
=10mA, I
L
=1A
DC
)
25
20
15
10
5
0
Device Count (N)
Device Count (N)
25
20
15
10
5
0
LED Forward Voltage (V)
Device Count (N)
7.0
7.5
8.0
8.5
9.0
0.04
0.06
0.08
0.09
0.10
0.11
Turn-On (ms)
Turn-Off (ms)
35
30
Device Count (N)
25
20
15
10
5
0
Typical On-Resistance Distribution
(N=50, I
F
=10mA, I
L
=1A
DC
)
Typical Blocking Voltage Distribution
(N=50)
35
30
Device Count (N)
0.54
0.55
0.56
0.57
0.58
0.59
25
20
15
10
5
0
815
820
825
830
835
840
On-Resistance (Ω)
Blocking Voltage (V
P
)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
1.6
18
16
14
Typical Turn-On Time
vs. LED Forward Current
(I
L
=1A
DC
)
0.18
0.17
0.16
Turn-Off (ms)
0.15
0.14
0.12
0.12
0.10
0.08
0
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=1A
DC
)
Turn-On (ms)
1.4
I
F
=50mA
1.2
1.0
0.8
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
I
F
=20mA
I
F
=10mA
12
10
8
6
4
2
0
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
20
18
16
14
12
10
8
6
4
2
0
-40
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=1A
DC
)
14
12
Turn-On (ms)
Typical Turn-On Time vs. Temperature
(I
F
=10mA, I
L
=1A
DC
)
Typical Turn-Off Time vs. Temperature
(I
F
=10mA, I
L
=1A
DC
)
0.35
0.30
LED Current (mA)
8
6
4
2
0
Turn-Off (ms)
10
0.25
0.20
0.15
0.10
0.05
0
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
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I
NTEGRATED
C
IRCUITS
D
IVISION
CPC1977
1.8
1.6
On-Resistance (Ω)
1.2
1.0
0.8
0.6
0.4
0.2
0
-40
-20
1.4
Typical On-Resistance
vs. Temperature
(I
F
=20mA, I
L
=0.75A)
1.25
1.00
0.75
0.50
0.25
0
-0.25
-0.50
-0.75
-1.00
-1.25
-2.0
Typical Load Current
vs. Load Voltage
(I
F
=10mA)
Load Current (A
rms
)
8
7
6
5
4
3
2
1
0
0
Maximum Load Current
vs. Temperature with Heat Sink
(I
F
=20mA)
1ºC/W
Load Current (A)
5ºC/W
10ºC/W
Free Air
0
20
40
60
80
100
-1.33
-0.66
0
0.66
1.33
2.0
20
40
60
80
100
Temperature (ºC)
Load Voltage (V)
Temperature (ºC)
Typical Blocking Voltage
vs. Temperature
845
0.014
0.012
0.010
0.008
0.006
0.004
0.002
-40
-20
0
20
40
60
80
100
Typical Leakage vs. Temperature
Measured Across Pins 1&2
(V
L
=600V
P
)
18
15
Load Current (A
P
)
12
9
6
3
0
Energy Rating Curve
Free Air, No Heat Sink
Blocking Voltage (V
P
)
840
Leakage (μA)
835
830
825
820
815
810
805
Temperature (ºC)
0
-40
-20
0
20
40
60
80
100
10µs 100µs 1ms 10ms 100ms
Time
1s
10s 100s
Temperature (ºC)
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
5
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