BTS54220-LBE
Revision History
Page or Item
All
Subjects (major changes since previous revision)
General: Numbering of Figures and Tables changed
Table 1
updated
Chapter 4.2.1
added
Chapter 4.2.2
added
Parameter P_4.1.4: number changed to P_4.1.5 and max. value improved
Parameter P_4.1.11: Max. Value improved
Parameter P_4.1.28: Max. Value improved
Parameter P_4.1.31: Max. Value improved
Parameter P_4.1.34: Max. Value improved
Parameter P_4.1.37: Max. Value improved
Parameter P_4.1.39: Min. Value improved
Parameter P_4.1.42: Max. Value improved
Parameter P_4.1.44: Min. Value improved
Parameter P_4.1.55 added
Parameter P_4.1.56 added
Chapter 5
rewritten (content improved)
Parameter P_5.3.7: Max. Value improved
Parameter P_5.3.8: Test Condition updated and Max. Value improved
Parameter P_5.3.10: Max. Value improved
Parameter P_5.3.13: Test Condition updated
Parameter P_5.3.14: Max. Value improved
Parameter P_5.3.16: Typ. and Max. value improved
Parameter P_5.3.17: Typ. and Min. Value improved
Parameter P_5.3.23: Max. Value improved
Chapter 6.1:
R
DS(ON)
graphs removed
Chapter 6.1:
R
DS(ON)
variation factor added
Chapter 6.4:
Description improved
Figure 16:
Content updated
Chapter 6.4.4:
Note added
Chapter 7.1:
Content improved
Chapter 7.1:
I
L(LIM)
graphs removed
Chapter 7.1:
I
L(LIM)
variation factor added
Chapter 7.2:
Content improved
Figure 18:
Content updated
Figure 19:
Content and Title updated
Figure 20:
added
Undervoltage Behavior shifted from Chapter 7.4 to
Chapter 5.2.1
Figure 21:
Content updated
Chapter 8.1:
Content improved
Figure 22:
Content updated
Figure 23:
Content updated
Chapter 8.2.3
added
Chapter 8.4:
Content improved
Parameter P_8.5.118 added
Rev. 2.0, 2014-05-26
Data Sheet
3
Rev. 2.2, 2016-10-10
BTS54220-LBE
Revision History
Page or Item
Subjects (major changes since previous revision)
Parameter P_9.4.19: Test Condition updated
Parameter P_9.4.20: Test Condition updated
Parameter P_9.4.22: Max. Value improved
Parameter P_9.4.24: Min. Value improved
Parameter P_9.4.26: Min. Value improved
Parameter P_9.4.28: Min. Value improved
Parameter P_9.4.30: Min. Value improved
Parameter P_9.4.32: Min. Value improved
Parameter P_9.4.34: Test Condition updated and Max. Value improved
Chapter 9.5:
Content improved
Figure 33:
Content updated
Figure 34:
Content updated
Chapter 9.6:
Content improved
Chapter 9.6.3
added
Chapter 9.7:
Content improved
Chapter 9.7.8:
Descriptions improved and Footnote added
Chapter 9.8 removed. Redundant information
Figure 35:
Content updated
Table 16
updated
BTS54220-LBE
Parameter P_5.3.9: Max. Value improved
Parameter P_5.3.11: Max. Value improved
Parameter P_6.6.24: Max. Value improved
Parameter P_6.6.25: Max. Value improved
Parameter P_6.6.87: Test Condition updated
Parameter P_6.6.88: Test Condition updated
Parameter P_6.6.91: Test Condition updated
Parameter P_6.6.92: Test Condition updated
Table 10
split into different tables
Table 10
to
Table 12:
Unit of
k
ILIS
updated
Parameter P_8.5.91: Max. Value improved
Parameter P_8.5.93: Max. Value improved
Parameter P_8.5.94: Max. Value improved
Data Sheet released
Rev. 1.0, 2013-03-24
All
Trademarks of Infineon Technologies AG
AURIX, BlueMoon, C166, CanPAK, CIPOS, CIPURSE, COMNEON, EconoPACK, CoolMOS,
CoolSET, CORECONTROL, CROSSAVE, DAVE, EasyPIM, EconoBRIDGE, EconoDUAL,
EconoPIM, EiceDRIVER, eupec, FCOS, HITFET, HybridPACK, I²RF, ISOFACE, IsoPACK,
MIPAQ, ModSTACK, my-d, NovalithIC, OmniTune, OptiMOS, ORIGA, PRIMARION,
PrimePACK, PrimeSTACK, PRO-SIL, PROFET, RASIC, ReverSave, SatRIC, SIEGET,
SINDRION, SIPMOS, SMARTi, SmartLEWIS, SOLID FLASH, SPOC, TEMPFET, thinQ!,
TRENCHSTOP, TriCore, X-GOLD, X-PMU, XMM, XPOSYS.
Other Trademarks
Advance Design System (ADS) of Agilent Technologies, AMBA, ARM, MULTI-ICE, KEIL,
PRIMECELL, REALVIEW, THUMB, Vision of ARM Limited, UK. AUTOSAR is licensed by AUTOSAR
Data Sheet
4
Rev. 2.2, 2016-10-10
BTS54220-LBE
development partnership. Bluetooth of Bluetooth SIG Inc. CAT-iq of DECT Forum. COLOSSUS,
FirstGPS of Trimble Navigation Ltd. EMV of EMVCo, LLC (Visa Holdings Inc.). EPCOS of Epcos AG.
FLEXGO of Microsoft Corporation. FlexRay is licensed by FlexRay Consortium. HYPERTERMINAL of
Hilgraeve Incorporated. IEC of Commission Electrotechnique Internationale. IrDA of Infrared Data
Association Corporation. ISO of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB of
MathWorks, Inc. MAXIM of Maxim Integrated Products, Inc. MICROTEC, NUCLEUS of Mentor Graphics
Corporation. Mifare of NXP. MIPI of MIPI Alliance, Inc. MIPS of MIPS Technologies, Inc., USA. muRata
of MURATA MANUFACTURING CO., MICROWAVE OFFICE (MWO) of Applied Wave Research Inc.,
OmniVision of OmniVision Technologies, Inc. Openwave Openwave Systems Inc. RED HAT Red Hat, Inc.
RFMD RF Micro Devices, Inc. SIRIUS of Sirius Satellite Radio Inc. SOLARIS of Sun Microsystems, Inc.
SPANSION of Spansion LLC Ltd. Symbian of Symbian Software Limited. TAIYO YUDEN of Taiyo Yuden
Co. TEAKLITE of CEVA, Inc. TEKTRONIX of Tektronix Inc. TOKO of TOKO KABUSHIKI KAISHA TA.
UNIX of X/Open Company Limited. VERILOG, PALLADIUM of Cadence Design Systems, Inc. VLYNQ
of Texas Instruments Incorporated. VXWORKS, WIND RIVER of WIND RIVER SYSTEMS, INC. ZETEX of
Diodes Zetex Limited.
Last Trademarks Update 2014-03-27
Data Sheet
5
Rev. 2.2, 2016-10-10