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RN1112MFV

产品描述Bipolar Transistors - Pre-Biased 100mA 50volts 22Kohms
产品类别分立半导体    晶体管   
文件大小295KB,共7页
制造商Toshiba(东芝)
官网地址http://toshiba-semicon-storage.com/
标准
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RN1112MFV概述

Bipolar Transistors - Pre-Biased 100mA 50volts 22Kohms

RN1112MFV规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
包装说明SMALL OUTLINE, R-PDSO-F3
针数3
Reach Compliance Codeunknown
ECCN代码EAR99
其他特性BUILT-IN BIAS RESISTOR
最大集电极电流 (IC)0.1 A
集电极-发射极最大电压50 V
配置SINGLE WITH BUILT-IN RESISTOR
最小直流电流增益 (hFE)120
JESD-30 代码R-PDSO-F3
元件数量1
端子数量3
最高工作温度150 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
极性/信道类型NPN
最大功率耗散 (Abs)0.15 W
认证状态Not Qualified
表面贴装YES
端子形式FLAT
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
晶体管应用SWITCHING
晶体管元件材料SILICON
Base Number Matches1

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RN1112MFV,RN1113MFV
TOSHIBA Transistor
Silicon NPN Epitaxial Type (PCT Process)
(Bias Resistor built-in Transistor)
RN1112MFV, RN1113MFV
0.22 ± 0.05
Unit: mm
1.2 ± 0.05
0.32 ± 0.05
0.80 ± 0.05
Switching, Inverter Circuit, Interface Circuit and
Driver Circuit Applications
Ultra-small package, suited to very high density mounting
Incorporating a bias resistor into the transistor reduces the number of
parts, so enabling the manufacture of ever more compact equipment and
lowering assembly cost.
A wide range of resistor values is available for use in various circuits.
Complementary to the RN2112MFV and RN2113MFV
0.8 ± 0.05
1
1.2 ± 0.05
0.4
0.4
1
3
2
0.13 ± 0.05
Equivalent Circuit
0.5 ± 0.05
1. BASE
VESM
2. EMITTER
3. COLLECTOR
Absolute Maximum Ratings
(Ta = 25°C)
Characteristic
Collector-base voltage
Collector-emitter voltage
Emitter-base voltage
Collector current
Collector power dissipation
Junction temperature
Storage temperature range
Symbol
V
CBO
V
CEO
V
EBO
I
C
P
C
(Note 1)
T
j
T
stg
Rating
50
50
5
100
150
150
−55
to 150
Unit
V
V
V
mA
mW
°C
°C
JEDEC
JEITA
TOSHIBA
2-1L1A
Weight: 1.5 mg (typ.)
Note:
Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in temperature, etc.)
may cause this product to decrease in the reliability significantly even if the
operating conditions (i.e. operating temperature/current/voltage, etc.) are
within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Mounted on an FR4 board (25.4 mm
×
25.4 mm
×
1.6 mmt)
Pad Dimension(Reference)
0.5
0.45
Unit:mm
1.15
0.4
0.45
0.4
0.4
Start of commercial production
2005-02
1
2014-03-01

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