
Digital Signal Processors & Controllers - DSP, DSC C6-INTEGRA DSP+ARM PROCESSOR
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 包装说明 | BGA, BGA256,16X16,40 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | S-PBGA-B256 |
| JESD-609代码 | e1 |
| 湿度敏感等级 | 3 |
| 端子数量 | 256 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装等效代码 | BGA256,16X16,40 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 1.2,1.8/3.3 V |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 1 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
| OMAPL137CZKBA3 | OMAPL137CZKBD4 | OMAPL137CZKBT3 | OMAPL137CZKB4 | OMAPL137CZKB3 | |
|---|---|---|---|---|---|
| 描述 | Digital Signal Processors & Controllers - DSP, DSC C6-INTEGRA DSP+ARM PROCESSOR | Digital Signal Processors & Controllers - DSP, DSC C6-Integra DSP+ARM Proc | Digital Signal Processors & Controllers - DSP, DSC C6-INTEGRA DSP+ARM PROCESSOR | Digital Signal Processors & Controllers - DSP, DSC C6-Integra DSP+ARM Proc | Digital Signal Processors & Controllers - DSP, DSC C6-Integra DSP+ARM Proc |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | BGA, BGA256,16X16,40 | BGA, BGA256,16X16,40 | BGA, BGA256,16X16,40 | BGA, BGA256,16X16,40 | BGA, BGA256,16X16,40 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 |
| JESD-609代码 | e1 | e1 | e1 | e1 | e1 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 256 | 256 | 256 | 256 | 256 |
| 最高工作温度 | 85 °C | 70 °C | 105 °C | 70 °C | 70 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | BGA | BGA | BGA |
| 封装等效代码 | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 | BGA256,16X16,40 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 |
| 电源 | 1.2,1.8/3.3 V | 1.2,1.8/3.3 V | 1.2,1.8/3.3 V | 1.2,1.8/3.3 V | 1.2,1.8/3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | OTHER | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 是否无铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 |
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