512KB and 1MB Synchronous Fast Static RAM Module
| 参数名称 | 属性值 |
| 厂商名称 | Motorola ( NXP ) |
| 零件包装代码 | DIMM |
| 包装说明 | DIMM, DIMM168 |
| 针数 | 168 |
| Reach Compliance Code | unknow |
| ECCN代码 | 3A991.B.2.A |
| 最长访问时间 | 10 ns |
| 其他特性 | FLOW-THROUGH ARCHITECTURE |
| JESD-30 代码 | R-XDMA-N168 |
| 内存密度 | 9437184 bi |
| 内存集成电路类型 | SRAM MODULE |
| 内存宽度 | 72 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 168 |
| 字数 | 131072 words |
| 字数代码 | 128000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 128KX72 |
| 输出特性 | 3-STATE |
| 可输出 | YES |
| 封装主体材料 | UNSPECIFIED |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | BICMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | NO LEAD |
| 端子位置 | DUAL |
| MCM72F7DG10 | MCM72F7DG12 | MCM72F6DG9 | MCM72F6DG10 | MCM72F6DG12 | MCM72F6 | |
|---|---|---|---|---|---|---|
| 描述 | 512KB and 1MB Synchronous Fast Static RAM Module | 512KB and 1MB Synchronous Fast Static RAM Module | 512KB and 1MB Synchronous Fast Static RAM Module | 512KB and 1MB Synchronous Fast Static RAM Module | 512KB and 1MB Synchronous Fast Static RAM Module | 512KB and 1MB Synchronous Fast Static RAM Module |
| 厂商名称 | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | - |
| 零件包装代码 | DIMM | - | DIMM | DIMM | DIMM | - |
| 包装说明 | DIMM, DIMM168 | DIMM-168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | - |
| 针数 | 168 | - | 168 | 168 | 168 | - |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | - |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | - |
| 最长访问时间 | 10 ns | 12 ns | 9 ns | 10 ns | 12 ns | - |
| 其他特性 | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | - |
| JESD-30 代码 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | - |
| 内存密度 | 9437184 bi | 9437184 bi | 4718592 bi | 4718592 bi | 4718592 bi | - |
| 内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | - |
| 内存宽度 | 72 | 72 | 72 | 72 | 72 | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | - |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | - |
| 端子数量 | 168 | 168 | 168 | 168 | 168 | - |
| 字数 | 131072 words | 131072 words | 65536 words | 65536 words | 65536 words | - |
| 字数代码 | 128000 | 128000 | 64000 | 64000 | 64000 | - |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | - |
| 组织 | 128KX72 | 128KX72 | 64KX72 | 64KX72 | 64KX72 | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| 可输出 | YES | YES | YES | YES | YES | - |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - |
| 最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | - |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - |
| 表面贴装 | NO | NO | NO | NO | NO | - |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | - |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - |
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