Transient Voltage Suppression Diodes
Surface Mount – 500W > SACB series
SACB Series
Uni-directional
Description
RoHS
Pb
e3
SACB series is designed specifically to protect sensitive
electronic equipment from voltage transients induced by
lightning and other transient voltage events.
Features
Agency Approvals
AGENCY
AGENCY FILE NUMBER
E230531
Maximum Ratings and Thermal Characteristics
(T
A
=25
O
C unless otherwise noted)
Parameter
Peak Pulse Power Dissipation at
T
L
=25
O
C by 10/1000μs Waveform
(fig.1)( Note 1)
Power Dissipation on Infinite Heat
Sink at T
L
=50ºC
Operating Temperature Range
Storage Temperature Range
Symbol
P
PPM
P
D
T
J
T
STG
Value
500
3.0
-65 to 150
-65 to 175
Unit
W
W
°C
°C
Note:
1. Non-repetitive current pulse , per Fig. 3 and derated above T
J
(initial) = 25
O
C per Fig. 2.
• 500W peak pulse power
capability at 10/1000μs
waveform, repetition rate
(duty cycles):0.01%
• For surface mounted
applications in order to
optimize board space
• Low profile package
• Built-in strain relief
• Typical failure mode is
short from over-specified
voltage or current
• Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
• IEC-61000-4-2 ESD
30kV(Air), 30kV (Contact)
• ESD protection of data
lines in accordance with
IEC 61000-4-2
• EFT protection of data
lines in accordance with
IEC 61000-4-4
• V
BR
@ T
J
= V
BR
@25°C
x (1+
α
T x (T
J
- 25))
(
α
T:Temperature
Coefficient, typical value
is 0.1%)
• Glass passivated chip
junction
• Fast response time:
typically less than 1.0ps
from 0V to BV min
• Excellent clamping
capability
• Low incremental surge
resistance
• High temperature
to reflow soldering
guaranteed: 260°C/40sec
• Plastic package is
flammability rated V-0 per
Underwriters Laboratories
• Meet MSL level1, per
J-STD-020, LF maximun
peak of 260
°
C
• Matte tin lead–free plated
• Halogen free and RoHS
compliant
• Pb-free E3 means 2nd
level interconnect is
Pb-free and the terminal
finish material is tin(Sn)
(IPC/JEDEC J-STD-
609A.01)
Additional Infomarion
Applications
TVS devices are ideal for the protection of I/O Interfaces,
V
CC
bus and other vulnerable circuits used in Telecom,
Computer, Industrial and Consumer electronic
applications.
Datasheet
Resources
Samples
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/27/16
Transient Voltage Suppression Diodes
Surface Mount – 500W > SACB series
Electrical Characteristics
(T =25°C unless otherwise noted)
A
Part
Number
Marking
Code
Stand-Off
Voltage V
R
(V)
5.0
6.0
7.0
8.0
8.5
10.0
12.0
15.0
18.0
22.0
26.0
30.0
36.0
45.0
50.0
Maximum
Minimum Maximum Maximum
Maximum
Peak
Clamping
Breakdown Reverse
Junction
Pulse
Voltage at I
T
Leakage at Voltage at Current per Capacitance
I
PP
=5.0A
=1.0MA
at
I
R
@ V
R
(Fig.3)
0 Volts (pF)
(uA)
V
BR
(V)
V
C
(V)
I
PP
(A)
7.60
7.90
8.33
8.89
9.44
11.10
13.30
16.70
20.00
24.40
28.90
33.30
40.00
50.00
55.50
A
A
Working
Inverse
Blocking
Voltage
V
WIB
(V)
75
75
75
75
75
75
75
75
75
75
75
75
75
150
150
Inverse
Blocking Peak Inverse
Leakage
Blocking
Current at Voltage V
PIB
V
WIB
@ I
IB
(V)
(mA)
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
100
100
100
100
100
100
100
100
100
100
100
100
100
200
200
Agency
Approval
SACB5.0
SACB6.0
SACB7.0
SACB8.0
SACB8.5
SACB10
SACB12
SACB15
SACB18
SACB22
SACB26
SACB30
SACB36
SACB45
SACB50
SKE
SKG
SKM
SKR
SKT
SKX
SLE
SLM
SLT
SLX
SME
SMK
SMP
SMV
SMZ
300
300
300
100
50
5
5
5
5
5
5
5
5
5
5
10.0
11.2
12.6
13.4
14.0
16.3
19.0
23.6
28.8
35.4
42.3
48.6
60.0
77.0
88.0
44.0
41.0
38.0
36.0
34.0
29.0
25.0
20.0
15.0
14.0
11.1
10.0
8.6
6.8
5.8
45
45
45
45
45
45
45
45
45
45
45
45
45
45
45
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Ratings and Characteristic Curves
(T =25°C unless otherwise noted
Ratings and Characteristic Curves
(T = 25°C unless otherwise noted)
Figure 1 - Peak Pulse Power Rating Curve
100
Figure 2 - Peak Pulse Power Derating Curve
100
30
Peak Pulse Power (P
PP
) or Current (I
PP
)
Derating in Percentage %
I
PPM
- Peak Pulse Power (kW)
80
60
40
20
0
10
1
P
PK
".5"
td
P
PK
td
µ
Impulse
Exponential
Decay
Half Sine
td=7tp
P
PK
td
Square
0.1
0.001
Current Waveforms
0.01
0.1
1
10
0
t
d
- Pulse Width (ms)
25
50
75
100 125 150
T
J
- Initial Junction Temperature (ºC)
175
Figure 3 - Pulse Waveform
150
I
PPM
- Peak Pulse Current, % I
RSM
tr=10µsec
Peak Value
IPPM
TJ=25°C
Pulse Width(td) is defined
as the point where the peak
current decays to 50% of IPPM
Figure 4 - AC Line Protection Application
100
Half Value
IPPM
IPPM
2
( )
10/1000µsec. Waveform
as defined by R.E.A
50
Low Capacitance
0
td
Application Note:
Device must be used with two
units in parallel, opposite in polarity as shown in
circuit for AC signal line protection.
0
1.0
2.0
t-Time (ms)
3.0
4.0
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/27/16
Transient Voltage Suppression Diodes
Surface Mount – 500W > SACB series
Soldering Parameters
Reflow Condition
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (min to max) (t
s
)
Average ramp up rate (Liquidus Temp (T
A
)
to peak
T
S(max)
to T
A
- Ramp-up Rate
Reflow
- Temperature (T
A
) (Liquidus)
- Time (min to max) (t
s
)
Lead–free
assembly
150°C
Temperature (T)
t
p
Ramp-up
Critical Zone
T
L
to T
P
T
P
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260
+0/-5
°C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
T
L
T
s(max)
t
L
T
s(min)
Ramp-down
Preheat
t
s
25˚C
t 25˚C to Peak
Time (t)
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
Flow/Wave Soldering (Solder Dipping)
Peak Temperature :
Dipping Time :
Soldering :
265
O
C
10 seconds
1 time
Physical Specifications
Weight
Case
Polarity
Terminal
0.003oz., 0.093g
JEDEC DO-214AA molded plastic body
over glass passivated junction.
Color band denotes cathode except
Bidirectional
Matte Tin-plated leads. Solderable per
JESD22-B102.
Environmental Specifications
High Temp. Storage
HTRB
Temperature Cycling
MSL
H3TRB
RSH
JESD22-A103
JESD22-A108
JESD22-A104
JEDEC-J-STD-020, Level 1
JESD22-A101
JESD22-A111
Dimensions
DO-214AA (SMB J-Bend)
Dimensions
Cathode Band
Inches
Min
0.077
0.160
0.130
0.084
0.030
-
0.205
0.006
Max
0.086
0.180
0.155
0.096
0.060
0.008
0.220
0.012
Millimeters
Min
1.950
4.060
3.300
2.130
0.760
-
5.210
0.152
Max
2.200
4.570
3.940
2.440
1.520
0.203
5.590
0.305
A
A
B
H
D
F
G
C
B
C
D
E
F
G
H
E
Dimension in inches and (millimeters)
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/27/16
3
3
Transient Voltage Suppression Diodes
Surface Mount – 500W > SACB series
Part Numbering System
Part Marking System
SACB
Series Type
XX
Cathode Band
F
Stand Off Voltage
Littelfuse Logo
XX
YMXXX
Marking Code
Trace Code Marking
Y:Year Code
M: Month Code
XXX: Lot Code
Packaging
Part number
SACBXX
Component
Package
DO-214AA
Quantity
3000
Packaging
Option
Tape & Reel - 12mm tape/13” reel
Packaging Specification
EIA STD RS-481
Schematic
Transient
Voltage
Suppressor
Diode
Tape and Reel Specification
0.157
(4.0)
0.47
(12.0)
Cathode
0.315
(8.0)
13.0 (330)
0.80 (20.2)
Arbor Hole Dia.
0.059 DIA
(1.5)
Cover tape
Dimensions are in inches
(and millimeters).
0.49
(12.5)
Direction of Feed
© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/27/16
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