Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CERAMIC, PGA-68
| 参数名称 | 属性值 |
| 零件包装代码 | PGA |
| 包装说明 | PGA, |
| 针数 | 68 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 外部数据总线宽度 | 16 |
| JESD-30 代码 | S-CPGA-P68 |
| 端子数量 | 68 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | PGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | PIN/PEG |
| 端子位置 | PERPENDICULAR |
| uPs/uCs/外围集成电路类型 | BIT-SLICE MICROPROCESSOR |
| Base Number Matches | 1 |
| 5962-8995902ZX | 5962-8995903YX | 5962-8995903ZX | 5962-8995901YX | 5962-8995902YX | 5962-8995901XX | 5962-8995901ZX | |
|---|---|---|---|---|---|---|---|
| 描述 | Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CERAMIC, PGA-68 | Bit-Slice Processor, 16-Bit, CMOS, CQCC68, CERAMIC, LCC-68 | Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CERAMIC, PGA-68 | Bit-Slice Processor, 16-Bit, CMOS, CQCC68, CERAMIC, LCC-68 | Bit-Slice Processor, 16-Bit, CMOS, CQCC68, CERAMIC, LCC-68 | Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CERAMIC, PGA-68 | Bit-Slice Processor, 16-Bit, CMOS, CPGA68, CERAMIC, PGA-68 |
| 零件包装代码 | PGA | LCC | PGA | LCC | LCC | PGA | PGA |
| 包装说明 | PGA, | QCCN, | PGA, | QCCN, | QCCN, | PGA, | PGA, |
| 针数 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 外部数据总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| JESD-30 代码 | S-CPGA-P68 | S-CQCC-N68 | S-CPGA-P68 | S-CQCC-N68 | S-CQCC-N68 | R-CPGA-P68 | S-CPGA-P68 |
| 端子数量 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | PGA | QCCN | PGA | QCCN | QCCN | PGA | PGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | GRID ARRAY | CHIP CARRIER | GRID ARRAY | CHIP CARRIER | CHIP CARRIER | GRID ARRAY | GRID ARRAY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | PIN/PEG | NO LEAD | PIN/PEG | NO LEAD | NO LEAD | PIN/PEG | PIN/PEG |
| 端子位置 | PERPENDICULAR | QUAD | PERPENDICULAR | QUAD | QUAD | PERPENDICULAR | PERPENDICULAR |
| uPs/uCs/外围集成电路类型 | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR | BIT-SLICE MICROPROCESSOR |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
嵌入式系统
模拟与混合信号
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嵌入式系统
FPGA/CPLD
嵌入式系统
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