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HCF4008BC1: 产品描述4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT; 产品类别逻辑逻辑; 文件大小277KB，共13页; 制造商ST(意法半导体); 官网地址http://www.st.com/; 标准

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HCF4008BC1概述

4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT

HCF4008BC1规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	ST(意法半导体)
零件包装代码	QLCC
包装说明	PLASTIC, LCC-20
针数	20
Reach Compliance Code	compliant
其他特性	FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING
系列	4000/14000/40000
JESD-30 代码	S-PQCC-J20
JESD-609代码	e3
长度	8.9662 mm
负载电容（CL）	50 pF
逻辑集成电路类型	ADDER/SUBTRACTOR
位数	4
功能数量	1
端子数量	20
最高工作温度	85 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	QCCJ
封装等效代码	LDCC20,.4SQ
封装形状	SQUARE
封装形式	CHIP CARRIER
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	3/15 V
传播延迟（tpd）	800 ns
认证状态	Not Qualified
座面最大高度	4.57 mm
最大供电电压 (Vsup)	15 V
最小供电电压 (Vsup)	3 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Matte Tin (Sn)
端子形式	J BEND
端子节距	1.27 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	8.9662 mm
Base Number Matches	1

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HCC/HCF4008B

4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT

4 SUM OUTPUTS PLUS PARALLEL LOOK-

AHERD CARRY-OUTPUT

HIGH-SPEED OPERATION-SUM IN-TO-SUM

OUT 160ns (typ.) : CARRY IN-TO-CARRY OUT

50ns (typ.) AT V

= 10V, C

= 50pF

QUIESCENT CURRENT SPECIFIED TO 20V

FOR HCC DEVICE

INPUT CURRENT OF 100nA AT 18V AND 25°C

FOR HCC DEVICE

100% TESTED FOR QUIESCENT CURRENT

5V, 10V, AND 15V PARAMETRIC RATING

MEETS ALL REQUIREMENTS OF JEDEC TEN-

TATIVE STANDARD N° 13A, ”STANDARD SPE-

CIFICATIONS FOR DESCRIPTION OF ”B”

SERIES CMOS DEVICES”

(Plastic Package)

(Ceramic Frit Seal Package)

(Micro Package)

(Plastic Chip Carrier)

ORDER CODES :

HCC4008BF

HCF4008BM1

HCF4008BEY

HCF4008BC1

PIN CONNECTIONS

DESCRIPTION

The

HCC4008B

(extended temperature range) and

HCF4008B

(intermediate temperature range) are

monolithic integrated circuits, available in 16-lead

dual in-line plastic or ceramic package and plastic

micropackage.

The

HCC/HCF4008B

types consist of four full adder

stages with fast look ahead carry provision from

stage to stage. Circuitry is included to provide a fast

”parallel-carry-out” to permit high-speed operation

in arithmetic sections using several HCC/HCF

4008B’s.

HCC/HCF4008B

inputs include the four sets of bits

to be added, A

to A

and B

to B

, in addition to the

”Carry In” bit from a previous section.

HCC/HCF4008B

outputs include the four sum bits,

to S

. In addition to the high speed ”parallel-carry-

out” which may be utilized at a succeeding

HCC/HCF4008B

section.

June 1989

1/13

HCF4008BC1相似产品对比

	HCF4008BC1	HCC4008BF	HCF4008B	HCF4008BEY	HCF4008BM1
描述	4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT	4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT	4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT	4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT	4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT
是否Rohs认证	符合	不符合	-	符合	符合
厂商名称	ST(意法半导体)	ST(意法半导体)	-	ST(意法半导体)	ST(意法半导体)
零件包装代码	QLCC	DIP	-	DIP	SOIC
包装说明	PLASTIC, LCC-20	FRIT SEALED, CERAMIC, DIP-16	-	PLASTIC, DIP-16	SOP-16
针数	20	16	-	16	16
Reach Compliance Code	compliant	not_compliant	-	compliant	compliant
其他特性	FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING	FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING	-	FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING	FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING
系列	4000/14000/40000	4000/14000/40000	-	4000/14000/40000	4000/14000/40000
JESD-30 代码	S-PQCC-J20	R-GDIP-T16	-	R-PDIP-T16	R-PDSO-G16
JESD-609代码	e3	e0	-	e3	e4
负载电容（CL）	50 pF	50 pF	-	50 pF	50 pF
逻辑集成电路类型	ADDER/SUBTRACTOR	ADDER/SUBTRACTOR	-	ADDER/SUBTRACTOR	ADDER/SUBTRACTOR
位数	4	4	-	4	4
功能数量	1	1	-	1	1
端子数量	20	16	-	16	16
最高工作温度	85 °C	125 °C	-	125 °C	125 °C
最低工作温度	-40 °C	-55 °C	-	-55 °C	-55 °C
封装主体材料	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	-	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	QCCJ	DIP	-	DIP	SOP
封装等效代码	LDCC20,.4SQ	DIP16,.3	-	DIP16,.3	SOP16,.25
封装形状	SQUARE	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
封装形式	CHIP CARRIER	IN-LINE	-	IN-LINE	SMALL OUTLINE
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	-
电源	3/15 V	3/18 V	-	3/15 V	3/15 V
传播延迟（tpd）	800 ns	800 ns	-	800 ns	800 ns
认证状态	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
座面最大高度	4.57 mm	5.08 mm	-	5.1 mm	1.75 mm
最大供电电压 (Vsup)	15 V	18 V	-	20 V	20 V
最小供电电压 (Vsup)	3 V	3 V	-	3 V	3 V
标称供电电压 (Vsup)	5 V	5 V	-	5 V	5 V
表面贴装	YES	NO	-	NO	YES
技术	CMOS	CMOS	-	CMOS	CMOS
温度等级	INDUSTRIAL	MILITARY	-	MILITARY	MILITARY
端子面层	Matte Tin (Sn)	Tin/Lead (Sn/Pb)	-	Matte Tin (Sn)	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式	J BEND	THROUGH-HOLE	-	THROUGH-HOLE	GULL WING
端子节距	1.27 mm	2.54 mm	-	2.54 mm	1.27 mm
端子位置	QUAD	DUAL	-	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	-
宽度	8.9662 mm	7.62 mm	-	7.62 mm	3.9 mm
Base Number Matches	1	1	-	1	1

HCF4008BC1

HCF4008BC1概述

HCF4008BC1规格参数

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