4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT
| HCF4008B | HCC4008BF | HCF4008BC1 | HCF4008BEY | HCF4008BM1 | |
|---|---|---|---|---|---|
| 描述 | 4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT | 4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT | 4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT | 4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT | 4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT |
| 是否Rohs认证 | - | 不符合 | 符合 | 符合 | 符合 |
| 厂商名称 | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| 零件包装代码 | - | DIP | QLCC | DIP | SOIC |
| 包装说明 | - | FRIT SEALED, CERAMIC, DIP-16 | PLASTIC, LCC-20 | PLASTIC, DIP-16 | SOP-16 |
| 针数 | - | 16 | 20 | 16 | 16 |
| Reach Compliance Code | - | not_compliant | compliant | compliant | compliant |
| 其他特性 | - | FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING | FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING | FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING | FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING |
| 系列 | - | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
| JESD-30 代码 | - | R-GDIP-T16 | S-PQCC-J20 | R-PDIP-T16 | R-PDSO-G16 |
| JESD-609代码 | - | e0 | e3 | e3 | e4 |
| 负载电容（CL） | - | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | - | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR |
| 位数 | - | 4 | 4 | 4 | 4 |
| 功能数量 | - | 1 | 1 | 1 | 1 |
| 端子数量 | - | 16 | 20 | 16 | 16 |
| 最高工作温度 | - | 125 °C | 85 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -55 °C | -40 °C | -55 °C | -55 °C |
| 封装主体材料 | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | DIP | QCCJ | DIP | SOP |
| 封装等效代码 | - | DIP16,.3 | LDCC20,.4SQ | DIP16,.3 | SOP16,.25 |
| 封装形状 | - | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | IN-LINE | CHIP CARRIER | IN-LINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | - | 3/18 V | 3/15 V | 3/15 V | 3/15 V |
| 传播延迟（tpd） | - | 800 ns | 800 ns | 800 ns | 800 ns |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 5.08 mm | 4.57 mm | 5.1 mm | 1.75 mm |
| 最大供电电压 (Vsup) | - | 18 V | 15 V | 20 V | 20 V |
| 最小供电电压 (Vsup) | - | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | - | NO | YES | NO | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | MILITARY | INDUSTRIAL | MILITARY | MILITARY |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | - | THROUGH-HOLE | J BEND | THROUGH-HOLE | GULL WING |
| 端子节距 | - | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | - | DUAL | QUAD | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | - | 7.62 mm | 8.9662 mm | 7.62 mm | 3.9 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 |
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