FIFO, 1KX36, 11ns, Synchronous, CMOS, PQFP132, PLASTIC, QFP-132
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | QFP |
包装说明 | PLASTIC, QFP-132 |
针数 | 132 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
最长访问时间 | 11 ns |
其他特性 | MAIL BOX; RETRANSMIT |
最大时钟频率 (fCLK) | 66.7 MHz |
周期时间 | 15 ns |
JESD-30 代码 | S-PQFP-G132 |
JESD-609代码 | e0 |
长度 | 24.13 mm |
内存密度 | 36864 bit |
内存集成电路类型 | OTHER FIFO |
内存宽度 | 36 |
湿度敏感等级 | 3 |
功能数量 | 1 |
端子数量 | 132 |
字数 | 1024 words |
字数代码 | 1000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 1KX36 |
输出特性 | 3-STATE |
可输出 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | BQFP |
封装等效代码 | SPQFP132,1.1SQ |
封装形状 | SQUARE |
封装形式 | FLATPACK, BUMPER |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 225 |
电源 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 4.57 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | GULL WING |
端子节距 | 0.635 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 20 |
宽度 | 24.13 mm |
Base Number Matches | 1 |
IDT723641L15PQF | IDT723641L20PF | IDT723641L20PFI | IDT723651L15PQF | IDT723641L20PQFI | IDT723631L15PQF | |
---|---|---|---|---|---|---|
描述 | FIFO, 1KX36, 11ns, Synchronous, CMOS, PQFP132, PLASTIC, QFP-132 | FIFO, 1KX36, 13ns, Synchronous, CMOS, PQFP120, TQFP-120 | FIFO, 1KX36, 13ns, Synchronous, CMOS, PQFP120, TQFP-120 | FIFO, 2KX36, 11ns, Synchronous, CMOS, PQFP132, PLASTIC, QFP-132 | FIFO, 1KX36, 13ns, Synchronous, CMOS, PQFP132, PLASTIC, QFP-132 | FIFO, 512X36, 11ns, Synchronous, CMOS, PQFP132, PLASTIC, QFP-132 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP |
包装说明 | PLASTIC, QFP-132 | TQFP-120 | TQFP-120 | PLASTIC, QFP-132 | PLASTIC, QFP-132 | BQFP, SPQFP132,1.1SQ |
针数 | 132 | 120 | 120 | 132 | 132 | 132 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 11 ns | 13 ns | 13 ns | 11 ns | 13 ns | 11 ns |
其他特性 | MAIL BOX; RETRANSMIT | MAIL BOX; RETRANSMIT | MAIL BOX; RETRANSMIT | MAIL BOX; RETRANSMIT | MAIL BOX; RETRANSMIT | MAIL BOX; RETRANSMIT |
最大时钟频率 (fCLK) | 66.7 MHz | 50 MHz | 50 MHz | 66.7 MHz | 50 MHz | 66.7 MHz |
周期时间 | 15 ns | 20 ns | 20 ns | 15 ns | 20 ns | 15 ns |
JESD-30 代码 | S-PQFP-G132 | S-PQFP-G120 | S-PQFP-G120 | S-PQFP-G132 | S-PQFP-G132 | S-PQFP-G132 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 24.13 mm | 14 mm | 14 mm | 24.13 mm | 24.13 mm | 24.13 mm |
内存密度 | 36864 bit | 36864 bit | 36864 bit | 73728 bit | 36864 bit | 18432 bit |
内存集成电路类型 | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
内存宽度 | 36 | 36 | 36 | 36 | 36 | 36 |
湿度敏感等级 | 3 | 4 | 4 | 3 | 3 | 3 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 132 | 120 | 120 | 132 | 132 | 132 |
字数 | 1024 words | 1024 words | 1024 words | 2048 words | 1024 words | 512 words |
字数代码 | 1000 | 1000 | 1000 | 2000 | 1000 | 512 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C |
组织 | 1KX36 | 1KX36 | 1KX36 | 2KX36 | 1KX36 | 512X36 |
可输出 | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | BQFP | LFQFP | LFQFP | BQFP | BQFP | BQFP |
封装等效代码 | SPQFP132,1.1SQ | QFP120,.63SQ,16 | QFP120,.63SQ,16 | SPQFP132,1.1SQ | SPQFP132,1.1SQ | SPQFP132,1.1SQ |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, BUMPER | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, BUMPER | FLATPACK, BUMPER | FLATPACK, BUMPER |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | 225 | 240 | 240 | 225 | 225 | 225 |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.57 mm | 1.6 mm | 1.6 mm | 4.57 mm | 4.57 mm | 4.57 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.635 mm | 0.4 mm | 0.4 mm | 0.635 mm | 0.635 mm | 0.635 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 20 | 20 | 20 | 20 | 20 | 20 |
宽度 | 24.13 mm | 14 mm | 14 mm | 24.13 mm | 24.13 mm | 24.13 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
输出特性 | 3-STATE | 3-STATE | - | 3-STATE | - | 3-STATE |
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