NXP Semiconductors
Data Sheet: Technical Data
K22P121M120SF7
Rev. 7.1, 08/2016
Kinetis K22F 512KB Flash
120 MHz ARM® Cortex®-M4 Based Microcontroller with FPU
The Kinetis K22 product family members are optimized for cost-
sensitive applications requiring low-power, USB connectivity, and
processing efficiency and high peripheral integration with a
floating point unit. These devices share the comprehensive
enablement and scalability of the Kinetis family.
This product offers:
• Run power consumption down to 156 µA/MHz and static
power consumption down to 3.8 µA, full state retention and
6 µS wakeup. Lowest static mode down to 140 nA.
• USB LS/FS OTG 2.0 with embedded 3.3 V, 120 mA LDO
voltage regulator. USB FS device crystal-less functionality.
MK22FN512VDC12
MK22FN512VLL12
MK22FN512VLH12
MK22FN512VMP12
MK22FN512VFX12
100 & 64 LQFP(LL&LH)
121 XFBGA (DC)
14x14x1.4 mm P .5(LL)
8 x 8 x 0.5 mm P .65
10x10x1.4 mm P .5(LH)
64 MAPBGA (MP)
5 x 5 x 1.2 mm P .5
88 QFN (FX)
10 x 10 x 0.9 mm P .4
Performance
• 120 MHz ARM Cortex-M4 core with DSP instructions
delivering 1.25 Dhrystone MIPS per MHz
Memories and memory interfaces
• 512 KB of embedded flash and 128 KB of RAM
• FlexBus external bus interface
1
• Serial programming interface (EzPort)
• Preprogrammed Kinetis flashloader for one-time, in-
system factory programming
Timers
• Two 8-ch general purpose/PWM timers
• Two 2-ch general purpose timers with quadrature
decoder functionality
• Periodic interrupt timers
• 16-bit low-power timer
• Real-time clock with independent power domain
• Programmable delay block
Security and integrity modules
• Hardware CRC module
• 128-bit unique identification (ID) number per chip
• Hardware random-number generator
• Flash access control to protect proprietary software
Operating Characteristics
• Voltage range (including flash writes): 1.71 to 3.6 V
• Temperature range (ambient): -40 to 105°C
Analog modules
• Two 16-bit SAR ADCs (1.2 MS/s in 12bit mode)
• Two 12-bit DACs
2
• Two analog comparators (CMP) with 6-bit DAC
• Accurate internal voltage reference
System peripherals
• Flexible low-power modes, multiple wake-up
sources
• 16-channel DMA controller
• Independent external and software watchdog
monitor
Clocks
• Two crystal oscillators: 32 kHz (RTC) and 32-40 kHz
or 3-32 MHz
• Three internal oscillators: 32 kHz, 4 MHz, & 48 MHz
• Multipurpose clock generator with PLL and FLL
Communication interfaces
• USB full/low-speed On-the-Go controller
• USB full-speed device crystal-less operation
• Two SPI modules and I2S module
• Three UART modules and one low-power UART
• Two I2C: Support for up to 1 Mbps operation
Human-machine interface
• Up to 81 general-purpose I/O (GPIO)
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
1. MK22FN512VFX12 (88QFN) does not support the FlexBus function.
2. MK22FN512VFX12 (88QFN) does not support the DAC1 function.
Ordering Information
Part Number
Flash (KB)
MK22FN512VDC12
MK22FN512VLL12
MK22FN512VLH12
MK22FN512VMP12
MK22FN512VFX12
512
512
512
512
512
Memory
SRAM (KB)
128
128
128
128
128
81
66
40
40
60
Maximum number of I/O's
Device Revision Number
Device Mask Set Number
0N50M
0001
SIM_SDID[REVID]
JTAG ID Register[PRN]
0001
Related Resources
Type
Selector Guide
Product Brief
Reference
Manual
Data Sheet
Chip Errata
Description
The NXP Solution Advisor is a web-based tool that features interactive
application wizards and a dynamic product selector
Document
KINETISKMCUSELGD
The Product Brief contains concise overview/summary information to enable
K22FPB
quick evaluation of a device for design suitability.
The Reference Manual contains a comprehensive description of the
structure and function (operation) of a device.
The Data Sheet is this document. It includes electrical characteristics and
signal connections.
The chip mask set Errata provides additional or corrective information for a
particular device mask set.
K22P121M120SF7RM
K22P121M120SF7
KINETIS_K_xN50M
1
Package drawing:
•
98ASA00595D
•
98ASS23308W
•
98ASS23234W
•
98ASA00420D
•
98ASA00935D
Electrical Connection
Recommendations for the
Exposed Pad on QFN and
DFN Packages.
Package drawing Package dimensions are provided by part number:
• MK22FN512VDC12
• MK22FN512VLL12
• MK22FN512VLH12
• MK22FN512VMP12
• MK22FN512VFX12
Engineering
Bulletin
This engineering bulletin gives connection recommendations specifically for
microcontrollers in DFN and QFN packages.
1. To find the associated resource, go to
nxp.com
and perform a search using this term with the
x
replaced by the revision
of the device you are using.
Figure 1
shows the functional modules in the chip.
2
NXP Semiconductors
Kinetis K22F 512KB Flash, Rev. 7.1, 08/2016
ARM
®
Cortex™-M4
Core
System
DMA (16ch)
Memories and Memory Interfaces
Clocks
Program
flash
(512 KB)
FlexBus
RAM
(128 KB)
Phase-
locked loop
Frequency-
locked loop
Low/high
frequency
oscillators
Internal
reference
clocks
Human-Machine
Interface (HMI)
Up to
81 GPIOs
Debug
interfaces
Interrupt
contoller
DSP
Low-leakage
wakeup
Internal
and external
watchdogs
FPU
Serial
programming
interface
(EzPort)
Security
and Integrity
CRC
Analog
Timers
Communication Interfaces
2
I C
x2
UART
x3
LPUART
x1
2
I S
16-bit
ADC x2
Comparator
with 6-bit DAC
x2
12-bit DAC
x2
High
performance
voltage ref
Timers
x2 (8ch)
x2 (2ch)
Programmable
delay block
Periodic
interrupt
timers
16-bit
low-power
timer
Independent
real-time
clock
Random
number
generator
Flash access
control
USB OTG
LS/FS
USB LS/FS
transceiver
SPI
x2
USB voltage
regulator
Figure 1. Functional block diagram
Kinetis K22F 512KB Flash, Rev. 7.1, 08/2016
3
NXP Semiconductors
Table of Contents
1 Ratings.................................................................................... 5
1.1 Thermal handling ratings................................................. 5
1.2 Moisture handling ratings................................................ 5
1.3 ESD handling ratings....................................................... 5
1.4 Voltage and current operating ratings............................. 5
2 General................................................................................... 6
2.1 AC electrical characteristics.............................................6
2.2 Nonswitching electrical specifications..............................6
2.2.1 Voltage and current operating requirements....... 6
2.2.2 LVD and POR operating requirements................7
2.2.3 Voltage and current operating behaviors.............8
2.2.4 Power mode transition operating behaviors........ 9
2.2.5 Power consumption operating behaviors............ 10
2.2.6 EMC radiated emissions operating behaviors..... 17
2.2.7 Designing with radiated emissions in mind..........18
2.2.8 Capacitance attributes.........................................18
2.3 Switching specifications...................................................18
2.3.1 Device clock specifications..................................18
2.3.2 General switching specifications......................... 19
2.4 Thermal specifications..................................................... 20
2.4.1 Thermal operating requirements......................... 20
2.4.2 Thermal attributes................................................20
2.4.3 Thermal attributes for 88 QFN.............................21
3 Peripheral operating requirements and behaviors.................. 22
3.1 Core modules.................................................................. 22
3.1.1 SWD electricals .................................................. 22
3.1.2 JTAG electricals.................................................. 23
3.2 System modules.............................................................. 26
3.3 Clock modules................................................................. 26
3.3.1 MCG specifications..............................................26
3.3.2
3.3.3
3.3.4
IRC48M specifications.........................................29
Oscillator electrical specifications........................29
32 kHz oscillator electrical characteristics........... 32
3.6 Analog............................................................................. 38
3.6.1 ADC electrical specifications............................... 39
3.6.2 CMP and 6-bit DAC electrical specifications....... 43
3.6.3 12-bit DAC electrical characteristics....................45
3.6.4 Voltage reference electrical specifications.......... 48
3.7 Timers..............................................................................49
3.8 Communication interfaces............................................... 49
3.8.1 USB electrical specifications............................... 50
3.8.2 USB VREG electrical specifications.................... 50
3.8.3 DSPI switching specifications (limited voltage
range).................................................................. 51
3.8.4 DSPI switching specifications (full voltage
range).................................................................. 53
3.8.5 Inter-Integrated Circuit Interface (I2C) timing...... 54
3.8.6 UART switching specifications............................ 56
3.8.7 I2S/SAI switching specifications.......................... 56
4 Dimensions............................................................................. 62
4.1 Obtaining package dimensions....................................... 62
5 Pinout...................................................................................... 63
5.1 K22F Signal Multiplexing and Pin Assignments.............. 63
5.2 Recommended connection for unused analog and
digital pins........................................................................69
5.3 K22 Pinouts..................................................................... 70
6 Part identification.....................................................................75
6.1 Description.......................................................................75
6.2 Format............................................................................. 75
6.3 Fields............................................................................... 76
6.4 Example...........................................................................76
6.5 121-pin XFBGA part marking.......................................... 77
6.6 64-pin MAPBGA part marking......................................... 77
7 Terminology and guidelines.................................................... 77
7.1 Definitions........................................................................ 77
7.2 Examples......................................................................... 78
7.3 Typical-value conditions.................................................. 78
7.4 Relationship between ratings and operating
requirements....................................................................79
7.5 Guidelines for ratings and operating requirements..........79
8 Revision History...................................................................... 79
3.4 Memories and memory interfaces................................... 32
3.4.1 Flash electrical specifications.............................. 32
3.4.2 EzPort switching specifications........................... 34
3.4.3 Flexbus switching specifications..........................35
3.5 Security and integrity modules........................................ 38
4
NXP Semiconductors
Kinetis K22F 512KB Flash, Rev. 7.1, 08/2016
Ratings
1 Ratings
1.1 Thermal handling ratings
Symbol
T
STG
T
SDR
Description
Storage temperature
Solder temperature, lead-free
Min.
–55
—
Max.
150
260
Unit
°C
°C
Notes
1
2
1. Determined according to JEDEC Standard JESD22-A103,
High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.2 Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
—
Max.
3
Unit
—
Notes
1
1. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.3 ESD handling ratings
Symbol
V
HBM
V
CDM
I
LAT
Description
Electrostatic discharge voltage, human body model
Electrostatic discharge voltage, charged-device
model
Latch-up current at ambient temperature of 105°C
Min.
-2000
-500
-100
Max.
+2000
+500
+100
Unit
V
V
mA
Notes
1
2
3
1. Determined according to JEDEC Standard JESD22-A114,
Electrostatic Discharge (ESD) Sensitivity Testing Human
Body Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101,
Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
3. Determined according to JEDEC Standard JESD78,
IC Latch-Up Test.
1.4 Voltage and current operating ratings
Kinetis K22F 512KB Flash, Rev. 7.1, 08/2016
5
NXP Semiconductors
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