Datasheet> 器件分类 > 半导体> 嵌入式处理器和控制器> MK22FN512VDC12

MK22FN512VDC12: 产品描述RF Connectors / Coaxial Connectors U.FL RECEPTACLE SMT GLD M CONTACT; 产品类别半导体嵌入式处理器和控制器; 文件大小1MB，共82页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com

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MK22FN512VDC12概述

RF Connectors / Coaxial Connectors U.FL RECEPTACLE SMT GLD M CONTACT

MK22FN512VDC12规格参数

参数名称	属性值
产品种类 Product Category	ARM Microcontrollers - MCU
制造商 Manufacturer	NXP(恩智浦)
RoHS	Details
安装风格 Mounting Style	SMD/SMT
封装 / 箱体 Package / Case	BGA-121
Core	ARM Cortex M4
Data Bus Width	32 bit/16 bit
Maximum Clock Frequency	120 MHz
Program Memory Size	512 kB
Data RAM Size	128 kB
ADC Resolution	16 bit
Number of I/Os	81 I/O
工作电源电压 Operating Supply Voltage	1.71 V to 3.6 V
最大工作温度 Maximum Operating Temperature	+ 105 C
Analog Supply Voltage	1.71 V to 3.6 V
Data RAM Type	SRAM
I/O Voltage	1.71 V to 3.6 V
接口类型 Interface Type	DSPI, I2C, I2S, LPUART, USB
最小工作温度 Minimum Operating Temperature	- 40 C
Moisture Sensitive	Yes
Number of ADC Channels	2
Number of Timers/Counters	4 Timer
Processor Series	K22F
Program Memory Type	Flash
工厂包装数量 Factory Pack Quantity	348
电源电压-最大 Supply Voltage - Max	3.6 V
电源电压-最小 Supply Voltage - Min	1.71 V
单位重量 Unit Weight	0.001901 oz

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NXP Semiconductors

Data Sheet: Technical Data

K22P121M120SF7

Rev. 7.1, 08/2016

Kinetis K22F 512KB Flash

120 MHz ARM® Cortex®-M4 Based Microcontroller with FPU

The Kinetis K22 product family members are optimized for cost-

sensitive applications requiring low-power, USB connectivity, and

processing efficiency and high peripheral integration with a

floating point unit. These devices share the comprehensive

enablement and scalability of the Kinetis family.

This product offers:

• Run power consumption down to 156 µA/MHz and static

power consumption down to 3.8 µA, full state retention and

6 µS wakeup. Lowest static mode down to 140 nA.

• USB LS/FS OTG 2.0 with embedded 3.3 V, 120 mA LDO

voltage regulator. USB FS device crystal-less functionality.

MK22FN512VDC12

MK22FN512VLL12

MK22FN512VLH12

MK22FN512VMP12

MK22FN512VFX12

100 & 64 LQFP(LL&LH)

121 XFBGA (DC)

14x14x1.4 mm P .5(LL)

8 x 8 x 0.5 mm P .65

10x10x1.4 mm P .5(LH)

64 MAPBGA (MP)

5 x 5 x 1.2 mm P .5

88 QFN (FX)

10 x 10 x 0.9 mm P .4

Performance

• 120 MHz ARM Cortex-M4 core with DSP instructions

delivering 1.25 Dhrystone MIPS per MHz

Memories and memory interfaces

• 512 KB of embedded flash and 128 KB of RAM

• FlexBus external bus interface

• Serial programming interface (EzPort)

• Preprogrammed Kinetis flashloader for one-time, in-

system factory programming

Timers

• Two 8-ch general purpose/PWM timers

• Two 2-ch general purpose timers with quadrature

decoder functionality

• Periodic interrupt timers

• 16-bit low-power timer

• Real-time clock with independent power domain

• Programmable delay block

Security and integrity modules

• Hardware CRC module

• 128-bit unique identification (ID) number per chip

• Hardware random-number generator

• Flash access control to protect proprietary software

Operating Characteristics

• Voltage range (including flash writes): 1.71 to 3.6 V

• Temperature range (ambient): -40 to 105°C

Analog modules

• Two 16-bit SAR ADCs (1.2 MS/s in 12bit mode)

• Two 12-bit DACs

• Two analog comparators (CMP) with 6-bit DAC

• Accurate internal voltage reference

System peripherals

• Flexible low-power modes, multiple wake-up

sources

• 16-channel DMA controller

• Independent external and software watchdog

monitor

Clocks

• Two crystal oscillators: 32 kHz (RTC) and 32-40 kHz

or 3-32 MHz

• Three internal oscillators: 32 kHz, 4 MHz, & 48 MHz

• Multipurpose clock generator with PLL and FLL

Communication interfaces

• USB full/low-speed On-the-Go controller

• USB full-speed device crystal-less operation

• Two SPI modules and I2S module

• Three UART modules and one low-power UART

• Two I2C: Support for up to 1 Mbps operation

Human-machine interface

• Up to 81 general-purpose I/O (GPIO)

NXP reserves the right to change the production detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ratings.................................................................................... 5

1.1 Thermal handling ratings................................................. 5

1.2 Moisture handling ratings................................................ 5

1.3 ESD handling ratings....................................................... 5

1.4 Voltage and current operating ratings............................. 5

2 General................................................................................... 6

2.1 AC electrical characteristics.............................................6

2.2 Nonswitching electrical specifications..............................6

2.2.1 Voltage and current operating requirements....... 6

2.2.2 LVD and POR operating requirements................7

2.2.3 Voltage and current operating behaviors.............8

2.2.4 Power mode transition operating behaviors........ 9

2.2.5 Power consumption operating behaviors............ 10

2.2.6 EMC radiated emissions operating behaviors..... 17

2.2.7 Designing with radiated emissions in mind..........18

2.2.8 Capacitance attributes.........................................18

2.3 Switching specifications...................................................18

2.3.1 Device clock specifications..................................18

2.3.2 General switching specifications......................... 19

2.4 Thermal specifications..................................................... 20

2.4.1 Thermal operating requirements......................... 20

2.4.2 Thermal attributes................................................20

2.4.3 Thermal attributes for 88 QFN.............................21

3 Peripheral operating requirements and behaviors.................. 22

3.1 Core modules.................................................................. 22

3.1.1 SWD electricals .................................................. 22

3.1.2 JTAG electricals.................................................. 23

3.2 System modules.............................................................. 26

3.3 Clock modules................................................................. 26

3.3.1 MCG specifications..............................................26

3.3.2

3.3.3

3.3.4

IRC48M specifications.........................................29

Oscillator electrical specifications........................29

32 kHz oscillator electrical characteristics........... 32

3.6 Analog............................................................................. 38

3.6.1 ADC electrical specifications............................... 39

3.6.2 CMP and 6-bit DAC electrical specifications....... 43

3.6.3 12-bit DAC electrical characteristics....................45

3.6.4 Voltage reference electrical specifications.......... 48

3.7 Timers..............................................................................49

3.8 Communication interfaces............................................... 49

3.8.1 USB electrical specifications............................... 50

3.8.2 USB VREG electrical specifications.................... 50

3.8.3 DSPI switching specifications (limited voltage

range).................................................................. 51

3.8.4 DSPI switching specifications (full voltage

range).................................................................. 53

3.8.5 Inter-Integrated Circuit Interface (I2C) timing...... 54

3.8.6 UART switching specifications............................ 56

3.8.7 I2S/SAI switching specifications.......................... 56

4 Dimensions............................................................................. 62

4.1 Obtaining package dimensions....................................... 62

5 Pinout...................................................................................... 63

5.1 K22F Signal Multiplexing and Pin Assignments.............. 63

5.2 Recommended connection for unused analog and

digital pins........................................................................69

5.3 K22 Pinouts..................................................................... 70

6 Part identification.....................................................................75

6.1 Description.......................................................................75

6.2 Format............................................................................. 75

6.3 Fields............................................................................... 76

6.4 Example...........................................................................76

6.5 121-pin XFBGA part marking.......................................... 77

6.6 64-pin MAPBGA part marking......................................... 77

7 Terminology and guidelines.................................................... 77

7.1 Definitions........................................................................ 77

7.2 Examples......................................................................... 78

7.3 Typical-value conditions.................................................. 78

7.4 Relationship between ratings and operating

requirements....................................................................79

7.5 Guidelines for ratings and operating requirements..........79

8 Revision History...................................................................... 79

3.4 Memories and memory interfaces................................... 32

3.4.1 Flash electrical specifications.............................. 32

3.4.2 EzPort switching specifications........................... 34

3.4.3 Flexbus switching specifications..........................35

3.5 Security and integrity modules........................................ 38