Power Switch ICs - Power Distribution
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
零件包装代码 | QFN |
包装说明 | 3 X 3 MM, 0.80 MM HEIGHT, THIN, EXPOSED PAD, MO-220, QFN-6 |
针数 | 6 |
Reach Compliance Code | not_compliant |
模拟集成电路 - 其他类型 | ANALOG CIRCUIT |
JESD-30 代码 | S-XDSO-N6 |
JESD-609代码 | e0 |
长度 | 3 mm |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 6 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | UNSPECIFIED |
封装代码 | HVSON |
封装等效代码 | SOLCC6,.11,37 |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 240 |
电源 | 2.5/5 V |
认证状态 | Not Qualified |
座面最大高度 | 0.8 mm |
最大供电电流 (Isup) | 0.16 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 2.3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | NO LEAD |
端子节距 | 0.95 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 20 |
宽度 | 3 mm |
Base Number Matches | 1 |
MAX4792ETT-T | MAX4792EUS-T | MAX4789EUK-T | MAX4789EUS | MAX4791EUK-V-T | MAX4793EUS-T | MAX4791ETT-T | MAX4789EUS-T | |
---|---|---|---|---|---|---|---|---|
描述 | Power Switch ICs - Power Distribution | Power Switch ICs - Power Distribution | Power Switch ICs - Power Distribution 200mA/250mA/300mA Current-Limit Switches | Power Switch ICs - Power Distribution MAX4789EUS | Power Switch ICs - Power Distribution 200/250/300mA Crnt Limit Switch | Power Switch ICs - Power Distribution 200mA/250mA/300mA Current-Limit Switches | Power Switch ICs - Power Distribution | Power Switch ICs - Power Distribution |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 |
零件包装代码 | QFN | SOT-143 | SOT-23 | - | - | SOT-143 | QFN | SOT-143 |
包装说明 | 3 X 3 MM, 0.80 MM HEIGHT, THIN, EXPOSED PAD, MO-220, QFN-6 | SOT-143, 4 PIN | SOT-23, 5 PIN | SOT-143, 4PIN | - | SOT-143, 4 PIN | 3 X 3 MM, 0.80 MM HEIGHT, THIN, EXPOSED PAD, MO-220, QFN-6 | SOT-143, 4 PIN |
针数 | 6 | 4 | 5 | - | - | 4 | 6 | 4 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | - | not_compliant | not_compliant | not_compliant |
模拟集成电路 - 其他类型 | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | - | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT |
JESD-30 代码 | S-XDSO-N6 | R-PDSO-G4 | R-PDSO-G5 | R-PDSO-G4 | - | R-PDSO-G4 | S-XDSO-N6 | R-PDSO-G4 |
JESD-609代码 | e0 | e0 | e0 | e0 | - | e0 | e0 | e0 |
长度 | 3 mm | 2.92 mm | 2.9 mm | 2.92 mm | - | 2.92 mm | 3 mm | 2.92 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 |
端子数量 | 6 | 4 | 5 | 4 | - | 4 | 6 | 4 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
封装代码 | HVSON | TSOP | LSSOP | LSOP | - | TSOP | HVSON | TSOP |
封装等效代码 | SOLCC6,.11,37 | TO-253 | TSOP5/6,.11,37 | SOT-143R | - | TO-253 | SOLCC6,.11,37 | TO-253 |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE | - | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
峰值回流温度(摄氏度) | 240 | 240 | 240 | NOT SPECIFIED | - | 240 | 240 | 240 |
电源 | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V | - | 2.5/5 V | 2.5/5 V | 2.5/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 0.8 mm | 1.22 mm | 1.45 mm | 1.22 mm | - | 1.22 mm | 0.8 mm | 1.22 mm |
最大供电电流 (Isup) | 0.16 mA | 0.16 mA | 0.16 mA | 0.16 mA | - | 0.16 mA | 0.16 mA | 0.16 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V | - | 2.3 V | 2.3 V | 2.3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | - | YES | YES | YES |
技术 | BICMOS | BICMOS | BICMOS | BICMOS | - | BICMOS | BICMOS | BICMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | - | GULL WING | NO LEAD | GULL WING |
端子节距 | 0.95 mm | 1.92 mm | 0.95 mm | - | - | 1.92 mm | 0.95 mm | 1.92 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 20 | 20 | 20 | NOT SPECIFIED | - | 20 | 20 | 20 |
宽度 | 3 mm | 1.3 mm | 1.625 mm | 1.3 mm | - | 1.3 mm | 3 mm | 1.3 mm |
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