Power Switch ICs - Power Distribution
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | SOT-143 |
| 包装说明 | SOT-143, 4 PIN |
| 针数 | 4 |
| Reach Compliance Code | not_compliant |
| 模拟集成电路 - 其他类型 | ANALOG CIRCUIT |
| JESD-30 代码 | R-PDSO-G4 |
| JESD-609代码 | e0 |
| 长度 | 2.92 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 4 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP |
| 封装等效代码 | TO-253 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 2.5/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.22 mm |
| 最大供电电流 (Isup) | 0.16 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 1.92 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 1.3 mm |
| MAX4792EUS-T | MAX4789EUK-T | MAX4792ETT-T | MAX4789EUS | MAX4791EUK-V-T | MAX4793EUS-T | MAX4791ETT-T | MAX4789EUS-T | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Power Switch ICs - Power Distribution | Power Switch ICs - Power Distribution 200mA/250mA/300mA Current-Limit Switches | Power Switch ICs - Power Distribution | Power Switch ICs - Power Distribution MAX4789EUS | Power Switch ICs - Power Distribution 200/250/300mA Crnt Limit Switch | Power Switch ICs - Power Distribution 200mA/250mA/300mA Current-Limit Switches | Power Switch ICs - Power Distribution | Power Switch ICs - Power Distribution |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | SOT-143 | SOT-23 | QFN | - | - | SOT-143 | QFN | SOT-143 |
| 包装说明 | SOT-143, 4 PIN | SOT-23, 5 PIN | 3 X 3 MM, 0.80 MM HEIGHT, THIN, EXPOSED PAD, MO-220, QFN-6 | SOT-143, 4PIN | - | SOT-143, 4 PIN | 3 X 3 MM, 0.80 MM HEIGHT, THIN, EXPOSED PAD, MO-220, QFN-6 | SOT-143, 4 PIN |
| 针数 | 4 | 5 | 6 | - | - | 4 | 6 | 4 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | - | not_compliant | not_compliant | not_compliant |
| 模拟集成电路 - 其他类型 | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | - | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT |
| JESD-30 代码 | R-PDSO-G4 | R-PDSO-G5 | S-XDSO-N6 | R-PDSO-G4 | - | R-PDSO-G4 | S-XDSO-N6 | R-PDSO-G4 |
| JESD-609代码 | e0 | e0 | e0 | e0 | - | e0 | e0 | e0 |
| 长度 | 2.92 mm | 2.9 mm | 3 mm | 2.92 mm | - | 2.92 mm | 3 mm | 2.92 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 |
| 端子数量 | 4 | 5 | 6 | 4 | - | 4 | 6 | 4 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | - | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | TSOP | LSSOP | HVSON | LSOP | - | TSOP | HVSON | TSOP |
| 封装等效代码 | TO-253 | TSOP5/6,.11,37 | SOLCC6,.11,37 | SOT-143R | - | TO-253 | SOLCC6,.11,37 | TO-253 |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | - | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, LOW PROFILE | - | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| 峰值回流温度（摄氏度） | 240 | 240 | 240 | NOT SPECIFIED | - | 240 | 240 | 240 |
| 电源 | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V | - | 2.5/5 V | 2.5/5 V | 2.5/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.22 mm | 1.45 mm | 0.8 mm | 1.22 mm | - | 1.22 mm | 0.8 mm | 1.22 mm |
| 最大供电电流 (Isup) | 0.16 mA | 0.16 mA | 0.16 mA | 0.16 mA | - | 0.16 mA | 0.16 mA | 0.16 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V | - | 2.3 V | 2.3 V | 2.3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | - | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | - | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | GULL WING | NO LEAD | GULL WING | - | GULL WING | NO LEAD | GULL WING |
| 端子节距 | 1.92 mm | 0.95 mm | 0.95 mm | - | - | 1.92 mm | 0.95 mm | 1.92 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | 20 | 20 | NOT SPECIFIED | - | 20 | 20 | 20 |
| 宽度 | 1.3 mm | 1.625 mm | 3 mm | 1.3 mm | - | 1.3 mm | 3 mm | 1.3 mm |
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