SPLD - Simple Programmable Logic Devices 31 INPUT 10 OUTPUT 3.3V ispJTAG 2.3ns
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Lattice(莱迪斯) |
零件包装代码 | QFN |
包装说明 | 5 X 5 MM, LEAD FREE, QFN-32 |
针数 | 32 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
架构 | PAL-TYPE |
最大时钟频率 | 143 MHz |
JESD-30 代码 | S-XQCC-N32 |
JESD-609代码 | e3 |
长度 | 5 mm |
湿度敏感等级 | 1 |
专用输入次数 | 11 |
I/O 线路数量 | 10 |
输入次数 | 22 |
输出次数 | 10 |
产品条款数 | 132 |
端子数量 | 32 |
组织 | 11 DEDICATED INPUTS, 10 I/O |
输出函数 | MACROCELL |
封装主体材料 | UNSPECIFIED |
封装代码 | HVQCCN |
封装等效代码 | LCC32,.2SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
电源 | 3.3 V |
可编程逻辑类型 | EE PLD |
传播延迟 | 5 ns |
认证状态 | Not Qualified |
座面最大高度 | 1 mm |
最大供电电压 | 3.6 V |
最小供电电压 | 3 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
端子面层 | Matte Tin (Sn) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
宽度 | 5 mm |
ispGAL22V10AV-5LSN | GAL22LV10C-7LJ | GAL22LV10C-15LJN | GAL22LV10D-4LJ | ispGAL22V10AB-5LSI | GAL22LV10C-15LJ | ispGAL22V10AB-75LS | GP6548-2640-CB | GAL22LV10D-5LJN | ispGAL22V10AV-23LS | |
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描述 | SPLD - Simple Programmable Logic Devices 31 INPUT 10 OUTPUT 3.3V ispJTAG 2.3ns | SPLD - Simple Programmable Logic Devices LO VOLT E2CMOS PLD | SPLD - Simple Programmable Logic Devices LO VOLT E2CMOS PLD | SPLD - Simple Programmable Logic Devices LO VOLT E2CMOS PLD | SPLD - Simple Programmable Logic Devices 59 INPUT 10 OUTPUT 3.3V ispJTAG 2.3ns | SPLD - Simple Programmable Logic Devices LO VOLT E2CMOS PLD | SPLD - Simple Programmable Logic Devices 56 INPUT 10 OUTPUT 3.3V ispJTAG 2.3ns | Fixed Resistor, Metal Film, 1W, 264ohm, 400V, 0.25% +/-Tol, 100ppm/Cel, | SPLD - Simple Programmable Logic Devices LO VOLT E2CMOS PLD | SPLD - Simple Programmable Logic Devices 23 INPUT 10 OUTPUT 3.3V ispJTAG 2.3ns |
Reach Compliance Code | unknown | unknown | unknown | unknown | compliant | unknown | compliant | compliant | unknown | compliant |
端子数量 | 32 | 28 | 28 | 28 | 32 | 28 | 32 | 2 | 28 | 32 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | CYLINDRICAL PACKAGE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Axial | CHIP CARRIER | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | METAL FILM | CMOS | CMOS |
是否Rohs认证 | 符合 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 符合 | 不符合 |
零件包装代码 | QFN | QLCC | QLCC | QLCC | QFN | QLCC | QFN | - | QLCC | QFN |
包装说明 | 5 X 5 MM, LEAD FREE, QFN-32 | PLASTIC, LCC-28 | LEAD FREE, PLASTIC, LCC-28 | PLASTIC, LCC-28 | 5 X 5 MM, QFN-32 | PLASTIC, LCC-28 | 5 X 5 MM, QFN-32 | - | LEAD FREE, PLASTIC, LCC-28 | 5 X 5 MM, QFN-32 |
针数 | 32 | 28 | 28 | 28 | 32 | 28 | 32 | - | 28 | 32 |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 |
架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | - | PAL-TYPE | PAL-TYPE |
最大时钟频率 | 143 MHz | 91 MHz | 50 MHz | 167 MHz | 143 MHz | 50 MHz | 100 MHz | - | 143 MHz | 303 MHz |
JESD-30 代码 | S-XQCC-N32 | S-PQCC-J28 | S-PQCC-J28 | S-PQCC-J28 | S-XQCC-N32 | S-PQCC-J28 | S-XQCC-N32 | - | S-PQCC-J28 | S-XQCC-N32 |
JESD-609代码 | e3 | e0 | e3 | e0 | - | e0 | - | - | e3 | - |
长度 | 5 mm | 11.5062 mm | 11.5062 mm | 11.5062 mm | 5 mm | 11.5062 mm | 5 mm | - | 11.5062 mm | 5 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |
专用输入次数 | 11 | 11 | 11 | 11 | 11 | 11 | 11 | - | 11 | 11 |
I/O 线路数量 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | - | 10 | 10 |
输入次数 | 22 | 22 | 22 | 22 | 22 | 22 | 22 | - | 22 | 22 |
输出次数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | - | 10 | 10 |
产品条款数 | 132 | 132 | 132 | 132 | 132 | 132 | 132 | - | 132 | 132 |
组织 | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | - | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O |
输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | - | MACROCELL | MACROCELL |
封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | - | PLASTIC/EPOXY | UNSPECIFIED |
封装代码 | HVQCCN | QCCJ | QCCJ | QCCJ | HVQCCN | QCCJ | HVQCCN | - | QCCJ | HVQCCN |
封装等效代码 | LCC32,.2SQ,20 | LDCC28,.5SQ | LDCC28,.5SQ | LDCC28,.5SQ | LCC32,.2SQ,20 | LDCC28,.5SQ | LCC32,.2SQ,20 | - | LDCC28,.5SQ | LCC32,.2SQ,20 |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 2.5 V | 3.3 V | 2.5 V | - | 3.3 V | 3.3 V |
可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | - | EE PLD | EE PLD |
传播延迟 | 5 ns | 7.5 ns | 15 ns | 4 ns | 5 ns | 15 ns | 7.5 ns | - | 5 ns | 2.3 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
座面最大高度 | 1 mm | 4.572 mm | 4.572 mm | 4.572 mm | 1 mm | 4.572 mm | 1 mm | - | 4.572 mm | 1 mm |
最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 2.7 V | 3.6 V | 2.7 V | - | 3.6 V | 3.6 V |
最小供电电压 | 3 V | 3 V | 3 V | 3 V | 2.3 V | 3 V | 2.3 V | - | 3 V | 3 V |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 2.5 V | 3.3 V | 2.5 V | - | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | - | YES | YES |
端子面层 | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) | - | - | Matte Tin (Sn) | - |
端子形式 | NO LEAD | J BEND | J BEND | J BEND | NO LEAD | J BEND | NO LEAD | - | J BEND | NO LEAD |
端子节距 | 0.5 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.5 mm | 1.27 mm | 0.5 mm | - | 1.27 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | - | QUAD | QUAD |
宽度 | 5 mm | 11.5062 mm | 11.5062 mm | 11.5062 mm | 5 mm | 11.5062 mm | 5 mm | - | 11.5062 mm | 5 mm |
最高工作温度 | - | 75 °C | 75 °C | 75 °C | - | 75 °C | - | 160 °C | 75 °C | - |
Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - | - | 1 | 1 |
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