Multiplexer Switch ICs 16:1 CMOS Latched
参数名称 | 属性值 |
Source Url Status Check Date | 2013-05-01 14:56:37.705 |
Brand Name | Analog Devices Inc |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | ADI(亚德诺半导体) |
零件包装代码 | SOIC |
包装说明 | 0.300 INCH, SOIC-28 |
针数 | 28 |
制造商包装代码 | RW-28 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
其他特性 | ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | R-PDSO-G28 |
JESD-609代码 | e0 |
长度 | 12.8 mm |
湿度敏感等级 | 1 |
负电源电压最大值(Vsup) | -16.5 V |
负电源电压最小值(Vsup) | -10.8 V |
标称负供电电压 (Vsup) | -15 V |
信道数量 | 16 |
功能数量 | 1 |
端子数量 | 28 |
标称断态隔离度 | 68 dB |
通态电阻匹配规范 | 5 Ω |
最大通态电阻 (Ron) | 450 Ω |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP28,.4 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 240 |
电源 | 12/15,GND/-12/-15 V |
认证状态 | Not Qualified |
座面最大高度 | 2.65 mm |
最大信号电流 | 0.02 A |
最大供电电流 (Isup) | 1.5 mA |
最大供电电压 (Vsup) | 16.5 V |
最小供电电压 (Vsup) | 10.8 V |
标称供电电压 (Vsup) | 15 V |
表面贴装 | YES |
最长断开时间 | 300 ns |
最长接通时间 | 300 ns |
切换 | BREAK-BEFORE-MAKE |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 7.5 mm |
Base Number Matches | 1 |
ADG526AKR-REEL | ADG526AKN | ADG527AKPZ | 5962-89710013X | ADG527AKP | ADG527AKNZ | ADG527AKN | |
---|---|---|---|---|---|---|---|
描述 | Multiplexer Switch ICs 16:1 CMOS Latched | Multiplexer Switch ICs 16:1 CMOS Latched | Battery Management Snaphat Batt u0026 Cryst | Multiplexer Switch ICs 16 CHMUX IC | Multiplexer Switch ICs 8:1 280 Ohm Latchable Diff | IC u0026 Component Sockets 8P DUAL WIPE DIPSKT | Multiplexer Switch ICs 8:1 280 Ohm Latchable Diff |
Brand Name | Analog Devices Inc | - | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc |
是否无铅 | 含铅 | - | 含铅 | 不含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | - | 符合 | 不符合 | 不符合 | 符合 | 不符合 |
厂商名称 | ADI(亚德诺半导体) | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
零件包装代码 | SOIC | - | QLCC | QLCC | QLCC | DIP | DIP |
包装说明 | 0.300 INCH, SOIC-28 | - | QCCJ, LDCC28,.5SQ | QCCN, | PLASTIC, LCC-28 | DIP, DIP28,.6 | PLASTIC, DIP-28 |
针数 | 28 | - | 28 | 28 | 28 | 28 | 28 |
制造商包装代码 | RW-28 | - | P-28 | - | P-28A | N-28-2 | N-28-2 |
Reach Compliance Code | unknown | - | compliant | unknown | not_compliant | compliant | unknown |
ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY | - | ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY | ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY | ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY | ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY | ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | - | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER |
JESD-30 代码 | R-PDSO-G28 | - | S-PQCC-J28 | S-CQCC-N28 | S-PQCC-J28 | R-PDIP-T28 | R-PDIP-T28 |
JESD-609代码 | e0 | - | e3 | e4 | e0 | e3 | e0 |
长度 | 12.8 mm | - | 11.505 mm | 11.43 mm | 11.505 mm | 36.205 mm | 36.205 mm |
负电源电压最大值(Vsup) | -16.5 V | - | -16.5 V | -16.5 V | -16.5 V | -16.5 V | -16.5 V |
负电源电压最小值(Vsup) | -10.8 V | - | -10.8 V | -10.8 V | -10.8 V | -10.8 V | -10.8 V |
标称负供电电压 (Vsup) | -15 V | - | -15 V | -15 V | -15 V | -15 V | -15 V |
信道数量 | 16 | - | 8 | 16 | 8 | 8 | 8 |
功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | - | 28 | 28 | 28 | 28 | 28 |
标称断态隔离度 | 68 dB | - | 68 dB | 68 dB | 68 dB | 68 dB | 68 dB |
通态电阻匹配规范 | 5 Ω | - | 5 Ω | 5 Ω | 5 Ω | 5 Ω | 5 Ω |
最大通态电阻 (Ron) | 450 Ω | - | 450 Ω | 450 Ω | 450 Ω | 450 Ω | 450 Ω |
最高工作温度 | 85 °C | - | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | - | -40 °C | -55 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | - | QCCJ | QCCN | QCCJ | DIP | DIP |
封装等效代码 | SOP28,.4 | - | LDCC28,.5SQ | - | LDCC28,.5SQ | DIP28,.6 | DIP28,.6 |
封装形状 | RECTANGULAR | - | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | - | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | 240 | - | 260 | NOT SPECIFIED | 225 | NOT APPLICABLE | NOT APPLICABLE |
电源 | 12/15,GND/-12/-15 V | - | 12/15,GND/-12/-15 V | - | 12/15,GND/-12/-15 V | 12/15,GND/-12/-15 V | 12/15,GND/-12/-15 V |
认证状态 | Not Qualified | - | Not Qualified | Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.65 mm | - | 4.57 mm | 2.54 mm | 4.57 mm | 5.08 mm | 5.08 mm |
最大信号电流 | 0.02 A | - | 0.02 A | - | 0.02 A | 0.02 A | 0.02 A |
最大供电电流 (Isup) | 1.5 mA | - | 1.5 mA | - | 1.5 mA | 1.5 mA | 1.5 mA |
最大供电电压 (Vsup) | 16.5 V | - | 16.5 V | 16.5 V | 16.5 V | 16.5 V | 16.5 V |
最小供电电压 (Vsup) | 10.8 V | - | 10.8 V | 10.8 V | 10.8 V | 10.8 V | 10.8 V |
标称供电电压 (Vsup) | 15 V | - | 15 V | 15 V | 15 V | 15 V | 15 V |
表面贴装 | YES | - | YES | YES | YES | NO | NO |
最长断开时间 | 300 ns | - | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns |
最长接通时间 | 300 ns | - | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns |
切换 | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | - | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) | - | MATTE TIN | GOLD | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) | TIN LEAD |
端子形式 | GULL WING | - | J BEND | NO LEAD | J BEND | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | - | QUAD | QUAD | QUAD | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | - | 40 | NOT SPECIFIED | 30 | NOT APPLICABLE | NOT APPLICABLE |
宽度 | 7.5 mm | - | 11.505 mm | 11.43 mm | 11.505 mm | 15.24 mm | 15.24 mm |
Base Number Matches | 1 | - | 1 | 1 | 1 | 1 | 1 |
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