Circuit Board Hardware - PCB RFI Clip 0.15-0.20mm 6.5mm ht x 1.28mm ln
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | TDK(株式会社) |
包装说明 | CHIP |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
电容 | 0.000068 µF |
电容器类型 | ARRAY/NETWORK CAPACITOR |
JESD-609代码 | e3 |
长度 | 3.2 mm |
安装特点 | SURFACE MOUNT |
负容差 | 10% |
网络类型 | ISOLATED C NETWORK |
元件数量 | 1 |
功能数量 | 4 |
端子数量 | 8 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装代码 | CHIP |
封装形状 | RECTANGULAR PACKAGE |
包装方法 | TR, 7 INCH |
正容差 | 10% |
额定(直流)电压(URdc) | 50 V |
座面最大高度 | 1 mm |
表面贴装 | YES |
温度特性代码 | C0G |
温度系数 | -/+30ppm/Cel ppm/°C |
端子面层 | MATTE TIN OVER NICKEL |
端子节距 | 0.8 mm |
端子形状 | WRAPAROUND |
宽度 | 1.6 mm |
CKCA43C0G1H680K100AA | BLU0201-8251-FB10W | CKCL44C0G1H680K085AA | CKCA43C0G1H330K100AA | CKCL44C0G1H101K085AA | CKCA43C0G1H150K100AA | CKCL44C0G1H150K085AA | CKCA43C0G1H100F100AA | CKCA43C0G1H331K100AA | CKCA43C0G1H470K100AA | |
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描述 | Circuit Board Hardware - PCB RFI Clip 0.15-0.20mm 6.5mm ht x 1.28mm ln | Fixed Resistor, Thin Film, 0.05W, 8250ohm, 15V, 1% +/-Tol, 10ppm/Cel, 0201, | USB Interface IC 4-Port Full-Spd Univ Serial Bus Hub | RS-422/RS-485 Interface IC 3-5.5V 1uA Tcvr Multiprotocol | Power Switch ICs - Power Distribution | Capacitor Arrays u0026 Networks 1206 C0G 50V 15pF 4 Element Array | Ethernet ICs 10/100 Ethernet XCVR w/HPAutoMDIX FlexPwr | Ethernet ICs MII/RMII 10/100 Eth Ethernet Transceiver | Multilayer Ceramic Capacitors MLCC - SMD/SMT 1210 22uF 25volts X7R 10% | USB Interface IC USB to Serial UART Enhanced IC SSOP-28 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
安装特点 | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT |
端子数量 | 8 | 2 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 125 °C | 155 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
包装方法 | TR, 7 INCH | BULK | TR, 7 INCH | TR, 7 INCH | TR, 7 INCH | TR, 7 INCH | TR, 7 INCH | TR, 7 INCH | TR, 7 INCH | TR, 7 INCH |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
温度系数 | -/+30ppm/Cel ppm/°C | 10 ppm/°C | -/+30ppm/Cel ppm/°C | -/+30ppm/Cel ppm/°C | -/+30ppm/Cel ppm/°C | -/+30ppm/Cel ppm/°C | 30ppm/Cel ppm/°C | -/+30ppm/Cel ppm/°C | -/+30ppm/Cel ppm/°C | -/+30ppm/Cel ppm/°C |
端子面层 | MATTE TIN OVER NICKEL | Matte Tin (Sn) - with Nickel (Ni) barrier | MATTE TIN OVER NICKEL | MATTE TIN OVER NICKEL | MATTE TIN OVER NICKEL | MATTE TIN OVER NICKEL | MATTE TIN OVER NICKEL | MATTE TIN OVER NICKEL | MATTE TIN OVER NICKEL | MATTE TIN OVER NICKEL |
端子形状 | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND |
是否无铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
厂商名称 | TDK(株式会社) | - | TDK(株式会社) | TDK(株式会社) | TDK(株式会社) | TDK(株式会社) | - | TDK(株式会社) | TDK(株式会社) | TDK(株式会社) |
包装说明 | CHIP | - | CHIP | CHIP | CHIP | CHIP | CHIP, | CHIP | CHIP | CHIP |
电容 | 0.000068 µF | - | 0.000068 µF | 0.000033 µF | 0.0001 µF | 0.000015 µF | 0.000015 µF | 0.00001 µF | 0.00033 µF | 0.000047 µF |
电容器类型 | ARRAY/NETWORK CAPACITOR | - | ARRAY/NETWORK CAPACITOR | ARRAY/NETWORK CAPACITOR | ARRAY/NETWORK CAPACITOR | ARRAY/NETWORK CAPACITOR | ARRAY/NETWORK CAPACITOR | ARRAY/NETWORK CAPACITOR | ARRAY/NETWORK CAPACITOR | ARRAY/NETWORK CAPACITOR |
长度 | 3.2 mm | - | 2 mm | 3.2 mm | 2 mm | 3.2 mm | 2 mm | 3.2 mm | 3.2 mm | 3.2 mm |
负容差 | 10% | - | 10% | 10% | 10% | 10% | 10% | 10% | 10% | 10% |
网络类型 | ISOLATED C NETWORK | - | ISOLATED C NETWORK | ISOLATED C NETWORK | ISOLATED C NETWORK | ISOLATED C NETWORK | ISOLATED C NETWORK | ISOLATED C NETWORK | ISOLATED C NETWORK | ISOLATED C NETWORK |
元件数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 4 | - | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
封装代码 | CHIP | - | CHIP | CHIP | CHIP | CHIP | CHIP | CHIP | CHIP | CHIP |
封装形状 | RECTANGULAR PACKAGE | - | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE |
正容差 | 10% | - | 10% | 10% | 10% | 10% | 10% | 10% | 10% | 10% |
额定(直流)电压(URdc) | 50 V | - | 50 V | 50 V | 50 V | 50 V | 50 V | 50 V | 50 V | 50 V |
座面最大高度 | 1 mm | - | 0.85 mm | 1 mm | 0.85 mm | 1 mm | 0.85 mm | 1 mm | 1 mm | 1 mm |
温度特性代码 | C0G | - | C0G | C0G | C0G | C0G | C0G | C0G | C0G | C0G |
端子节距 | 0.8 mm | - | 0.5 mm | 0.8 mm | 0.5 mm | 0.8 mm | 0.5 mm | 0.8 mm | 0.8 mm | 0.8 mm |
宽度 | 1.6 mm | - | 1.25 mm | 1.6 mm | 1.25 mm | 1.6 mm | 1.25 mm | 1.6 mm | 1.6 mm | 1.6 mm |
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