Subminiature High Performance
AlInGaP LED Lamps
Technical Data
SunPower Series
HLMA-PF00 HLMT-PG00
HLMA-PG00 HLMT-PH00
HLMA-PH00 HLMT-PL00
HLMA-PL00 HLMT-QG00
HLMA-QF00 HLMT-QH00
HLMA-QG00 HLMT-QL00
HLMA-QH00
HLMA-QL00
Features
•
Subminiature Flat Top
Package
Ideal for Backlighting and Light
Piping Applications
•
Subminiature Dome Package
Nondiffused Dome for High
Brightness
• Wide Range of Drive
Currents
• Colors: 590 nm Amber,
605 nm Orange, 615 nm
Reddish-Orange, 626 nm
Red, and 635 nm Red
• Ideal for Space Limited
Applications
• Axial Leads
• Available with Lead
Configurations for Surface
Mount and Through Hole PC
Board Mounting
Dome Packages
The HLMX-QXXX dome lamps
use an untinted, nondiffused lens
to provide a high luminous
intensity within a narrow
radiation pattern.
Lead Configurations
All of these devices are made by
encapsulating LED chips on axial
lead frames to form molded
epoxy subminiature lamp
packages. A variety of package
configuration options is available.
These include special surface
mount lead configurations, gull
wing, yoke lead, or Z-bend. Right
angle lead bends at 2.54 mm
(0.100 inch) and 5.08 mm (0.200
inch) center spacing are available
for through hole mounting. For
more information refer to
Standard SMT and Through Hole
Lead Bend Options for
Subminiature LED Lamps data
sheet.
Description
Flat Top Package
The HLMX-PXXX flat top lamps
use an untinted, nondiffused,
truncated lens to provide a wide
radiation pattern that is neces-
sary for use in backlighting
applications. The flat top lamps
are also ideal for use as emitters
in light pipe applications.
Technology
These subminiature solid state
lamps utilize one of the two newly
developed aluminum indium
gallium phosphide (AlInGaP)
LED technologies, either the
absorbing substrate carrier
technology (AS = HLMA-
Devices) or the transparent
substrate carrier technology
(TS = HLMT-Devices). The TS
HLMT-Devices are especially
effective in very bright ambient
lighting conditions. The colors
590 nm amber, 605 nm orange,
615 nm reddish-orange, 626 nm
red, and 635 nm red are available
with viewing angles of 15° for the
domed devices and 125° for the
flat top devices.
3
Part Numbering System
HLMx - x x 00 - x x x xx
Packaging Option
00: Straight Leads, Bulk Packaging, Quantity of 500 parts
11: Gull Wing Bend, Tape & Reel – 7" Reel
12: Gull Wing Bend, Bulk
14: Gull Wing Bend, Tape & Reel – 13" Reel
21: Yoke Bend, Tape and Reel – 7" Reel
22: Yoke Bend, Bulk
24: Yoke Bend, Tape and Reel – 13" Reel
31: Z-Bend, Tape and Reel – 7" Reel
32: Z-Bend, Bulk
34: Z-Bend, Tape and Reel – 13" Reel
Color Bin Selection
0: Full Color Bin Distribution
B: Color Bins 3 & 4
K: Color Bins 2, 3 & 4
R: Color Bins 2 & 4
W: Color Bins 2, 4, 6 & 7
X: Color Bins 4, 6 & 7
Maximum Iv Bin Options
Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Color Options
L: Amber 590 nm
J: Orange 605 nm
H: Reddish Orange 615 nm
G: Red 626 nm
F: Red 635 nm
Package Options
Q: Dome
P: Flat Top
Dice Options
A: AS AlInGaP
T: TS AlInGaP
5
Absolute Maximum Ratings at T
A
= 25
°
C
Parameter
Peak Forward Current
[2]
Average Forward Current (I
PEAK
= 100 mA)
[1,2]
DC Forward Current
[3,5,6]
Power Dissipation
Reverse Voltage (I
R
= 100
µA)
Transient Forward Current (10
µs
Pulse)
[5]
Operating Temperature Range
Storage Temperature Range
LED Junction Temperature
Lead Soldering Temperature
[1.6 mm (0.063 in.) from body]
SMT Reflow Soldering Temperatures
Convective Reflow
Vapor Phase Reflow
HLMA-xxxx
100
30
50
105
5
500
–40 to +100
–55 to +100
110
260°C for 5 seconds
235°C Peak, above 183°C for 90 seconds
215°C for 3 minutes
HLMT-xxxx
100
37
50
120
Unit
mA
mA
mA
mW
V
mA
°C
°C
°C
Notes:
1. Maximum I
AVG
at f = 1 kHz.
2. Refer to Figure 5 to establish pulsed operating conditions.
3. Derate linearly as shown in Figure 4.
4. The transient peak current is the maximum non-recurring peak current these devices can withstand without damaging the LED die
and wire bonds. Operation at currents above Absolute Maximum Peak Forward Current is not recommended.
5. Drive currents between 10 mA and 30 mA are recommended for best long term performance.
6. Operation at currents below 5 mA is not recommended, please contact your Agilent sales representative.
CATHODE
TAB
NO. ANODE DOWN.
YES. CATHODE DOWN.
Proper Right Angle Mounting to a PC Board to Prevent Protruding Cathode Tab
from Shorting to Anode Connection.
NXP MCU
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