Daughter Cards u0026 OEM Boards TOWER ELEVATOR BOARDS
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 包装说明 | FQFP, |
| Reach Compliance Code | compliant |
| ECCN代码 | 5A992 |
| 具有ADC | YES |
| 地址总线宽度 | |
| 位大小 | 32 |
| 最大时钟频率 | 80 MHz |
| DMA 通道 | YES |
| 外部数据总线宽度 | |
| JESD-609代码 | e3 |
| 长度 | 14 mm |
| 湿度敏感等级 | 3 |
| I/O 线路数量 | 56 |
| 端子数量 | 100 |
| PWM 通道 | YES |
| 封装代码 | FQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 速度 | 80 MHz |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 14 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
| Base Number Matches | 1 |
| MCF52264AF80 | MCF52258CAG66 | MCF52256AG80 | MCF52258VN80 | MCF52256CVN66 | MCF52258AG80 | MCF52258CVN66J | |
|---|---|---|---|---|---|---|---|
| 描述 | Daughter Cards u0026 OEM Boards TOWER ELEVATOR BOARDS | Circuit Board Hardware - PCB MINI SMT TEST POINT | Daughter Cards u0026 OEM Boards TOWER ELEVATOR BOARDS | Programmers - Processor Based Universal Multilink In-Cir Debug/Program | Programmers - Processor Based Universal Multilink In-Cir Debug/Program | Daughter Cards u0026 OEM Boards TOWER ELEVATOR BOARDS | Daughter Cards u0026 OEM Boards TOWER ELEVATOR BOARDS |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| Reach Compliance Code | compliant | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 5A992 | 5A992 | 5A992 | 5A992 | 5A992 | 5A992 | 5A992 |
| 位大小 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| JESD-609代码 | e3 | e3 | e3 | e2 | e2 | e3 | e2 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 100 | 144 | 144 | 144 | 144 | 144 | 144 |
| 封装代码 | FQFP | QFP | QFP | BGA | BGA | QFP | BGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, FINE PITCH | FLATPACK | FLATPACK | GRID ARRAY | GRID ARRAY | FLATPACK | GRID ARRAY |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 速度 | 80 MHz | 66 MHz | 80 MHz | 80 MHz | 66 MHz | 80 MHz | 66 MHz |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | TIN COPPER/TIN SILVER | TIN COPPER/TIN SILVER | Matte Tin (Sn) | TIN COPPER/TIN SILVER |
| 端子形式 | GULL WING | GULL WING | GULL WING | BALL | BALL | GULL WING | BALL |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 1 mm | 1 mm | 0.5 mm | 1 mm |
| 端子位置 | QUAD | QUAD | QUAD | BOTTOM | BOTTOM | QUAD | BOTTOM |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
| 包装说明 | FQFP, | 20 X 20 MM, ROHS COMPLIANT, LQFP-144 | 20 X 20 MM, ROHS COMPLIANT, LQFP-144 | 13 X 13 MM, ROHS COMPLIANT, MAPBGA-144 | 13 X 13 MM, ROHS COMPLIANT, MAPBGA-144 | 20 X 20 MM, ROHS COMPLIANT, LQFP-144 | - |
| 具有ADC | YES | YES | YES | YES | YES | YES | - |
| 最大时钟频率 | 80 MHz | 66 MHz | 80 MHz | 80 MHz | 66 MHz | 80 MHz | - |
| DMA 通道 | YES | YES | YES | YES | YES | YES | - |
| 长度 | 14 mm | 20 mm | 20 mm | 13 mm | 13 mm | 20 mm | - |
| I/O 线路数量 | 56 | 96 | 96 | 96 | 96 | 96 | - |
| PWM 通道 | YES | YES | YES | YES | YES | YES | - |
| 最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - |
| 最小供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | - |
| 宽度 | 14 mm | 20 mm | 20 mm | 13 mm | 13 mm | 20 mm | - |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | - |
| Base Number Matches | 1 | 1 | - | - | - | 1 | 1 |
| Brand Name | - | Freescale | Freescale | Freescale | Freescale | Freescale | - |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 零件包装代码 | - | QFP | QFP | BGA | BGA | QFP | - |
| 针数 | - | 144 | 144 | 144 | 144 | 144 | - |
| CPU系列 | - | COLDFIRE | COLDFIRE | COLDFIRE | COLDFIRE | COLDFIRE | COLDFIRE |
| DAC 通道 | - | NO | NO | NO | NO | NO | - |
| JESD-30 代码 | - | S-PQFP-G144 | S-PQFP-G144 | S-XBGA-B144 | S-XBGA-B144 | S-PQFP-G144 | S-PBGA-B144 |
| 最高工作温度 | - | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装等效代码 | - | QFP144,.87SQ,20 | QFP144,.87SQ,20 | BGA144,12X12,40 | BGA144,12X12,40 | QFP144,.87SQ,20 | BGA144,12X12,40 |
| 电源 | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | - | 65536 | 32768 | 65536 | 65536 | 65536 | 65536 |
| ROM（单词） | - | 524288 | 262144 | 524288 | 262144 | 524288 | 524288 |
| ROM可编程性 | - | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 温度等级 | - | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
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