DRAM 64M 4Mx16 143Mhz Industrial Temp
参数名称 | 属性值 |
产品种类 Product Category | DRAM |
制造商 Manufacturer | ISSI(芯成半导体) |
RoHS | No |
类型 Type | SDRAM |
Data Bus Width | 16 bit |
Organization | 4 M x 16 |
封装 / 箱体 Package / Case | TSOP-54 |
Memory Size | 64 Mbit |
Maximum Clock Frequency | 143 MHz |
Access Time | 7 ns |
电源电压-最大 Supply Voltage - Max | 3.6 V |
电源电压-最小 Supply Voltage - Min | 3 V |
Supply Current - Max | 110 mA |
最小工作温度 Minimum Operating Temperature | - 40 C |
最大工作温度 Maximum Operating Temperature | + 85 C |
系列 Packaging | Reel |
系列 Packaging | Cut Tape |
高度 Height | 1.05 mm |
长度 Length | 22.42 mm |
安装风格 Mounting Style | SMD/SMT |
工作电源电压 Operating Supply Voltage | 3.3 V |
工厂包装数量 Factory Pack Quantity | 1500 |
宽度 Width | 10.29 mm |
IS42S16400D-7TI-TR | IS42S16400D-6T | IS42S16400D-6BL-TR | IS42S16400D-7TL | IS42S16400D-7TLI | IS42S16400D-7BL | IS42S16400D-6TL-TR | |
---|---|---|---|---|---|---|---|
描述 | DRAM 64M 4Mx16 143Mhz Industrial Temp | DRAM 64M 4Mx16 166Mhz | DRAM 64M 4Mx16 166Mhz | DRAM 64M 4Mx16 143Mhz | DRAM 64M 4Mx16 143Mhz Industrial Temp | DRAM 64M 4Mx16 143Mhz | DRAM 64M 4Mx16 166Mhz |
是否Rohs认证 | - | 不符合 | - | 符合 | 符合 | 符合 | 符合 |
厂商名称 | - | ISSI(芯成半导体) | - | ISSI(芯成半导体) | ISSI(芯成半导体) | ISSI(芯成半导体) | - |
零件包装代码 | - | TSOP2 | - | TSOP2 | TSOP2 | BGA | TSOP2 |
包装说明 | - | TSOP2, TSOP54,.46,32 | - | TSOP2, TSOP54,.46,32 | TSOP2, TSOP54,.46,32 | TFBGA, BGA60,7X15,25 | TSOP2, |
针数 | - | 54 | - | 54 | 54 | 60 | 54 |
Reach Compliance Code | - | not_compliant | - | compliant | compliant | compliant | unknown |
ECCN代码 | - | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | - | FOUR BANK PAGE BURST | - | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
最长访问时间 | - | 6 ns | - | 7 ns | 7 ns | 7 ns | 6 ns |
其他特性 | - | AUTO/SELF REFRESH | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
最大时钟频率 (fCLK) | - | 166 MHz | - | 143 MHz | 143 MHz | 143 MHz | - |
I/O 类型 | - | COMMON | - | COMMON | COMMON | COMMON | - |
交错的突发长度 | - | 1,2,4,8 | - | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | - |
JESD-30 代码 | - | R-PDSO-G54 | - | R-PDSO-G54 | R-PDSO-G54 | R-PBGA-B60 | R-PDSO-G54 |
JESD-609代码 | - | e0 | - | e3 | e3 | e1 | e3 |
长度 | - | 22.22 mm | - | 22.22 mm | 22.22 mm | 10.1 mm | 22.22 mm |
内存密度 | - | 67108864 bit | - | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bit |
内存集成电路类型 | - | SYNCHRONOUS DRAM | - | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM |
内存宽度 | - | 16 | - | 16 | 16 | 16 | 16 |
功能数量 | - | 1 | - | 1 | 1 | 1 | 1 |
端口数量 | - | 1 | - | 1 | 1 | 1 | 1 |
端子数量 | - | 54 | - | 54 | 54 | 60 | 54 |
字数 | - | 4194304 words | - | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
字数代码 | - | 4000000 | - | 4000000 | 4000000 | 4000000 | 4000000 |
工作模式 | - | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | - | 70 °C | - | 70 °C | 85 °C | 70 °C | 70 °C |
组织 | - | 4MX16 | - | 4MX16 | 4MX16 | 4MX16 | 4MX16 |
输出特性 | - | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | - |
封装主体材料 | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | TSOP2 | - | TSOP2 | TSOP2 | TFBGA | TSOP2 |
封装等效代码 | - | TSOP54,.46,32 | - | TSOP54,.46,32 | TSOP54,.46,32 | BGA60,7X15,25 | - |
封装形状 | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | SMALL OUTLINE, THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE |
峰值回流温度(摄氏度) | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 |
电源 | - | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | - |
认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | - | 4096 | - | 4096 | 4096 | 4096 | - |
座面最大高度 | - | 1.2 mm | - | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
自我刷新 | - | YES | - | YES | YES | YES | YES |
连续突发长度 | - | 1,2,4,8,FP | - | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | - |
最大待机电流 | - | 0.001 A | - | 0.001 A | 0.003 A | 0.001 A | - |
最大压摆率 | - | 0.15 mA | - | 0.13 mA | 0.15 mA | 0.13 mA | - |
最大供电电压 (Vsup) | - | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | - | 3 V | - | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | - | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | - | YES | - | YES | YES | YES | YES |
技术 | - | CMOS | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | COMMERCIAL | - | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
端子面层 | - | Tin/Lead (Sn/Pb) | - | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) |
端子形式 | - | GULL WING | - | GULL WING | GULL WING | BALL | GULL WING |
端子节距 | - | 0.8 mm | - | 0.8 mm | 0.8 mm | 0.65 mm | 0.8 mm |
端子位置 | - | DUAL | - | DUAL | DUAL | BOTTOM | DUAL |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | 40 | 40 |
宽度 | - | 10.16 mm | - | 10.16 mm | 10.16 mm | 6.4 mm | 10.16 mm |
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