Si7447ADP-T1-GE3 (Lead (Pb)-free and Halogen-free)
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS
T
A
= 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
T
C
= 25 °C
Continuous Drain Current (T
J
= 150 °C)
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
Pulsed Drain Current
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Avalanche Energy
T
C
= 25 °C
T
A
= 25 °C
L = 0.1 mH
T
C
= 25 °C
Maximum Power Dissipation
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
d, e
T
J
, T
stg
P
D
I
DM
I
S
I
AS
E
AS
I
D
Symbol
V
DS
V
GS
Limit
- 30
± 25
- 35
- 28
- 21.5
b, c
- 17
b, c
- 60
- 28
- 4.3
b, c
40
80
83.3
53.3
5.4
b, c
3.4
b, c
- 55 to 150
260
W
mJ
A
Unit
V
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient
Maximum Junction-to-Case (Drain)
b, f
t
≤
10 s
Steady State
Symbol
R
thJA
R
thJC
Typical
18
1.0
Maximum
23
1.3
Unit
°C/W
Notes:
a. Based on T
C
= 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See Solder Profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 65 °C/W.
Document Number: 73358
S09-0273-Rev. C, 16-Feb-09
www.vishay.com
1
Si7447ADP
Vishay Siliconix
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
a
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= - 19 A, dI/dt = - 100 A/µs, T
J
= 25 °C
I
S
= - 4.3 A
- 0.72
47
50
22
25
T
C
= 25 °C
- 28
- 60
- 1.1
70
75
A
V
ns
nC
ns
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
V
DD
= - 15 V, R
L
= 1.5
Ω
I
D
≅
- 10 A, V
GEN
= - 10 V, R
g
= 1
Ω
f = 1 MHz
1.7
V
DS
= - 15 V, V
GS
= - 10 V, I
D
= - 24 A
V
DS
= - 15 V, V
GS
= 0 V, f = 1 MHz
4650
1200
930
100
15.5
25
3.5
20
25
82
98
5.3
30
40
125
150
ns
Ω
150
nC
pF
V
DS
ΔV
DS
/T
J
ΔV
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
V
GS
= 0 V, I
D
= - 250 µA
I
D
= - 250 µA
V
DS
= V
GS
, I
D
= - 250 µA
V
DS
= 0 V, V
GS
= ± 25 V
V
DS
= - 30 V, V
GS
= 0 V
V
DS
= - 30 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
≥
- 5 V, V
GS
= - 10 V
V
GS
= - 10 V, I
D
= - 24 A
V
DS
= - 15 V, I
D
= - 24 A
- 30
0.0054
50
0.0065
-1
- 30
- 33
5.3
- 2.0
-3
± 100
-1
- 10
V
mV/°C
V
nA
µA
A
Ω
S
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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2
Document Number: 73358
S09-0273-Rev. C, 16-Feb-09
Si7447ADP
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
60
V
GS
= 10 V thru 5 V
50
I
D
- Drain Current (A)
I
D
- Drain Current (A)
1.0
1.2
40
4V
30
0.8
0.6
T
C
= 125 °C
0.4
25 °C
20
10
0.2
- 55 °C
0
0.0
0.4
0.8
1.2
1.6
2.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
V
DS
- Drain-to-Source Voltage (V)
V
GS
- Gate-to-Source Voltage (V)
Output Characteristics
0.018
0.016
R
DS(on)
- On-Resistance (mΩ)
5200
C - Capacitance (pF)
0.014
0.012
0.010
0.008
0.006
0.004
0
10
20
30
40
50
60
V
GS
= 10 V
1300
V
GS
= 4.5 V
6500
Transfer Characteristics
C
iss
3900
2600
C
oss
C
rss
0
0
5
10
15
20
25
30
I
D
- Drain Current (A)
V
DS
- Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
10
I
D
= 24 A
8
R
DS(on)
- On-Resistance
(Normalized)
V
DS
= 10 V
6
V
DS
= 15 V
4
V
DS
= 20 V
1.4
1.6
Capacitance
V
GS
- Gate-to-Source Voltage (V)
V
GS
= 10 V
1.2
V
GS
= 4.5 V
1.0
2
0.8
0
0
21
42
63
84
105
0.6
- 50
- 25
0
25
50
75
100
125
150
Q
g
- Total Gate Charge (nC)
T
J
- Junction Temperature (°C)
Gate Charge
Document Number: 73358
S09-0273-Rev. C, 16-Feb-09
On-Resistance vs. Junction Temperature
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3
Si7447ADP
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
60
R
DS(on)
- Drain-to-Source On-Resistance (Ω)
0.05
0.04
I
S
- Source Current (A)
T
J
= 150 °C
10
T
J
= 25 °C
0.03
0.02
T
J
= 150 °C
0.01
T
J
= 25 °C
0.00
0
2
4
6
8
10
1
0.00
0.2
0.4
0.6
0.8
1.0
1.2
V
SD
- Source-to-Drain Voltage (V)
V
GS
- Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
0.8
200
On-Resistance vs. Gate-to-Source Voltage
0.6
I
D
= 250 µA
Power (W)
160
0.4
V
GS(th)
(V)
120
0.2
I
D
= 5 mA
80
0.0
40
- 0.2
- 0.4
- 50
- 25
0
25
50
75
100
125
150
0
0.001
0.01
0.1
Time (s)
1
10
T
J
- Temperature (°C)
Threshold Voltage
100
Limited by
R
DS(on)
*
10
I
D
- Drain Current (A)
Single Pulse Power, Junction-to-Ambient
1 ms
10 ms
1
100 ms
1s
0.1
10 s
T
C
= 25 °C
Single Pulse
DC
0.01
0.01
0.1
1
10
100
V
DS
- Drain-to-Source Voltage (V)
* V
GS
> minimum V
GS
at which R
DS(on)
is specified
Safe Operating Area, Junction-to-Ambient
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4
Document Number: 73358
S09-0273-Rev. C, 16-Feb-09
Si7447ADP
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
100
80
I
D
- Drain Current (A)
60
40
20
Package Limited
0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
Current Derating*
100
2.5
80
2.0
Power (W)
60
Power (W)
0
25
50
75
100
125
150
1.5
40
1.0
20
0.5
0
0.0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
T
A
- Ambient Temperature (°C)
Power, Junction-to-Case
Power, Junction-to-Ambient
* The power dissipation P
D
is based on T
J(max)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
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