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TMPN3120A20

产品描述TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
文件大小220KB,共12页
制造商Toshiba(东芝)
官网地址http://toshiba-semicon-storage.com/
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TMPN3120A20概述

TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC

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TMPN3120A20M/U
TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TMPN3120A20M, TMPN3120A20U
Neuron
®
Chip
For Distributed Intelligent Control Networks (L
ON
W
ORKS
®
)
The Neuron Chip (TMPN3120A20M and TMPN3120A20U) provides
double the performance of previous Neuron Chips. It supports a
response time of 3 to 4 ms across a L
ON
W
ORKS
Network and has
double the input / output (I / O) performance of the previous Neuron
Chip in terms of both response time and data transmission speed.
Neuron Chips have all the built-in communications and control
functions required to implement L
ON
W
ORKS
nodes. These nodes
may then be easily integrated into highly-reliable distributed
intelligent control networks.
The typical functions for this chip are explained below.
FEATURES
New features
( In comparison with TMPN3120FE3M and TMPN3120A20M /U )
Enhanced communication port
The package is QFP44-P-1010-0.80 (TMPN3120A20U only)
Weight
SOP32-P-525-1.27 : 1.1g (Typ.)
QFP44-P-1010-0.80 : 0.6g (Typ.)
000707EBA1
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general
can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the
buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and
to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or
damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the
most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling
Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..
The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal
equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are
neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or
failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy
control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control
instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document
shall be made at the customer’s own risk.
The products described in this document are subject to the foreign exchange and foreign trade laws.
The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by
TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its
use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or
others.
The information contained herein is subject to change without notice.
2003-07-01
1/12

TMPN3120A20相似产品对比

TMPN3120A20 TMPN3120A20M TMPN3120A20U
描述 TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
是否Rohs认证 - 不符合 不符合
零件包装代码 - SOIC QFP
包装说明 - SOP, SOP32,.56 QFP, QFP44,.5SQ,32
针数 - 32 44
Reach Compliance Code - unknow unknow
边界扫描 - NO NO
最大时钟频率 - 20 MHz 20 MHz
最大数据传输速率 - 0.3125 MBps 0.3125 MBps
JESD-30 代码 - R-PDSO-G32 S-PQFP-G44
JESD-609代码 - e0 e0
长度 - 20.6 mm 10 mm
低功率模式 - YES YES
串行 I/O 数 - 1 1
端子数量 - 32 44
最高工作温度 - 85 °C 85 °C
最低工作温度 - -40 °C -40 °C
封装主体材料 - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 - SOP QFP
封装等效代码 - SOP32,.56 QFP44,.5SQ,32
封装形状 - RECTANGULAR SQUARE
封装形式 - SMALL OUTLINE FLATPACK
电源 - 5 V 5 V
认证状态 - Not Qualified Not Qualified
座面最大高度 - 2.8 mm 1.9 mm
最大压摆率 - 55 mA 55 mA
最大供电电压 - 5.5 V 5.5 V
最小供电电压 - 4.5 V 4.5 V
标称供电电压 - 5 V 5 V
表面贴装 - YES YES
技术 - CMOS CMOS
温度等级 - INDUSTRIAL INDUSTRIAL
端子面层 - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 - GULL WING GULL WING
端子节距 - 1.27 mm 0.8 mm
端子位置 - DUAL QUAD
宽度 - 10.7 mm 10 mm
uPs/uCs/外围集成电路类型 - SERIAL IO/COMMUNICATION CONTROLLER, LAN SERIAL IO/COMMUNICATION CONTROLLER, LAN
Base Number Matches - 1 1
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