1. SCOPE AND MEANING OF ‘HIGH RELIABILITY GRADE”
This specification is applicable to FERRITE CHIP COMMON MODE FILTERS with a priority over the other
relevant specifications. Manufacturing places defined in this specification shall be TDK-EPC Corporation
Japan, and TDK Components USA. Inc.
“High Reliability Grade” means that TDK's LGJ Series Inductors provide an extended life Inductor that meets
or exceeds the electrical, mechanical and environmental performance standards from AEC Q200 Rev.D.
Details are referenced within section 8 of this specification. It also means that, in addition to our highest
quality Inductor, the customer will also receive access to an on-line Sigma Report (Enhanced Certificate of
Compliance) and internet based product authentication for each lot (which includes electrical characterization
data, and estimated product life, as well as anti-counterfeit packaging).
Additionally RFID (radio frequency identification) tags are available as an option.
EXPLANATORY NOTE:
For warranty information, please refer to section 15 of this specification.
2. CODE CONSTRUCTION
(Example)
LGJ45B - 510 - 2P – TL 003
(1)
(1) Series Name
(2) Inductance (typ) 510:51uH
(3) Number of Lines 2P: 2 Lines
(4) Packaging Style TL: Taping
330mm
(5) Control Number
(2)
(3)
(4) (5)
3. SHAPES AND DIMENSIONS/CIRCUIT DIAGRAM
Marking
e.g.)G345351
G: Product No.
*1
3: Year (2013→3, 2020→0) 10 years/cycle
45: Week (CW45→45)
3: A day of week
*2
51: Lot No.
(*2)
Week
Equivalent Circuit
No polarity
Fri
5
Sat
6
Sun
0
Mon
1
Tue
2
Wed
3
Thu
4
Marking
Dimensions in mm
̶
1
̶
8. PERFORMANCE
No.
1
2
Item
Solderability
Resistance to Solder Heat
Performance
Solder shall successfully connect product to
circuit board with minimum 0.2mm fillet height.
External Appearance: No mechanical damage.
Impedance: Meet the initial specs
Insulation resistance: Meet the initial specs
DC resistance: Meet the initial specs
Test Condition / Inspection Method
Reflow solder the Common Mode Filter on the P.C. test board.
Refer to Section 10 for reflow profile.
Reflow solder (2x) the Common Mode Filter on the P.C. test board.
Reflow Profile
150~180°C
60~120 sec.
40 sec.max.
Peak 260°Cmax.
230°C
Reflow two times
3
Robustness of Termination
External Appearance: No mechanical damage
Reflow solder the Common Mode Filter on the P.C. test board.
Apply a lateral pushing force of 9.8N in direction of arrow.
Printed circuit board
4
Low Temperature Exposure
(Storage)
External Appearance: No mechanical damage.
Impedance: Meet the initial specs
Insulation resistance: Meet the initial specs
DC resistance: Meet the initial specs
After the samples shall be soldered onto the test circuit board, the test shall be
done.
Measurement : After placing for 24 hours min.
Temperature : -40±2°C
Testing time : 2000±12 hours
5
Operational Life
External Appearance: No mechanical damage.
Impedance: Meet the initial specs. initial specs
Insulation resistance: Meet the initial specs
DC resistance: Meet the initial specs
After the samples shall be soldered onto the test circuit board, the test shall be
done.
Measurement : After placing for 24 hours min.
Temperature : 150±2°C
Applied current: Rated current
Testing time : 2000±12 hours
6
Bending
External Appearance: No mechanical damage
Solder a chip to test substrate and then apply a load.
10
20
Test board: FR4 100×40×1mm
Fall speed: 1mm/sec.
R10
2
Dimensions in mm
45
45
7
Vibration
External Appearance: No mechanical damage
Impedance: Meet the initial specs.
Insulation resistance: Meet the initial specs.
DC resistance: Meet the initial specs.
After the samples shall be soldered onto the test circuit board, the test shall be
done.
Frequency : 10~2000Hz
Amplitude : 10G or 1.5mm P-P
Dimension and times : X, Y and Z directions for 20 minutes, 12 cycles
8
Thermal Shock
External Appearance: No mechanical damage
Impedance : Meet the initial specs.
Insulation resistance: Meet the initial specs.
DC resistance: Meet the initial specs.
- 40°C
+150°C
1 cycle
30min.
3min.
30min.
Test Time: 2,000 cycle
9
Biased Humidity
External Appearance: No mechanical damage
Impedance : Meet the initial specs.
Insulation resistance: Meet the initial specs.
DC resistance: Meet the initial specs.
After the samples shall be soldered onto the test circuit board, the test shall be
done.
Measurement : After placing for 24 hours min.
Temperature : 85±2°C, Humidity : 83~87%RH
Testing time: 2000±12 hours
̶
4
̶
1.0