Development Boards u0026 Kits - COLDFIRE MCU Brd for Fsl Towr
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
零件包装代码 | QFP |
包装说明 | 14 X 14 MM, ROHS COMPLIANT, LQFP-100 |
针数 | 100 |
Reach Compliance Code | unknown |
ECCN代码 | 3A991.A.2 |
具有ADC | YES |
地址总线宽度 | |
位大小 | 32 |
CPU系列 | COLDFIRE |
最大时钟频率 | 16 MHz |
DAC 通道 | YES |
DMA 通道 | NO |
外部数据总线宽度 | |
JESD-30 代码 | S-PQFP-G100 |
JESD-609代码 | e3 |
长度 | 14 mm |
湿度敏感等级 | 3 |
I/O 线路数量 | 68 |
端子数量 | 100 |
最高工作温度 | 105 °C |
最低工作温度 | -40 °C |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LFQFP |
封装等效代码 | QFP100,.63SQ,20 |
封装形状 | SQUARE |
封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 260 |
电源 | 2/3.3 V |
认证状态 | Not Qualified |
RAM(字节) | 32768 |
ROM(单词) | 262144 |
ROM可编程性 | FLASH |
座面最大高度 | 1.7 mm |
速度 | 50.33 MHz |
最大压摆率 | 48 mA |
最大供电电压 | 3.6 V |
最小供电电压 | 1.8 V |
标称供电电压 | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 14 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
Base Number Matches | 1 |
MCF51JE256VLL | MCF51JE256CMB | MCF51JE256CLL | MCF51JE256VLK | MCF51JE128CLK | MCF51JE256VMB | |
---|---|---|---|---|---|---|
描述 | Development Boards u0026 Kits - COLDFIRE MCU Brd for Fsl Towr | Daughter Cards u0026 OEM Boards TOWER ELEVATOR BOARDS | Development Boards u0026 Kits - COLDFIRE MCU Brd for Fsl Towr | Daughter Cards u0026 OEM Boards TOWER ELEVATOR BOARDS | Daughter Cards u0026 OEM Boards TOWER ELEVATOR BOARDS | |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | QFP | BGA | QFP | QFP | QFP | BGA |
包装说明 | 14 X 14 MM, ROHS COMPLIANT, LQFP-100 | 10 X 10 MM, ROHS COMPLIANT, MAPBGA-81 | 14 X 14 MM, ROHS COMPLIANT, LQFP-100 | 12 X 12 MM, ROHS COMPLIANT, LQFP-80 | 12 X 12 MM, ROHS COMPLIANT, LQFP-80 | 10 X 10 MM, ROHS COMPLIANT, MAPBGA-81 |
针数 | 100 | 81 | 100 | 80 | 80 | 81 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
具有ADC | YES | YES | YES | YES | YES | YES |
位大小 | 32 | 32 | 32 | 32 | 32 | 32 |
CPU系列 | COLDFIRE | COLDFIRE | COLDFIRE | COLDFIRE | COLDFIRE | COLDFIRE |
最大时钟频率 | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
DAC 通道 | YES | YES | YES | YES | YES | YES |
DMA 通道 | NO | NO | NO | NO | NO | NO |
JESD-30 代码 | S-PQFP-G100 | S-PBGA-B81 | S-PQFP-G100 | S-PQFP-G80 | S-PQFP-G80 | S-PBGA-B81 |
长度 | 14 mm | 10 mm | 14 mm | 12 mm | 12 mm | 10 mm |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 |
I/O 线路数量 | 68 | 48 | 68 | 49 | 49 | 48 |
端子数量 | 100 | 81 | 100 | 80 | 80 | 81 |
最高工作温度 | 105 °C | 85 °C | 85 °C | 105 °C | 85 °C | 105 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
PWM 通道 | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LFQFP | LBGA | LFQFP | LFQFP | LFQFP | LBGA |
封装等效代码 | QFP100,.63SQ,20 | BGA81,9X9,40 | QFP100,.63SQ,20 | QFP80,.55SQ,20 | QFP80,.55SQ,20 | BGA81,9X9,40 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 |
电源 | 2/3.3 V | 2/3.3 V | 2/3.3 V | 2/3.3 V | 2/3.3 V | 2/3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 32768 | 32768 | 32768 | 32768 | 32768 | 32768 |
ROM(单词) | 262144 | 262144 | 262144 | 262144 | 131072 | 262144 |
ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
座面最大高度 | 1.7 mm | 1.52 mm | 1.7 mm | 1.6 mm | 1.6 mm | 1.52 mm |
速度 | 50.33 MHz | 50.33 MHz | 50.33 MHz | 50.33 MHz | 50.33 MHz | 50.33 MHz |
最大压摆率 | 48 mA | 48 mA | 48 mA | 48 mA | 48 mA | 48 mA |
最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
标称供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) | Tin/Silver/Copper - with Nickel barrier | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Silver/Copper - with Nickel barrier |
端子形式 | GULL WING | BALL | GULL WING | GULL WING | GULL WING | BALL |
端子节距 | 0.5 mm | 1 mm | 0.5 mm | 0.5 mm | 0.5 mm | 1 mm |
端子位置 | QUAD | BOTTOM | QUAD | QUAD | QUAD | BOTTOM |
处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | 40 |
宽度 | 14 mm | 10 mm | 14 mm | 12 mm | 12 mm | 10 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
JESD-609代码 | e3 | - | e3 | e3 | e3 | - |
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