Encoder, HCT Series, 9-Bit, CMOS, CDIP16
参数名称 | 属性值 |
厂商名称 | Harris |
包装说明 | , |
Reach Compliance Code | unknown |
其他特性 | 9 TO 4 LINE PRIORITY ENCODER; RADIATION HARDENED |
系列 | HCT |
JESD-30 代码 | R-CDIP-T16 |
JESD-609代码 | e4 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | ENCODER |
位数 | 9 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
传播延迟(tpd) | 32 ns |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | GOLD |
端子形式 | THROUGH-HOLE |
端子位置 | DUAL |
总剂量 | 100k Rad(Si) V |
Base Number Matches | 1 |
5962R9574101VEC | 5962R9574101VXC | 5962R9574101VXX | 5962R9574101VEX | HCTS147DMSH | HCTS147KMSH | |
---|---|---|---|---|---|---|
描述 | Encoder, HCT Series, 9-Bit, CMOS, CDIP16 | Encoder, HCT Series, 9-Bit, CMOS, CDFP16 | Encoder, HCT Series, 9-Bit, CMOS, CDFP16 | Encoder, HCT Series, 9-Bit, CMOS, CDIP16 | Encoder, HCT Series, 9-Bit, CMOS, CDIP16 | Encoder, HCT Series, 9-Bit, CMOS, CDFP16 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
其他特性 | 9 TO 4 LINE PRIORITY ENCODER; RADIATION HARDENED | 9 TO 4 LINE PRIORITY ENCODER; RADIATION HARDENED | 9 TO 4 LINE PRIORITY ENCODER; RADIATION HARDENED | 9 TO 4 LINE PRIORITY ENCODER; RADIATION HARDENED | 9 TO 4 LINE PRIORITY ENCODER; RADIATION HARDENED | 9 TO 4 LINE PRIORITY ENCODER; RADIATION HARDENED |
系列 | HCT | HCT | HCT | HCT | HCT | HCT |
JESD-30 代码 | R-CDIP-T16 | R-CDFP-F16 | R-CDFP-F16 | R-CDIP-T16 | R-CDIP-T16 | R-CDFP-F16 |
逻辑集成电路类型 | ENCODER | ENCODER | ENCODER | ENCODER | ENCODER | ENCODER |
位数 | 9 | 9 | 9 | 9 | 9 | 9 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | FLATPACK | FLATPACK | IN-LINE | IN-LINE | FLATPACK |
传播延迟(tpd) | 32 ns | 32 ns | 32 ns | 32 ns | 40 ns | 40 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | YES | NO | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
厂商名称 | Harris | Harris | - | Harris | Harris | Harris |
负载电容(CL) | 50 pF | 50 pF | - | - | 50 pF | 50 pF |
总剂量 | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | - | - |
Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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