UMBER
TYPE
GS-12-675
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
1.25 mm pitch SMT Wire to Board Connector
1 of 7
AUTHORIZED BY
DATE
A
11/9/10
Jason Hsu
CLASSIFICATION
UNRESTRICTED
1.0
SCOPE
This specification covers performance, tests and quality requirements for 1.25 mm pitch Wire to Board
DIP & SMT Type of 10114826~10114831 Series.
2.0
REFERENCE DOCUMENTS
EIA-364 ELECTRONICS INDUSTRIES ASSOCIATION
3.0
DEFINITIONS
3.1
Design and Construction
Product shall be of design, construction and physical dimensions specified on applicable
product drawing.
All materials conform to RoHS
3.2
Materials and Finish
3.2.1 Contact: Copper alloy
Finish: (a) Contact Area: Based on drawing specification.
(b) Under plate: Nickel-plated all over.
(c) Solder area: Based on drawing specification.
3.2.2 Housing: Thermoplastic or Thermoplastic High Temp., UL94V-0 and meet IEC 60695-2
glowing/hot wire test.
3.2.3 M.H.D: Copper Alloy, Plating based on drawing specification.
3.3
Ratings
Voltage: 125 Volts AC (per pin)
Current: 1 Amp (0.8 A --32 AWG)
3.3.1
3.3.2
4.0
REQUIREMENTS
4.1 Test Requirements and Procedures Summary
Item
Examination of Product
Requirement
Standard
Product shall meet requirements Visual, dimensional and functional
of applicable product drawing
per applicable quality inspection
and specification.
plan.
ELECTRICAL
Item
Low-signal Level
Contact Resistance
Requirement
20 m
Ω
Max.(initial)per contact
40 m
Ω
Max. after test
Standard
Mate connectors, measure by dry
circuit, 20mV Max., 100mA
Max. (EIA-364-23)
PDS: Rev :A
Copyright FCI.
Form E-3701 – Revision B
STATUS:Released
GS-01-029 – Revision A
Printed: Apr 05, 2012
UMBER
TYPE
GS-12-675
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
1.25 mm pitch SMT Wire to Board Connector
2 of 7
AUTHORIZED BY
DATE
A
11/9/10
Jason Hsu
CLASSIFICATION
UNRESTRICTED
Insulation Resistance
Dielectric
Withstanding Voltage
Unmated connectors, apply
100 M
Ω
Min.
500 V DC between adjacent terminals.
(EIA-364-21)
500 VAC Min. at sea level
Test between adjacent contacts of
for 1 minute.
unmated connectors.
No discharge, flashover or (EIA-364-20)
breakdown.
Current leakage: 1 mA max.
MECHANICAL
Item
Requirement
Standard
The sample should be mounted in the
tester and fully mated and unmated the
number of cycles specified at the rate of
25.4 ± 3mm/min.
(EIA-364-09)
Operation Speed：
25.4 ± 3 mm/minute..
Measure the force required to
mate/Unmate connector.
(EIA-364-13)
Apply axial pull out force at the speed rate
of 25.4 ± 3 mm/minute. On the terminal
assembled in the housing.
Apply axial pull out force at the speed rate
of 25.4 ± 3 mm/minute. On the hold down
assembled in the housing.
Apply axial pull out force at the speed rate
of 25.4 ± 3 mm/minute. On the terminal
assembled in the housing.
Apply axial pull out force at the speed rate
of 25.4 ± 3 mm/minute. On the terminal
assembled in the housing.
Durability
30 cycles.
Insertion/Withdrawal Force
See Section 7.
Contact
Retention Force
Hold down /Housing
Retention Force
Wire
Retention Force
0.5kgf MIN.
1.0kgf MIN.
0.5kgf MIN.
Terminal / Housing
Retention Force
0.5kgf MIN.
PDS: Rev :A
Copyright FCI.
Form E-3701 – Revision B
STATUS:Released
GS-01-029 – Revision A
Printed: Apr 05, 2012
UMBER
TYPE
GS-12-675
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
1.25 mm pitch SMT Wire to Board Connector
3 of 7
AUTHORIZED BY
DATE
A
11/9/10
Jason Hsu
CLASSIFICATION
UNRESTRICTED
Vibration
1 µs Max.
The electrical load condition shall be 100
mA maximum for all contacts. Subject to
a simple harmonic motion having
amplitude of 0.76mm (1.52mm maximum
total excursion) in frequency between
the limits of 10 and 55 Hz. The entire
frequency range, from 10 to 55 Hz and
return to 10 Hz, shall be traversed in
approximately 1 minute. This motion
shall be applied for 2 hours in each of
three mutually perpendicular directions.
(EIA-364-28 Condition I)
Shock (Mechanical)
1 µs Max.
Subject mated connectors to
50 G’s (peak value) half-sine shock
pulses of 11 milliseconds duration.
Three shocks in each direction shall be
applied along the three mutually
perpendicular axes of the test specimen
(18 shocks). The electrical load
condition shall be 100mA maximum for
all contacts.
(EIA-364-27, test condition A)
ENVIRONMENTAL
Item
Resistance to Reflow
Soldering Heat
Resistance to Hand
Soldering Heat
Requirement
See Product Qualification and
Test Sequence Group 9 (Lead
Free)
Excessive pressure shall not
be applied to the terminals.
See Product Qualification and
Test Sequence Group 10
Standard
Pre Heat：150℃~180℃, 60~90sec.
Heat：230℃ Min., 40sec Min.
Peak Temp.：260℃Max, 10sec Max.
Soldering iron：350±10℃
Duration：3~4 sec. at least
Thermal Shock
Humidity
PDS: Rev :A
Copyright FCI.
Form E-3701 – Revision B
Mate module and subject to follow
condition for 5 cycles.
See Product Qualification and 1 cycles:
-40 +0/-3 , 30 minutes
Test Sequence Group 3
+85 +3/-0 , 30 minutes
(EIA-364-32, test condition A)
Mated Connector
See Product Qualification and
40℃, 90~95% RH, 96 hours
Test Sequence Group 3
(EIA-364-31, test condition A)
STATUS:Released
Printed: Apr 05, 2012
GS-01-029 – Revision A
UMBER
TYPE
GS-12-675
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
1.25 mm pitch SMT Wire to Board Connector
4 of 7
AUTHORIZED BY
DATE
A
11/9/10
Jason Hsu
CLASSIFICATION
UNRESTRICTED
Subject mated connectors to
See Product Qualification and temperature life at 105 for 96 hours.
Temperature life
Test Sequence Group 4
Measure Signal.
(EIA-364-17, Test condition A)
Subject mated/unmated connectors to
See Product Qualification and 5% salt-solution concentration, 35 for
Salt Spray
Test Sequence Group 5
48 hours.
(EIA-364-26, Test condition B)
Solder able area shall have
And then into solder bath, Temperature
Solder ability
minimum of 95% solder
at 245 ±5 , for 4-5 sec.
coverage.
Note. Flowing Mixed Gas shell be conduct by customer request.
5.0
INFRARED REFLOW CONDITION
5.1 Lead-Free Process
PDS: Rev :A
Copyright FCI.
Form E-3701 – Revision B
STATUS:Released
GS-01-029 – Revision A
Printed: Apr 05, 2012
UMBER
TYPE
GS-12-675
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
1.25 mm pitch SMT Wire to Board Connector
5 of 7
AUTHORIZED BY
DATE
A
11/9/10
Jason Hsu
CLASSIFICATION
UNRESTRICTED
6.0 PRODUCT QUALIFICATION AND TEST SEQUENCES
Test Group
Test or Examination
1
2
3
4
5
6
7
8
9
10
Test Sequence
Examination of Product
Low-signal Level Contact Resistance
Insulation Resistance
Dielectric Withstanding Voltage
Insertion / Withdrawal Force
Durability
Contact Retention Force (Wafer)
Vibration(Random) / Vibration
Shock (Mechanical)
Thermal Shock
Humidity
Temperature life
Salt Spray
Solder ability
Wire Retention Force
Terminal / Housing Retention Force
Metal Hold-Down /Housing Retention
Force
Resistance to Reflow Soldering Heat
Resistance to Hand Soldering Heat
Sample Size
4
4
4
4
4
2
4
4
4
2
2
2
4
2
3
5
6
5
3
1
1
2
2、4
3
1
1、7 1、6 1、4
1、5 1、4 2、10 2、9 2、5
3、9 3、8
4、8 4、7
1
3
1
PDS: Rev :A
Copyright FCI.
Form E-3701 – Revision B
STATUS:Released
GS-01-029 – Revision A
Printed: Apr 05, 2012
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