262,263-Word x 4-Bit Field Memory
| 参数名称 | 属性值 |
| 厂商名称 | OKI |
| 零件包装代码 | SOJ |
| 包装说明 | SOJ, |
| 针数 | 20 |
| Reach Compliance Code | unknow |
| 其他特性 | INTERNAL 4 X 512 ROWS X 512 COLUMNS OF DRAM CELLS; SELF REFRESH |
| JESD-30 代码 | R-PDSO-J20 |
| 长度 | 17.15 mm |
| 内存密度 | 1048576 bi |
| 内存集成电路类型 | MEMORY CIRCUIT |
| 内存宽度 | 4 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX4 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOJ |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.55 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |

| MSM514221B-30JS | MSM514221B-30RS | MSM514221B-30ZS | MSM514221B-40JS | MSM514221B-40RS | MSM514221B-40ZS | MSM514221B-60JS | MSM514221B-60RS | MSM514221B-60ZS | MSM514221B | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 262,263-Word x 4-Bit Field Memory | 262,263-Word x 4-Bit Field Memory | 262,263-Word x 4-Bit Field Memory | 262,263-Word x 4-Bit Field Memory | 262,263-Word x 4-Bit Field Memory | 262,263-Word x 4-Bit Field Memory | 262,263-Word x 4-Bit Field Memory | 262,263-Word x 4-Bit Field Memory | 262,263-Word x 4-Bit Field Memory | 262,263-Word x 4-Bit Field Memory |
| 厂商名称 | OKI | - | OKI | OKI | OKI | OKI | OKI | OKI | OKI | - |
| 零件包装代码 | SOJ | DIP | ZIP | SOJ | DIP | ZIP | SOJ | DIP | ZIP | - |
| 包装说明 | SOJ, | DIP, | DIP, | SOJ, | DIP, | DIP, | SOJ, | DIP, | DIP, | - |
| 针数 | 20 | 16 | 20 | 20 | 16 | 20 | 20 | 16 | 20 | - |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow | - |
| 其他特性 | INTERNAL 4 X 512 ROWS X 512 COLUMNS OF DRAM CELLS; SELF REFRESH | INTERNAL 4 X 512 ROWS X 512 COLUMNS OF DRAM CELLS; SELF REFRESH | INTERNAL 4 X 512 ROWS X 512 COLUMNS OF DRAM CELLS; SELF REFRESH | INTERNAL 4 X 512 ROWS X 512 COLUMNS OF DRAM CELLS; SELF REFRESH | INTERNAL 4 X 512 ROWS X 512 COLUMNS OF DRAM CELLS; SELF REFRESH | INTERNAL 4 X 512 ROWS X 512 COLUMNS OF DRAM CELLS; SELF REFRESH | INTERNAL 4 X 512 ROWS X 512 COLUMNS OF DRAM CELLS; SELF REFRESH | INTERNAL 4 X 512 ROWS X 512 COLUMNS OF DRAM CELLS; SELF REFRESH | INTERNAL 4 X 512 ROWS X 512 COLUMNS OF DRAM CELLS; SELF REFRESH | - |
| JESD-30 代码 | R-PDSO-J20 | R-PDIP-T16 | R-PZIP-T20 | R-PDSO-J20 | R-PDIP-T16 | R-PZIP-T20 | R-PDSO-J20 | R-PDIP-T16 | R-PZIP-T20 | - |
| 长度 | 17.15 mm | 19.05 mm | 25.5 mm | 17.15 mm | 19.05 mm | 25.5 mm | 17.15 mm | 19.05 mm | 25.5 mm | - |
| 内存密度 | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | - |
| 内存集成电路类型 | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | - |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 端子数量 | 20 | 16 | 20 | 20 | 16 | 20 | 20 | 16 | 20 | - |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | - |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | - |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | - |
| 组织 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | SOJ | DIP | DIP | SOJ | DIP | DIP | SOJ | DIP | DIP | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 3.55 mm | 5.08 mm | 10.16 mm | 3.55 mm | 5.08 mm | 10.16 mm | 3.55 mm | 5.08 mm | 10.16 mm | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 表面贴装 | YES | NO | NO | YES | NO | NO | YES | NO | NO | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - |
| 端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | - |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | - |
| 端子位置 | DUAL | DUAL | ZIG-ZAG | DUAL | DUAL | ZIG-ZAG | DUAL | DUAL | ZIG-ZAG | - |
| 宽度 | 7.62 mm | 7.62 mm | 2.8 mm | 7.62 mm | 7.62 mm | 2.8 mm | 7.62 mm | 7.62 mm | 2.8 mm | - |
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