Buffers u0026 Line Drivers 3.3V BUF/LN DRVR N-INV 3S
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | BGA |
包装说明 | VFBGA, BGA56,6X10,25 |
针数 | 56 |
制造商包装代码 | SOT702-1 |
Reach Compliance Code | not_compliant |
控制类型 | ENABLE LOW |
系列 | LVC/LCX/Z |
JESD-30 代码 | R-PBGA-B56 |
JESD-609代码 | e0 |
长度 | 7 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | BUS DRIVER |
最大I(ol) | 0.024 A |
湿度敏感等级 | 2 |
位数 | 4 |
功能数量 | 4 |
端口数量 | 2 |
端子数量 | 56 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | VFBGA |
封装等效代码 | BGA56,6X10,25 |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
包装方法 | TAPE AND REEL |
峰值回流温度(摄氏度) | 240 |
电源 | 3.3 V |
Prop。Delay @ Nom-Sup | 5.5 ns |
传播延迟(tpd) | 6 ns |
认证状态 | Not Qualified |
座面最大高度 | 1 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 1.2 V |
标称供电电压 (Vsup) | 2.7 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Tin/Lead (Sn63Pb37) |
端子形式 | BALL |
端子节距 | 0.65 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | 20 |
宽度 | 4.5 mm |
Base Number Matches | 1 |
74LVC16244AEV | 74LVC16244ADL | 74LVC16244ADL-T | 74LVC16244ADL112 | 74LVC16244ADL118 | 74LVC16244AEV-S | 74LVC16244AEV157 | 74LVC16244AEVY | 74LVCH16244AEVK | |
---|---|---|---|---|---|---|---|---|---|
描述 | Buffers u0026 Line Drivers 3.3V BUF/LN DRVR N-INV 3S | Buffers u0026 Line Drivers 3.3V 16-BIT DRVR 3-S | Buffers u0026 Line Drivers 3.3V 16-BIT DRVR 3-S | Switching Voltage Regulators 2A Dual Non-Synch Buck Conv | Voltage References 2.048V u0026 2.5V Bandgap | Buffers u0026 Line Drivers 3.3V BUF/LN DRVR N-INV 3S | Buffers u0026 Line Drivers 3.3V BUF/LN DRVR | Buffers u0026 Line Drivers 74LVC16244AEV/VFBGA56/REEL 13 | Buffers u0026 Line Drivers 74LVCH16244AEV/VFBGA56/STANDAR |
是否Rohs认证 | 不符合 | 符合 | 符合 | - | - | 不符合 | - | 不符合 | 不符合 |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | - | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) |
零件包装代码 | BGA | SSOP | SSOP | - | - | - | - | BGA | BGA |
包装说明 | VFBGA, BGA56,6X10,25 | SSOP, SSOP48,.4 | SSOP, SSOP48,.4 | - | - | FBGA, BGA56,6X10,25 | - | VFBGA, BGA56,6X10,25 | VFBGA, BGA56,6X10,25 |
针数 | 56 | 48 | 48 | - | - | - | - | 56 | 56 |
Reach Compliance Code | not_compliant | unknown | unknown | - | - | unknown | - | unknown | unknown |
控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | - | - | ENABLE LOW | - | ENABLE LOW | ENABLE LOW |
系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | - | - | - | - | LVC/LCX/Z | LVC/LCX/Z |
JESD-30 代码 | R-PBGA-B56 | R-PDSO-G48 | R-PDSO-G48 | - | - | R-PBGA-B56 | - | R-PBGA-B56 | R-PBGA-B56 |
JESD-609代码 | e0 | e4 | e4 | - | - | - | - | e0 | e0 |
长度 | 7 mm | 15.875 mm | 15.875 mm | - | - | - | - | 7 mm | 7 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF | - | - | 50 pF | - | 50 pF | 50 pF |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | - | - | BUS DRIVER | - | BUS DRIVER | BUS DRIVER |
最大I(ol) | 0.024 A | 0.024 A | 0.024 A | - | - | 0.024 A | - | 0.024 A | 0.024 A |
位数 | 4 | 4 | 4 | - | - | 4 | - | 4 | 4 |
功能数量 | 4 | 4 | 4 | - | - | 4 | - | 4 | 4 |
端口数量 | 2 | 2 | 2 | - | - | - | - | 2 | 2 |
端子数量 | 56 | 48 | 48 | - | - | 56 | - | 56 | 56 |
最高工作温度 | 125 °C | 125 °C | 125 °C | - | - | 125 °C | - | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | - | - | -40 °C | - | -40 °C | -40 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | - | - | 3-STATE | - | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | - | - | TRUE | - | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | VFBGA | SSOP | SSOP | - | - | FBGA | - | VFBGA | VFBGA |
封装等效代码 | BGA56,6X10,25 | SSOP48,.4 | SSOP48,.4 | - | - | BGA56,6X10,25 | - | BGA56,6X10,25 | BGA56,6X10,25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | - | - | GRID ARRAY, FINE PITCH | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
包装方法 | TAPE AND REEL | TUBE | TAPE AND REEL | - | - | TRAY | - | TAPE AND REEL | TRAY |
电源 | 3.3 V | 3.3 V | 3.3 V | - | - | 3.3 V | - | 3.3 V | 3.3 V |
Prop。Delay @ Nom-Sup | 5.5 ns | 5.5 ns | 5.5 ns | - | - | 5.5 ns | - | 5.5 ns | 5.5 ns |
传播延迟(tpd) | 6 ns | 6 ns | 6 ns | - | - | - | - | 6 ns | 6 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | - | Not Qualified | Not Qualified |
座面最大高度 | 1 mm | 2.8 mm | 2.8 mm | - | - | - | - | 1 mm | 1 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | - | - | - | - | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 1.2 V | 1.2 V | 1.2 V | - | - | - | - | 1.2 V | 1.2 V |
标称供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | - | - | 3.3 V | - | 2.7 V | 2.7 V |
表面贴装 | YES | YES | YES | - | - | YES | - | YES | YES |
技术 | CMOS | CMOS | CMOS | - | - | CMOS | - | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | - | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | Tin/Lead (Sn63Pb37) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - | - | - | - | TIN LEAD | TIN LEAD |
端子形式 | BALL | GULL WING | GULL WING | - | - | BALL | - | BALL | BALL |
端子节距 | 0.65 mm | 0.635 mm | 0.635 mm | - | - | 0.635 mm | - | 0.65 mm | 0.65 mm |
端子位置 | BOTTOM | DUAL | DUAL | - | - | BOTTOM | - | BOTTOM | BOTTOM |
宽度 | 4.5 mm | 7.5 mm | 7.5 mm | - | - | - | - | 4.5 mm | 4.5 mm |
Base Number Matches | 1 | 1 | 1 | - | - | 1 | - | 1 | 1 |
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