
Gate Drivers
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Microchip(微芯科技) |
| 包装说明 | HLSOP, |
| Reach Compliance Code | compliant |
| Factory Lead Time | 10 weeks |
| 内置保护 | TRANSIENT |
| 接口集成电路类型 | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 4.93 mm |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出电流流向 | SOURCE AND SINK |
| 标称输出峰值电流 | 1.5 A |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HLSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE |
| 峰值回流温度(摄氏度) | 260 |
| 座面最大高度 | 1.68 mm |
| 最大供电电压 | 20 V |
| 最小供电电压 | 4.5 V |
| 电源电压1-最大 | 20 V |
| 电源电压1-分钟 | 4.5 V |
| 表面贴装 | YES |
| 技术 | BCDMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 断开时间 | 0.07 µs |
| 接通时间 | 0.06 µs |
| 宽度 | 3.94 mm |

| MIC4126YME-TR | MIC4126YML-TR | MIC4126YMME-TR | MIC4127YMME | MIC4126YME | MIC4128YMME-TR | MIC4128YML-TR | |
|---|---|---|---|---|---|---|---|
| 描述 | Gate Drivers | Gate Drivers | Gate Drivers | Audio Transformers / Signal Transformers MID-SN6501 TI Driver Toroid .475mH 5VDC | Temperature Sensor Development Tools SHT31 Smart Gadget | Gate Drivers | Gate Drivers |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | HLSOP, | HVSON, | HTSSOP, | HTSSOP, TSOP8,.20,25 | HLSOP, | MSOP-8 | MLF-8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| Factory Lead Time | 10 weeks | 13 weeks | 13 weeks | 10 weeks | 10 weeks | 10 weeks | 10 weeks |
| 接口集成电路类型 | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | FULL BRIDGE BASED MOSFET DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
| JESD-30 代码 | R-PDSO-G8 | S-PDSO-N8 | S-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 | S-PDSO-N8 |
| JESD-609代码 | e3 | e4 | e3 | e3 | e3 | e3 | e4 |
| 长度 | 4.93 mm | 2 mm | 3 mm | 3 mm | 4.93 mm | 3 mm | 2 mm |
| 功能数量 | 1 | 1 | 1 | 2 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 标称输出峰值电流 | 1.5 A | 1.5 A | 1.5 A | 1.5 A | 1.5 A | 1.5 A | 1.5 A |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HLSOP | HVSON | HTSSOP | HTSSOP | HLSOP | HTSSOP | HVSON |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 座面最大高度 | 1.68 mm | 0.9 mm | 1.1 mm | 1.14 mm | 1.68 mm | 1.1 mm | 0.9 mm |
| 最大供电电压 | 20 V | 20 V | 20 V | 20 V | 20 V | 20 V | 20 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | BCDMOS | BCDMOS | BCDMOS | BCDMOS | BCDMOS | BCDMOS | BCDMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Matte Tin (Sn) - annealed | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD |
| 端子节距 | 1.27 mm | 0.5 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 3.94 mm | 2 mm | 3 mm | 3 mm | 3.94 mm | 3 mm | 2 mm |
| 厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
| 内置保护 | TRANSIENT | TRANSIENT | TRANSIENT | - | TRANSIENT | TRANSIENT | TRANSIENT |
| 输出电流流向 | SOURCE AND SINK | SOURCE AND SINK | SOURCE AND SINK | - | SOURCE AND SINK | SOURCE AND SINK | SOURCE AND SINK |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | - | 260 | 260 | 260 |
| 电源电压1-最大 | 20 V | 20 V | 20 V | - | 20 V | 20 V | 20 V |
| 电源电压1-分钟 | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V |
| 处于峰值回流温度下的最长时间 | 30 | 40 | 40 | - | 40 | 40 | 40 |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 湿度敏感等级 | - | 1 | 3 | 3 | 2 | 3 | 1 |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | - | 18 V | 18 V | - | 18 V | 18 V | 18 V |
| 电源电压1-Nom | - | 18 V | 18 V | - | 18 V | 18 V | 18 V |
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