Continuous Power Dissipation (Note 1) ..............................5.3W
Operating Case Temperature Range (Note 4) .. -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Note 1:
Based on junction temperature T
J
= T
C
+ (B
JC
x V
CC
x I
CC
). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the
Applications Information
section for details. The junction
temperature must not exceed +150NC.
Note 2:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Note 3:
Junction temperature T
J
= T
A
+ (B
JA
x V
CC
x I
CC
). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150NC.
Note 4:
T
C
is the temperature on the exposed pad of the package. T
A
is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
+5V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical
Application Circuit,
V
CC
= V
CC_AMP_1
= V
CC_AMP_2
= V
CC_RG
= +4.75V to +5.25V, AMPSET = 0, PD_1 = PD_2 = 0, T
C
=
-40NC to +85NC. Typical values are at V
CC_
= +5.0V and T
C
= +25NC, unless otherwise noted.)
PARAMETER
Supply Voltage
Supply Current
Power-Down Current
Input Low Voltage
Input High Voltage
Input Logic Current
SYMBOL
V
CC
I
DC
I
DCPD
V
IL
V
IH
I
IH
, I
IL
1.7
-1
PD_1 = PD_2 = 1, V
IH
= 3.3V
CONDITIONS
MIN
4.75
TYP
5
148
5.2
MAX
5.25
205
8
0.5
3.465
+1
UNITS
V
mA
mA
V
V
FA
+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical
Application Circuit,
V
CC
= V
CC_AMP_1
= V
CC_AMP_2
= V
CC_RG
= +3.135V to +3.465V, AMPSET = 1, PD_1 = PD_2 = 0, T
C
= -40NC to +85NC. Typical values are at V
CC_
= +3.3V and T
C
= +25NC, unless otherwise noted.)
PARAMETER
Supply Voltage
Supply Current
Power-Down Current
Input Low Voltage
Input High Voltage
SYMBOL
V
CC
I
DC
I
DCPD
V
IL
V
IH
1.7
PD_1 = PD_2 = 1, V
IH
= 3.3V
CONDITIONS
MIN
3.135
TYP
3.3
88
4.3
MAX
3.465
145
8
0.5
3.465
UNITS
V
mA
mA
V
V
2
Maxim Integrated
MAX2063
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Digital VGA
RECOMMENDED AC OPERATING CONDITIONS
PARAMETER
RF Frequency
SYMBOL
f
RF
(Note 5)
CONDITIONS
MIN
50
TYP
MAX
1000
UNITS
MHz
+5V SUPPLY AC ELECTRICAL CHARACTERISTICS
(Typical
Application Circuit,
V
CC
= V
CC_AMP_1
= V
CC_AMP_2
= V
CC_RG
= +4.75V to +5.25V, attenuators are set for maximum gain,
RF ports are driven from 50I sources, AMPSET = 0, PD_1 = PD_2 = 0, 100MHz
≤
f
RF
≤
500MHz, T
C
= -40NC to +85NC. Typical
values are at maximum gain setting, V
CC_
= +5.0V, P
IN
= -20dBm, f
RF
= 350MHz, and T
C
= +25NC, unless otherwise noted.) (Note 6)
PARAMETER
SYMBOL
f
RF
= 50MHz
f
RF
= 100MHz
f
RF
= 200MHz
Small-Signal Gain
G
f
RF
= 350MHz, T
C
= +25NC
f
RF
= 450MHz
f
RF
= 750MHz
f
RF
= 900MHz
Gain vs. Temperature
From 100MHz to 200MHz
Gain Flatness vs. Frequency
Any 100MHz frequency band from
200MHz to 500MHz
f
RF
= 50MHz
f
RF
= 100MHz
f
RF
= 200MHz
Noise Figure
NF
f
RF
= 350MHz
f
RF
= 450MHz
f
RF
= 750MHz
f
RF
= 900MHz
Total Attenuation Range
Output Second-Order Intercept
Point (Minimum Attenuation)
OIP2
P
OUT
= 0dBm/tone,
Df
= 1MHz, f
1
+ f
2
RF input 1 amplified power measured at
RF output 2 relative to RF output 1, all
unused ports terminated to 50I
RF input 2 amplified power measured at
RF output 1 relative to RF output 2, all
unused ports terminated to 50I
18
CONDITIONS
MIN
TYP
22.0
21.7
21.3
21.0
20.8
19.9
18.3
-0.006
0.35
0.25
5.2
5.4
5.6
5.8
5.9
6.4
6.7
30.8
51.6
dB
dBm
dB
dB
dB/NC
23
dB
MAX
UNITS
48.8
dB
49.4
Path Isolation
Maxim Integrated
3
MAX2063
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Digital VGA
+5V SUPPLY AC ELECTRICAL CHARACTERISTICS (continued)
(Typical
Application Circuit,
V
CC
= V
CC_AMP_1
= V
CC_AMP_2
= V
CC_RG
= +4.75V to +5.25V, attenuators are set for maximum gain,
RF ports are driven from 50I sources, AMPSET = 0, PD_1 = PD_2 = 0, 100MHz
≤
f
RF
≤
500MHz, T
C
= -40NC to +85NC. Typical
values are at maximum gain setting, V
CC_
= +5.0V, P
IN
= -20dBm, f
RF
= 350MHz, and T
C
= +25NC, unless otherwise noted.) (Note 6)
PARAMETER
SYMBOL
CONDITIONS
P
OUT
= 0dBm/tone,
Df
= 1MHz, f
RF
= 50MHz
P
OUT
= 0dBm/tone,
Df
= 1MHz, f
RF
= 100MHz
P
OUT
= 0dBm/tone,
Df
= 1MHz, f
RF
= 200MHz
Output Third-Order Intercept
Point
OIP3
P
OUT
= 0dBm/tone,
Df
= 1MHz, f
RF
= 350MHz
P
OUT
= 0dBm/tone,
Df
= 1MHz, f
RF
= 450MHz
P
OUT
= 0dBm/tone,
Df
= 1MHz, f
RF
= 750MHz
P
OUT
= 0dBm/tone,
Df
= 1MHz, f
RF
= 900MHz
Output -1dB Compression Point
Second Harmonic
Third Harmonic
Group Delay
Amplifier Power-Down Time
Amplifier Power-Up Time
Input Return Loss
Output Return Loss
Insertion Loss
Input Second-Order Intercept
Point
Input Third-Order Intercept
Point
Attenuation Range
Step Size
Relative Attenuation Accuracy
Absolute Attenuation Accuracy
0dB to 16dB
Insertion Phase Step
f
RF
= 170MHz
0dB to 24dB
0dB to 31dB
RL
IN
RL
OUT
IL
IIP2
IIP3
P
RF1
= 0dBm, P
RF2
= 0dBm (minimum
attenuation),
Df
= 1MHz, f
1
+ f
2
P
IN1
= 0dBm, P
IN2
= 0dBm (minimum
attenuation),
Df
= 1MHz
P
1dB
HD2
HD3
(Note 7)
P
OUT
= +3dBm
P
OUT
= +3dBm
Includes EV kit PCB delays
PD_1 or PD_2 from 0 to 1, amplifier DC
supply current settles to within 0.1mA
PD_1 or PD_2 from 1 to 0, amplifier DC
supply current settles to within 1%
50I source
50I load
MIN
TYP
47.1
43.9
41.0
37.0
35.2
28.7
26.5
18.8
-54.8
-72.9
0.87
0.5
0.5
23.3
24.4
3.0
53.1
43.2
30.8
1
0.11
0.23
-0.4
0.6
0.9
Degrees
dBm
dBc
dBc
ns
Fs
Fs
dB
dB
dB
dBm
dBm
dB
dB
dB
dB
dBm
MAX
UNITS
DIGITAL ATTENUATOR (each path, unless otherwise noted)
4
Maxim Integrated
MAX2063
Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Digital VGA
+5V SUPPLY AC ELECTRICAL CHARACTERISTICS (continued)
(Typical
Application Circuit,
V
CC
= V
CC_AMP_1
= V
CC_AMP_2
= V
CC_RG
= +4.75V to +5.25V, attenuators are set for maximum gain,
RF ports are driven from 50I sources, AMPSET = 0, PD_1 = PD_2 = 0, 100MHz
≤
f
RF
≤
500MHz, T
C
= -40NC to +85NC. Typical
values are at maximum gain setting, V
CC_
= +5.0V, P
IN
= -20dBm, f
RF
= 350MHz, and T
C
= +25NC, unless otherwise noted.) (Note 6)
PARAMETER
Amplitude Overshoot/
Undershoot
Switching Speed
Input Return Loss
Output Return Loss
Maximum Clock Speed
Data-to-Clock Setup Time
Data-to-Clock Hold Time
Clock-to-CS Setup Time
CS
Positive Pulse Width
CS
Setup Time
Clock Pulse Width
RL
IN
RL
OUT
f
CLK
t
CS
t
CH
t
ES
t
EW
t
EWS
t
CW
SYMBOL
Between any
two states
RF settled to
within
Q0.1dB
50I source
50I load
CONDITIONS
Elapsed time = 15ns
Elapsed time = 40ns
31dB to 0dB
0dB to 31dB
MIN
TYP
1.0
0.05
25
21
21.6
21.2
20
2
2.5
3
7
3.5
5
MAX
UNITS
dB
ns
dB
dB
MHz
ns
ns
ns
ns
ns
ns
SERIAL PERIPHERAL INTERFACE (SPI)
+3.3V SUPPLY AC ELECTRICAL CHARACTERISTICS
(Typical
Application Circuit,
V
CC
= V
CC_AMP_1
= V
CC_AMP_2
= V
CC_RG
= +3.3V, attenuators are set for maximum gain, RF ports
are driven from 50I sources, AMPSET = 1, PD_1 = PD_2 = 0, 100MHz
≤
fRF
≤
500MHz, T
C
= -40NC to +85NC. Typical values are at
maximum gain setting, V
CC_
= +3.3V, P
IN
= -20dBm, f
RF
= 350MHz, and T
C
= +25NC, unless otherwise noted.) (Note 6)
PARAMETER
Small-Signal Gain
Output Third-Order Intercept
Point
Noise Figure
Total Attenuation Range
RF input 1 amplified power measured at
RF output 2 relative to RF output 1, all
unused ports terminated to 50I
RF input 2 amplified power measured at
RF output 1 relative to RF output 2, all
unused ports terminated to 50I
P
1dB
(Note 7)
SYMBOL
G
OIP3
NF
P
OUT
= 0dBm/tone
CONDITIONS
MIN
TYP
20.9
29.6
5.9
30.8
48.8
dB
49.1
13.4
dBm
MAX
UNITS
dB
dBm
dB
dB
Path Isolation
Output -1dB Compression Point
Note 5:
Operation outside this range is possible, but with degraded performance of some parameters. See the
Typical Operating
Characteristics.
Note 6:
All limits include external component losses. Output measurements are performed at the RF output port of the
Typical
Application Circuit.
Note 7:
It is advisable not to continuously operate RF input 1 or RF input 2 above +15dBm.
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