eTEC Series HV14,18,F0,0102,GG
Thin Film Thermoelectric Module
The eTEC Series is a thin film thermoelectric module (TEM) with high heat flux density.
Due to its size, input power requirements and heat pumping capacity this device is suited
for use in applications to stabilize the temperature of sensitive optical components in
telecom and photonics industries.
The eTEC HV14 can produce 1.3 Watts of cooling capacity at 25°C ambient in a 4 mm
2
footprint. Assembled with thin film semiconductor material and thermally conductive
Aluminum Nitride ceramics, the eTEC Series is designed for lower current applications
with tight geometric space constraints. Custom designs are available to accommodate
metallization, pretin solder and ceramic patterns, however MOQ applies.
FEATURES
•
•
•
•
•
•
Micro Footprint
High Heat Pumping Density
Precise Temperature Control
Reliable Solid State Operation
<2 ms Response Time
RoHS Compliant
APPLICATIONS
•
•
•
•
•
•
Laser Diodes
Photodiodes
Infrared (IR) Sensors
Pump Lasers
Crystal Oscillators
Optical Transceivers
PERFORMANCE SPECIFICATIONS
Hot Side Temperature (°C)
Qmax (Watts)
Delta Tmax (°C)
Imax (Amps)
Vmax (Volts)
Qmax / area (W/cm
2
)
Electrical Resistance (Ohms)
Thermal Resistance (K/W)
PACKAGE ASSEMBLY CONDITIONS
Max Time Exposure > 290°C
Peak Assembly Temperature
TEMPERATURE CONDITIONS
Max Operating Temperature
OPERATING CONDITIONS
Max rate of change of current
1.75 Amps/sec
150°C
60 sec
325°C
25°C
1.3
45
1.0
2.3
64
2.0
46
50°C
1.3
45
0.9
2.5
64
2.3
46
Americas: +1 888.246.9050
Europe: +46.31.420530
Asia: +86.755.2714.1166
clv.customerpos@lairdtech.com
www.lairdtech.com
eTEC Series HV14,18,F0,0102,GG
Thin Film Thermoelectric Module
PERFORMANCE CURVES
COEFFICIENT OF PERFORMANCE
2.31
1.20
0.34
0.68
1.02
0.03
3.57
2.36
Tolerance for all dimensions
+/- 0.02 mm
3.54
2.04
0.06
0.45
0.95
0.52
0.06
ISOMETRIC DRAWING
3.54
0.06
0.40
0.27 0.01 mm
0.60 0.02 mm
0.01
0.27
1.15
Standard
PROPRIETARY AND CONFIDENTIAL
1.89
UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE IN MM
TOLERANCES:
TWO PLACE DECIMAL
0.02
THREE PLACE DECIMAL 0.02
DRAWN
NAME
DATE
Au metallization on exterior ceramic substrate surfaces
Au wire bondable pads on hot side ceramic for lead attachment
CHECKED
ENG APPR.
MFG APPR.
INTERPRET GEOMETRIC
TOLERANCING PER:
MATERIAL
FINISH
Paul Crocco 10/3/2013
TITLE:
Paul Crocco 10/3/2013
A601
1
1
Q.A.
THE INFORMATION CONTAINED IN THIS
DRAWING IS THE SOLE PROPERTY OF
LAIRD ENGINEERED THERMAL SYSTEMS.
ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF
LAIRD ENGINEERED THERMAL SYSTEMS IS
PROHIBITED.
COMMENTS:
SIZE DWG. NO.
NEXT ASSY
USED ON
A
REV
2.04
1
OPERATING TIPS
5
Laird Engineered Thermal Systems
DO NOT SCALE DRAWING
SCALE: 20:1 WEIGHT:
2
SHEET 1 OF 1
UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE IN MM
TOLERANCES:
TWO PLACE DECIMAL
0.02
THREE PLACE DECIMAL 0.02
DRAWN
CHECKED
NAME
DATE
4
3
Paul Crocco 10/4/2013
• Maintain good surface contact on heat dissipation mechanism prior to operation
ENG APPR.
MFG APPR.
TITLE:
Paul Crocco 10/4/2013
A608
1
1
• Do not exceed Vmax or Imax values to maintain peak performance
PROPRIETARY AND CONFIDENTIAL
THE INFORMATION CONTAINED IN THIS
DRAWING IS THE SOLE PROPERTY OF
LAIRD ENGINEERED THERMAL SYSTEMS.
ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF
LAIRD ENGINEERED THERMAL SYSTEMS IS
PROHIBITED.
INTERPRET GEOMETRIC
TOLERANCING PER:
MATERIAL
FINISH
Q.A.
COMMENTS:
SIZE DWG. NO.
NEXT ASSY
USED ON
A
Laird Engineered Thermal Systems
DO NOT SCALE DRAWING
SCALE: 50:1 WEIGHT:
2
SHEET 1
5
4
3
THR-DS-eTEC-HV14 1113
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use
and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non-infringement of any Laird
Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products
are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies,
Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company
thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
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