MN101D09E
Type
Internal ROM type
ROM (byte)
RAM (byte)
Package (Lead-free)
MN101D09E
Mask ROM
80K
2K
QFP100-P-1818B
[With main clock operated]
0.1397
µs (at
4.0
V to
5.5
V,
14.32
MHz)
71.5
µs (at
2.7
V to
5.5
V,
14.32
MHz internal
frequency di Vision)
[When sub-clock operated]
61
µs (at
2.5
V to
5.5
V,
32.768
kHz)
0.1397
µs (at
4.0
V to
5.5
V,
14.32
MHz)
71.5
µs (at
2.7
V to
5.5
V,
14.32
MHz internal
frequency di Vision)
61
µs (at
2.5
V to
5.5
V,
32.768
kHz)
MN101DF09G
FLASH
128K
4K
Minimum Instruction
Execution Time
Interrupts
RESET, Runaway, External
0
to
4,
Timer
0
to
3,
Timer
6,
Capstan FG, Control, HSW, Cylinder(Drum) FG, Servo V-sync,
Synchronous output, OSD, XDS, Serial
1,
Serial
2,
PWM
4,
OSD V-sync
Timer counter
0
:
8-bit
×
1
(timer function)
Clock source................
1/4, 1/16
of system clock frequency
Interrupt source ........... overflow of timer counter
0
Timer counter
1
:
8-bit
×
1
(timer function, linear timer counter function)
Clock source................
1/4
of system clock frequency; CTL signal
Interrupt source ........... overflow of timer counter
1
Timer counter
2
:
16-bit
×
1
(timer function, input capture (CTL specified edge), duty judgment of CTL signal)
Clock source................
1/4, 1/16, 1/24
of system clock frequency
Interrupt source ........... overflow of timer counter
2;
input of CTL specified edge; underflow of timer
2
shift register
4-bit
counter;
coincidence of timer
2
shift register with timer
2
shift register compare register
Timer counter
3
:
16-bit
×
1
(timer function)
Clock source................
1/4, 1/16
of system clock frequency
Interrupt source ........... overflow of timer counter
3
Timer counter
5
:
19-bit
×
1
(watchdog, stable oscillation waiting function)
Clock source................ system clock
Watchdog interrupt source ...
1/2
16
,
1/2
19
of timer counter
5
frequency
Clear by stable oscillation ... after
256
counts by timer counter
5
(2
18
counts of OSC oscillation clock)
Timer counter
6
:
16-bit
×
1
(clock function [max.
2
s])
Clock source................
1/512
of OSC oscillation clock frequency; XI oscillation clock;
1/8, 1/128
of system clock frequency
Interrupt source ...........
1/2
13
,
1/2
1
4
,
1/2
15
overflow of timer counter
6
Timer Counter
Serial interface
Serial
1
:
8-bit
×
1
(synchronous type)
(transfer direction of MSB/LSB selectable, start condition function)
Clock source................
1/8, 1/16, 1/32, 1/64, 1/128, 1/256
of system clock frequency; NSBT1 pin input
Serial
2
:
8-bit
×
1
(I²C)
(master transmission/reception, slave transmission/reception)
Clock source................
1/144
to
1/252
of system clock; SCK pin input
MAD00033EEM
MN101D09E
OSD
Display mode ........................... Menu(Internal synchronized ) display, super impose(external synchronized) display
Applicable broadcasting system.... NTSC, PAL, PAL-M, PAL-N
Screen configuration ................
24
characters
×
2n
rows (n =
1
to
6)
Character type .......................... max.
128
character types (variable, include special characters)
Character size ...........................
12
×
18
dots (Vertical direction :
1
dot for
2H
at not enlargement)
Enlarged characters .................. each
×
2
settings in horizontal and vertical
Character interpolation............. none
Line background color .............
8-hue
settable in the row unit at menu display
Line background intensity........
8
gradations settable in the row unit
Screen background color..........
8-hue
settable at omenu display
Character color ......................... white
Character intensity ...................
8
gradations settable in the row unit
Frame function .........................
1-dot
frame in
4
directions
Frame intensity.........................
4
gradations settable in the row unit
Blinking.................................... none (covered by software)
Inverted character..................... settable in the character unit
Halftone.................................... none
Input ......................................... composite video signal input (output level :
1
V[p-p] /
2
V[p-p])
Clamp method .......................... sync tip clamp, clamp level in
4
levels
Output ...................................... composite video output
Measure against image fluctuation...... built-in AFC circuit
Dot clock ..................................
1/2
of OSC oscillation clock (automatic phase adjustment)
XDS
Built-in U.S. closed caption data slicer (optional
1
line data can be extracted.)
I/O Pins
I/O
Input
56
1
Common use :
45
Common use :
1
A/D converter
PWM
8-bit
×
11-ch.
(without S/H)
13-bit
×
2-ch.
(at repetition cycle
572
ms at
14.32
MHz),
8-bit
×
1-ch.
(at repetition cycle
71.5
ms,
0.572
ms,
1.14
ms,
2.29
ms at
14.32
MHz)
16-bit
×
2-ch.(Speed
system),
18-bit
×
4-ch.(Phase
system)
16-bit
×
3
(Synchronous output
×
2,
Rec CTL
×
1
)
3-state
output (PTO) VLP pin; CTL input; Capstan FG input; Cylinder(Drum) PG/FG inputs; HSW output; Head amp/ Rotary control
outputs; output of
1/4
OSC oscillation clock (1 V[p-p])
Correcting address designation : up to
3
addresses possible
Correction method : correction program being saved in internal RAM
ICR
OCR
Special Ports
ROM Correction
MAD00033EEM
Electrical Charactreistics (Supply current)
Parameter
Symbol
IDD1
Operating supply current
Supply current at STOP
Supply current at HALT
IDD2
IDD3
IDSP
IDHT0
IDHT1
Condition
14.32
MHz operation without load, VDD =
5
V
1/1024
of
14.32
MHz operation without load, VDD =
2.7
V
Stop of
14.32
MHz oscillation, VDD =
2.7
V
32
kHz oscillation operation without load
Stop of oscillation without load, VDD =
5
V
14.32
MHz oscillation without load, VDD =
5
V
Stop of
14.32
MHz oscillation, VDD =
2.7
V
32
kHz oscillation operation without load
Limit
min
typ
50
2
50
5
5
max
100
5
100
10
15
20
Unit
mA
mA
µA
µA
mA
µA
(Ta =
25
°
C
±
2
°
C , VSS =
0
V)
Electrical Charactreistics (A/D converter characteristics)
Parameter
Conversion relative error
A/D Conversion Time
Analog Input Voltage
Symbol
∆
NLAD
tAD
fosc =
14.32
MHz
8
5
Condition
Limit
min
typ
max
±
3
Unit
LSB
µs
V
(Ta =
25
°
C
±
2
°
C , VDD =
5.0
V , VSS =
0
V)
Development tools
In-circuit Emulator
PX-ICE101C/D + PX-PRB101D08-QFP100-P-1818B-M
MAD00033EEM
MN101D09E
Pin Assignment
RCTLN
RCTLP
AVDD
CTLA
AVSS
VRI
VRO
AFG
FGF
YPG(↔PB7)
YFG(PFG)
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
FSCLPF(↔PB0)
FSCI(↔PB1)
AFCLPF(↔PB2)
AFCC(↔PB3)
VDD2
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
MAD00033EEM
IRQ0(P64→)
IRQ1(P63↔)
IRQ2(P62↔)
IRQ3(P61↔)
IRQ4(P60↔)
N.C.
N.C.
N.C.
N.C.
N.C.
NSBT1(P07↔)
NSBI1(P06↔)
NSBO1(P05↔)
P02
P01
P00
SDA(P27↔)
SCK(P26↔)
HBUFD6(P46↔)
HBUFD4(P44↔)
HBUFD2(P42↔)
HBUFD0(P40↔)
HSW
VLP
NRST(P04←)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
CO
N.C.
N.C.
AD10(↔PC2)
AD9(↔PC1)
AD8(↔PC0)
AD7(↔P87)
AD6(↔P86)
AD5(↔P85)
AD4(↔P84)
AD3(↔P83)
AD2(↔P82)
AD1(↔P81)
AD0(↔P80)
P77
P76
P75
P74
P73
P72
P71
P70
ROTA(↔P67)
HAMP(↔P66)
DENV(↔P65)
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
MN101D09E
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
CVIN2(PB4↔)
CVIN(PB5↔)
VSS2
CVOUT(PB6↔)
N.C.
N.C.
N.C.
N.C.
SXI
XO(P23↔)
XI(P24↔)
VSS
OSCI
OSCO
VDD
PWM4(P25↔)
PWM0
PWM1
SBUFD1(P11↔)
SBUFD2(P12↔)
SBUFD3(P13↔)
SBUFD4(TC60, P14↔)
SBUFD5(P15↔)
SBUFD6(P16↔)
SBUFD7(OSCDIV, P17↔)
QFP100-P-1818B
Request for your special attention and preca
semiconductors de
(1)
If any of the products or technical information described in thi
regulations of the exporting country, especially, those with regar
(2) The technical information described in this book is intended onl
of the products, and no license is granted under any intellectua
company. Therefore, no responsibility is assumed by our comp
company which may arise as a result of the use of technical info
(3) The products described in this book are intended to be used for s
equipment, communications equipment, measuring instruments
Consult our sales staff in advance for information on the followi
–
Special applications (such as for airplanes, aerospace, automo
systems and safety devices) in which exceptional quality and
ucts may directly jeopardize life or harm the human body.
–
Any applications other than the standard applications intended.
(4) The products and product specifications described in this book
provement. At the final stage of your design, purchasing, or u
Standards in advance to make sure that the latest specifications s
(5) When designing your equipment, comply with the range of a
(operating power supply voltage and operating environment etc
maximum rating on the transient state, such as power-on, powe
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values
mode, possible to occur to semiconductor products. Measures o
or preventing glitch are recommended in order to prevent physic
(6) Comply with the instructions for use in order to prevent breakd
thermal stress and mechanical stress) at the time of handling, m
damp-proof packing is required, satisfy the conditions, such as s
(7) This book may be not reprinted or reproduced whether wholl
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